Ceramic capacitor mounting structure

Abstract

A ceramic capacitor mounting structure comprising a flat capacitor element, and two electrodes connected respectively between opposite surfaces of said capacitor element, and having extensions which extend outwards from the periphery of the capacitor element, being structured in such a manner that by virtue of the electrode extensions it is capable of being connected to and released from connectors which are connected to bus bars or similar elements.

What is claimed is:  
     
         1 . A ceramic capacitor mounting structure, comprising: 
 a flat capacitor element;    first and second electrodes connected to an opposite surface of said capacitor element respectively, and having extension member which extend outward from the periphery of said capacitor element respectively; and    first and second connectors attachable to said extension member of said first and second electrodes respectively.    
     
     
         2 . A ceramic capacitor mounting structure, comprising: 
 a ceramic capacitor comprising: 
 a flat capacitor element;  
 a first and second electrodes connected respectively to opposite surfaces of said capacitor element; wherein said ceramic capacitor is located between direct-current terminals of an inveter designed to permit a two-level alternating-current output; and  
 said direct-current terminals and said first and second electrodes being connected electrically and mechanically.  
   
     
     
         3 . A ceramic capacitor mounting structure, comprising: 
 a ceramic capacitor comprising: 
 a flat capacitor element;  
 a first and second electrodes connected respectively to opposite surfaces of said capacitor element; wherein two ceramic capacitors are respectively located between a neutral terminal and direct-current terminals of an inverter to permit a three-level alternating-current output; and  
 said neutral terminal and said first and second electrodes being each connected electrically and mechanically.  
   
     
     
         4 . A ceramic capacitor mounting structure, comprising: 
 a flat capacitor element;    a single electrode connected electrically to a surface of said capacitor element;    an electrode body connected electrically to the other surface of said capacitor element; and    a coolant passage structuring member fashioned integrally with said electrode body and carrying a coolant to facilitate the cooling of said electrode body.    
     
     
         5 . A ceramic capacitor mounting structure, comprising: 
 a flat capacitor element;    a single electrode connected electrically to a surface of said capacitor element;    an electrode body connected electrically to the other surface of said capacitor element; and    a cooling fin fashioned integrally with said electrode body and serving to increase the radiation effect.    
     
     
         6 . A ceramic capacitor mounting structure, comprising: 
 a plurality of ceramic capacitors comprising a flat capacitor element and two electrodes each connected electrically to opposite surfaces of said capacitor element,    wherein said ceramic capacitors are located between two flexible bus bars, and said electrodes are connected electrically and mechanically to said flexible bus bars respectively.    
     
     
         7 . A ceramic capacitor mounting structure, comprising: 
 a single ceramic capacitor which comprises a flat capacitor element and a electrode connected electrically to one surface of said capacitor element;    a single semiconductor power element which comprises a semiconductor power element chip mounted on and connected electrically to a substrate with a pattern wiring;    wherein said ceramic capacitor and said semiconductor power element are connected electrically in parallel, and    a wiring for use in external connection being located between the other surface of said capacitor element and the other surface of said chip, said capacitor element and said chip being connected electrically and mechanically.    
     
     
         8 . A ceramic capacitor mounting structure, comprising: 
 a semiconductor power element;    a snubber circuit comprising a serially connected diode and a ceramic capacitor;    said snubber circuit being electrically connected to said semiconductor power element in parallel;    said ceramic capacitor comprising a flat capacitor element and a electrode connected electrically to one surface of said capacitor element;    said diode comprising a substrate with a wiring pattern and diode chip mounted on and electrically connected to said substrate; and    the surface of said capacitor element to which no electrode is connected, and said wiring pattern on the surface of said substrate on which no diode being mounted are connected electrically.    
     
     
         9 . A ceramic capacitor mounting structure, comprising: 
 a semiconductor power element which comprises a semiconductor power element chip which mounted on a substrate with a wiring pattern, has electrically connected thereto for use in external connection an emitter and a collector terminal;    a ceramic capacitor which comprises a flat capacitor element;    a diode comprising a substrate with a wiring pattern and diode chip mounted on and electrically connected to said substrate;    wherein said semiconductor power element, said ceramic capacitor and said diode are serially connected; and    one surface of said capacitor element is connected electrically to a surface of an emitter terminal of said semiconductor power element, and the other surface of said capacitor element and said wiring pattern of said substrate on which said diode chip is mounted are connected electrically.    
     
     
         10 . A ceramic capacitor mounting structure, comprising: 
 a semiconductor power element;    a plurality of ceramic capacitors; and    first and second substrates with wiring patterns; wherein 
 said semiconductor power element is located between said first and second substrates, and has a chip housed within a circular package, and emitter, collector and gate terminals which are connected electrically to said chip and led outside the package, while also being connected electrically to the wiring patterns on said first and second substrates; and  
 said ceramic capacitor being located between said first and second substrates on the periphery of the circular package of the semiconductor power element, a circular capacitor element being divided radially, while said divided capacitor elements are connected electrically to said wiring patterns on said first and second substrates.  
   
     
     
         11 . A ceramic capacitor mounting structure, comprising: 
 a semiconductor power element;    a snubber circuit comprising a serially connected diode and a ceramic capacitor;    said snubber circuit being electrically connected to said semiconductor power element in parallel;    said ceramic capacitor comprising a flat capacitor element and a electrode connected electrically to one surface of said capacitor element;    said diode having a diode chip, in addition to a cathode terminal and an anode terminal which are electrically connected to said diode chip and further act as cooling fins; and    either said cathode terminal or said anode terminal of said diode is connected electrically and mechanically to an opposite surface of said capacitor element from said electrode to constitute a moulded layer wherein the periphery of said diode chips is embedded in such a manner that said cathode and anode terminals are exposed.    
     
     
         12 . A ceramic capacitor mounting structure, comprising: 
 a semiconductor power element chip constituting a power converter, or a snubber diode chip, or both these; and    a ceramic capacitor, wherein: 
 said ceramic capacitor comprises a flat capacitor element, first and second electrodes connected electrically and mechanically to opposite surfaces of said capacitor element, and first and second plugs respectively connected electrically and mechanically to said electrodes; and  
 said semiconductor power element or snubber diode is equipped with a package, a chip housed within said package, and terminals comprising an emitter, collector and gate, or a cathode and an anode, while receptacles provided within said package and connected electrically to said terminals are capable of being connected to and released from said plugs in said ceramic capacitor.  
   
     
     
         13 . A ceramic capacitor mounting structure, comprising: 
 an inverter designed to permit to a two-level alternating-current output;    a ceramic capacitor respectively connected to a first and second terminals of said inverter;    said ceramic capacitor comprising a block-shaped capacitor element and L-shaped first and second electrodes each connected electrically to a surface of said capacitor element; and    an insulating body being located between said direct-current terminals, while apertures being formed to penetrate said insulating body and said direct-current terminals, an insulating layer being formed around said aperture in said first direct-current terminal, and a conductive pin being inserted through said aperture formed in said insulating layer, said aperture in said insulating body and in said second direct-current terminal, serving respectively to fix said second electrode of said capacitor electrically to said second direct-current terminal, and to fix said first electrode of said capacitor electrically directly to said first directed-current terminal.    
     
     
         14 . A ceramic capacitor mounting structure, comprising: 
 an inverter designed to permit a three-level alternating-current output; and    ceramic capacitors respectively connected between first and second direct-current terminals and a neutral terminal of said inverter;    said ceramic capacitor comprising block-shaped capacitor element and L-shaped first and second electrodes each connected electrically to one surface of said capacitor elements; and    first and second insulating bodies being located respectively between said first direct-current terminal and said neutral terminal, and between said second direct-current terminal and said neutral terminal, while apertures being formed which penetrate respectively said first and second insulating bodies, said first and second direct-current terminals, and said neutral terminal, insulating layers being formed around the apertures in said first and second direct-current terminals respectively, and conductive pins being inserted respectively through said apertures formed in said insulating layers, said apertures in said first and second insulating bodies, and said aperture in said neutral terminal, serving respectively to fix said second electrodes of said first and second ceramic capacitors electrically to the neutral terminal, and to fix the first electrodes of said first and second ceramic capacitors electrically directly to said direct-current terminals.