Display panel module with improved bonding structure and method of forming the same

Abstract

A display panel module includes a substrate, a circuit board, electrode terminals aligned in a first direction over a surface of the substrate, each of the electrode terminals extending in a second direction perpendicular to the first direction, lead terminals aligned in the first direction over a confronting surface of the circuit board to the substrate, at least an anisotropically conductive film sandwiched between the electrode terminals and the lead terminals, and a plurality of first electrically insulating walls on the substrate in at least selected plural ones of gaps between selected ones of the electrode terminals and on opposite side regions of the module, the opposite side regions being distanced in the first direction and separated by a center region. The first electrically insulating walls have a first height that is higher than a first total height of the electrode terminals and the anisotropically conductive film.

What is claimed is:  
     
         1 . A method of forming a display panel module, comprising the steps of: 
 forming an alignment of electrode terminals in a first direction over a surface of a substrate, each of said electrode terminals extending in a second direction perpendicular to said first direction;    forming electrically insulating walls in at least selected plural ones of gaps between selected ones of said electrode terminals, and said selected ones of said electrode terminals being positioned on opposite side regions of said module, and said opposite side regions being distanced in said first direction and separated by a center region;    forming at least an anisotropically conductive film over said electrode terminals; and    bonding said electrode terminals through said anisotropically conductive film to lead terminals which are aligned in said first direction over a confronting surface of a circuit board to said substrate,    wherein said electrically insulating walls have a first height, which is higher than a first total height of said electrode terminals and said anisotropically conductive film.    
     
     
         2 . The method as claimed in  claim 1 , wherein said first height of said electrically insulating walls is lower than a second total height of said electrode terminals, said lead terminals and said anisotropically conductive film, so that a top surface of said electrically insulating wall is not in contact with said confronting surface of said circuit board.  
     
     
         3 . The method as claimed in  claim 1 , wherein said electrically insulating walls are provided in all gaps between said electrode terminals on said opposite side regions.  
     
     
         4 . The method as claimed in  claim 1 , wherein said electrically insulating walls are provided in all gaps between all said electrode terminals over entire regions of said module.