Laminated chip component and manufacturing method

Abstract

A laminated chip component including: alternately laminated conductive patterns ( 13,43,63 ) and insulating sheets ( 11,41,61 ); through-holes ( 12,42,62 ) which are provided in the insulating sheets and connect top layer conductive patterns to bottom layer conductive patterns; auxiliary conductive patterns ( 15,45,65 ) which are provided on the top faces of the conductive patterns at positions facing the through-holes provided in adjacent insulating sheets; and conductors ( 14,64 ) which are provided in the through-holes. The auxiliary conductive patterns can be substituted by conductor sections ( 16,66 ) which are provided in the insulating sheets at the positions facing the through-holes provided in adjacent insulating sheets. And, a method for manufacturing a laminated chip component is also disclosed.

What is claimed is:  
     
         1 . A laminated chip component comprising: alternately laminated conductive patterns and insulating sheets; through-holes which are provided in said insulating sheets; auxiliary conductive patterns which are provided on the top faces of positions which facing said through-holes provided in adjacent insulating sheets of said conductive patterns; and conductors which are provided in said through-holes, and connect upper layer conductive patterns to said auxiliary conductive pattern on lower layer conductive patterns.  
     
     
         2 . A laminated chip component comprising: alternately laminated conductive patterns and insulating sheets; through-holes which are provided in said insulating sheets; conductor sections which are provided in said insulating sheets at positions facing said through-holes provided in adjacent insulating sheets; and conductors which are provided in said conductor sections and said through-holes, and connect upper layer conductive patterns to lower layer conductive patterns.  
     
     
         3 . The laminated chip component as described in  claim 2 , wherein said conductor section is a cavity.  
     
     
         4 . The laminated chip component as described in  claim 2 , wherein said conductor section is a through-hole.  
     
     
         5 . The laminated chip component as described in  claim 2 , further comprising an auxiliary conductive pattern which is provided on a top face of said bottom layer conductive pattern at the connection with said top layer conductive pattern.  
     
     
         6 . A laminated chip component comprising: alternately laminated conductive patterns and insulating sheets; through-holes which are provided in said insulating sheets; said conductive pattern comprising a first conductive pattern and a second conductive pattern of different materials; an auxiliary conductive pattern of the same material as said second conductive pattern, provided on the top face of a connection section which connects to said second conductive pattern of said first conductive pattern; and a conductor of the same material as said second conductive pattern provided in a through-hole which runs between said first conductive pattern and said second conductive pattern.  
     
     
         7 . A laminated chip component comprising: alternately laminated conductive patterns and insulating sheets; through-holes which are provided in said insulating sheets; said conductive patterns comprising a first conductive pattern and a second conductive pattern of different materials; the insulating sheet on which said first conductive pattern is provided comprising a conductor section for providing a conductor of the same material as said second conductive pattern, the conductor section being provided at the position which corresponding to the connection between said first and second conductive patterns in said insulating sheet; and conductors comprising the same material as said second conductive pattern, the conductors being provided in a through-hole which runs between said first conductive pattern and said second conductive pattern and in said conductor section.  
     
     
         8 . The laminated chip component as described in  claim 7 , wherein said conductor section is a cavity.  
     
     
         9 . The laminated chip component as described in  claim 7 , wherein said conductor section is a through-hole.  
     
     
         10 . The laminated chip component as described in  claim 7 , further comprising an auxiliary conductive pattern which is provided on the top face of said bottom layer conductive pattern at the connection with said top layer conductive pattern.  
     
     
         11 . A method for manufacturing a laminated chip component comprising alternately laminated conductive patterns and insulating sheets, through-holes which are provided in said insulating sheets, the method comprising the steps of: printing conductive patterns on said insulating sheets; printing auxiliary conductive patterns on the top faces of said conductive patterns at the positions facing said through-holes of adjacent insulating sheets; and connecting upper layer conductive pattern to said auxiliary conductive pattern on lower layer conductive pattern by means of conductors which are provided in the through-holes in said insulating sheets.  
     
     
         12 . A method for manufacturing a laminated chip component comprising alternately laminated conductive patterns and insulating sheets, through-holes which are provided in said insulating sheets, the method comprising the steps of: providing conductor sections in the insulating sheets at positions facing the through-hole in adjacent insulating sheets; printing conductive patterns on said insulating sheets and providing conductors in said conductor sections; and connecting said upper layer conductive pattern to said auxiliary conductive pattern on said lower layer conductive pattern by means of conductors which are provided in the through-holes of said insulating sheets.  
     
     
         13 . A method for manufacturing a laminated chip component comprising alternately laminated conductive patterns and insulating sheets, through-holes which are provided in said insulating sheets, the method comprising the steps of: providing conductor sections in the insulating sheets at the positions facing the through-hole in adjacent insulating sheets; printing conductive patterns on said insulating sheets and providing conductors in said conductor sections; printing auxiliary conductive patterns on top faces of said conductive patterns at the positions facing said through-holes of adjacent insulating sheets; and connecting upper layer conductive pattern to said auxiliary conductive pattern on lower layer conductive pattern by means of conductors which are provided in the through-holes of said insulating sheets.  
     
     
         14 . A method for manufacturing a laminated chip component comprising alternately laminated conductive patterns and insulating sheets, through-holes which are provided in said insulating sheets, the method comprising the steps of: printing a first conductive pattern on an insulating sheet; printing an auxiliary conductive pattern comprising the same material as the second conductive pattern on the top face of the connection section which connects to said second conductive pattern of said first conductive pattern; and connecting the auxiliary conductive pattern on the first conductive pattern to the second conductive pattern by means of a conductor comprising the same material as the second conductive pattern, the conductor being provided in a through-hole in the laminated insulating sheets.  
     
     
         15 . A method for manufacturing a laminated chip component comprising alternately laminated conductive patterns and insulating sheets, through-holes which are provided in said insulating sheets, the method comprising the steps of: providing conductor sections for providing conductors comprising the same material as the second conductive pattern at the position corresponding to the connection between the first conductive pattern and the second conductive pattern in said insulating sheets; printing a first conductive pattern on said insulating sheets, and providing conductors comprising the same material as said second conductive pattern in said conductor sections; and connecting first conductive pattern to the second conductive pattern by means of conductors comprising the same material as the second conductive pattern, the conductors being provided in through-holes in the laminated insulating sheets.  
     
     
         16 . A method for manufacturing a laminated chip component comprising alternately laminated conductive patterns and insulating sheets, through-holes which are provided in said insulating sheets, the method comprising the steps of: providing conductor sections for providing conductors comprising the same material as the second conductive pattern at the position corresponding to the connections between a first conductive pattern and a second conductive pattern in said insulating sheets; printing a first conductive pattern on said insulating sheets; providing conductors comprising the same material as said second conductive pattern in said conductor sections, and printing an auxiliary conductive pattern comprising the same material as said second conductive pattern on the top face of said first conductive pattern at the connection with said second conductive pattern; and connecting first conductive pattern to the second conductive pattern by means of conductors comprising the same material as the second conductive pattern, the conductors being provided in through-holes in the laminated insulating sheets.