Substrate coated with an MgO-layer

Abstract

A coating apparatus has two Mg-targets mutually defining a slit and with a target Mg material purity of at least 99%. An anode arrangement and a gas inlet arrangement are adjacent a first end area of the slit, the gas inlet arrangement being connected to a gas tank arrangement with a working gas. The apparatus has a substrate carrier and conveying arrangement with which a planar substrate is movable across and distant from a second slit end area opposite the first end area and a further gas inlet arrangement is situated between the second slit end area and the substrate carrier and conveying arrangement and is connected to a gas tank arrangement containing oxygen.

What is claimed is:  
     
         1 . A coating apparatus, comprising: 
 two Mg-targets mutually defining a slit and with a target Mg material purity of at least 99%;    adjacent a first end area of said slit, an anode arrangement and a gas inlet arrangement, said gas inlet arrangement being connected to a gas tank arrangement with a working gas;    a substrate carrier and conveying arrangement with which a planar substrate is movable across and distant from a second slit end area opposite to said first end area; and    a further gas inlet arrangement situated between said second slit end area and said substrate carrier and conveying arrangement and being connected to a gas tank arrangement containing oxygen.    
     
     
         2 . The apparatus of  claim 1 , further comprising a heating and/or cooling arrangement for a substrate on said substrate carrier and conveying arrangement.  
     
     
         3 . The apparatus of  claim 2 , wherein said heating and/or cooling arrangement is open loop controlled or negative feedback controlled.  
     
     
         4 . A substrate coated with at least one MgO-layer and with an extent of at least 100 mm×100 mm, wherein said layer has a predominant peak in the measuring diagram of the Θ-2Θ-method.  
     
     
         5 . The substrate of  claim 4 , wherein said layer has a peak at (200) and/or at (220) and/or at (111).  
     
     
         6 . The substrate of  claim 5 , wherein said peak is at (111) and is the predominant peak.  
     
     
         7 . The substrate of  claim 6 , wherein said peak is the only peak.  
     
     
         8 . The substrate of  claim 4 , wherein said layer has an index of refraction n for a spectral range of light of at least 350 nm to 820 nm which is 1.6≦n≦1.8.  
     
     
         9 . The substrate of  claim 8 , wherein there is valid for n: 1.65≦n<1.75.  
     
     
         10 . The substrate of  claim 9 , wherein there is valid for n: 1.65≦n≦1.7.  
     
     
         11 . The substrate of  claim 8 , wherein said range is at least 400 nm to 800 nm.  
     
     
         12 . The substrate of  claim 4 , wherein said layer has a surface roughness which is homogenously distributed along said substrate and which is in the range of 0.2 nm RMS to 0.5 nm RMS, measured by means of AFM.  
     
     
         13 . The substrate of  claim 4 , wherein the density of the material of said layer is at least 85% of the density of stoichiometric MgO-bulk material, which latter is ρ=3.58 g/cm3.  
     
     
         14 . The substrate of  claim 13 , wherein said density is at least 90% of said density of MgO-bulk material.  
     
     
         15 . The substrate of  claim 4 , wherein the material of said layer comprises stoichiometric MgO.  
     
     
         16 . The substrate of  claim 15 , wherein the material of said layer consists of stoichiometric MgO.  
     
     
         17 . The substrate of  claim 4 , being a Plasma Display Panel substrate and comprising e.g. a substrate of glass.  
     
     
         18 . The substrate of  claim 4 , wherein the layer is deposited by reactive sputtering.  
     
     
         19 . The substrate of  claim 18  being produced by reactive sputtering material off of two targets mutually defining a slit and by blowing sputtered-off material through said slit and towards the substrate to be coated and reacting said sputtered-off material blown towards said substrate adjacent to said substrate with oxygen.