Apparatus and method for electropolishing a substrate in an electroplating cell

Abstract

An electrolyte cell receives a substrate for processing, a first electrode disposed in the electrolyte cell, the first electrode comprising at least a contact ring, a second electrode disposed within the electrolyte cell and spaced from the first electrode, and a porous membrane that is connected to the electrolyte cell and extends across at least a portion of the electrolyte cell, the membrane is positioned between a location for positioning a substrate when processing and surrounding electrolyte.

1 . An apparatus for electrochemically processing a substrate, comprising: 
 an electrolyte cell configured to receive a substrate for processing;    a substrate support in the electrolyte cell, the substrate support comprising at least a substrate seating surface;    a fixed electrode disposed within the electrolyte cell and spaced from the substrate support; and    a porous membrane that is connected to the electrolyte cell and extends across at least a portion of the electrolyte cell, wherein the membrane is positioned between the substrate seating surface and a substrate.    
     
     
         2 . The apparatus of  claim 1 , wherein the substrate support comprises at least a portion of the first electrode and the fixed electrode disposed within the electrolyte cell comprises a second electrode.  
     
     
         3 . The apparatus of  claim 1 , wherein the porous membrane comprises a material selected from the group of a ceramic material, a polymeric material, a polishing material, or combinations thereof.  
     
     
         4 . The apparatus of  claim 1 , wherein the porous membrane comprises a conductive polishing media and comprises at least a portion of the first electrode.  
     
     
         5 . The apparatus of  claim 1 , wherein the porous membrane has pore sizes between about 0.25 μm and about 2 μm wide.  
     
     
         6 . The apparatus of  claim 1 , wherein the substrate support further comprises a contact ring with the substrate seating surface disposed thereon.  
     
     
         7 . The apparatus of  claim 2 , wherein the porous membrane is disposed between a substrate surface and the second electrode.  
     
     
         8 . The apparatus of  claim 6 , wherein the porous membrane is disposed between a contact ring and a substrate surface.  
     
     
         9 . The apparatus of  claim 1 , wherein the porous membrane is disposed about 2000 Å or less from a substrate surface.  
     
     
         10 . The apparatus of  claim 1 , wherein the porous membrane is positioned in contact with at least a portion of a substrate surface.  
     
     
         11 . The apparatus of  claim 1 , further comprising a power source coupled to the first electrode and the second electrode, wherein the power source may provide a positive or negative bias between the first electrode and the second electrode.  
     
     
         12 . The apparatus of  claim 1 , further comprising an electrolyte supply coupled to the electrolyte cell.  
     
     
         13 . The apparatus of  claim 1 , further comprising a rotatable substrate support, the contact ring coupled to the rotatable substrate support, and adapted to move a substrate within the electrolyte cell.  
     
     
         14 . The apparatus of  claim 1 , further comprising a polishing article disposed in the electrolytic cell.  
     
     
         15 . An apparatus for electrochemically processing a substrate, comprising: 
 an electrolyte cell configured to receive a substrate to have a conductive material film deposited thereon or removed therefrom;    a substrate support;    a contact ring in electrical communication with the substrate support, wherein the contact ring comprises at least a portion of a first electrode;    a second electrode disposed on a bottom portion of a electrolyte cell;    a power source coupled to the contact ring and second electrode;    a source of electrolyte in fluid communication with the electrolyte cell; and    a porous membrane connected to the electrolyte cell and extends across at least a portion of the electrolyte cell, wherein the porous membrane is positioned between the first electrode and the second electrode.    
     
     
         16 . The apparatus of  claim 15 , wherein the porous membrane comprises a material selected from the group of a ceramic material, a polymeric material, a polishing material, or combinations thereof.  
     
     
         17 . The apparatus of  claim 15 , wherein the porous membrane comprises a conductive polishing material.  
     
     
         18 . The apparatus of  claim 15 , wherein the porous membrane has pore sizes between about 0.25 μm and about 2 μm wide.  
     
     
         19 . The apparatus of  claim 15 , further comprising a substrate in electrical communication with the contact ring and comprising at least a portion of the first electrode.  
     
     
         20 . The apparatus of  claim 15 , wherein the porous membrane is disposed between a substrate surface comprising a portion of the first electrode and the second electrode.  
     
     
         21 . The apparatus of  claim 20 , wherein the porous membrane is disposed between a contact ring and a substrate surface.  
     
     
         22 . The apparatus of  claim 15 , wherein the porous membrane is disposed about 2000 Å or less from a substrate surface.  
     
     
         23 . The apparatus of  claim 15 , wherein the porous membrane is positioned in contact with at least a portion of a substrate surface.  
     
     
         24 . The apparatus of  claim 15 , further comprising a power source coupled to the first electrode and the second electrode, wherein the power source may provide a positive or negative bias between the first electrode and the second electrode.  
     
     
         25 . The apparatus of  claim 15 , further comprising an electrolyte supply coupled to the electrolyte cell.  
     
     
         26 . The apparatus of  claim 15 , further comprising a rotatable substrate support, the contact ring coupled to the rotatable substrate support, and adapted to move a substrate within the electrolyte cell.  
     
     
         27 . The apparatus of  claim 15 , further comprising polishing media disposed in the electrolytic cell between the first electrode and the second electrode.  
     
     
         28 . An apparatus for use in an electrolyte cell, the apparatus comprising: 
 a porous membrane that is connected to and extends across a portion of the electrolyte cell, wherein the porous membrane is positioned between a first electrode and a second electrode disposed in the electrolyte cell, and wherein the porous membrane is formed a ceramic material, a polymer, a polishing material, or combinations thereof, having pore sizes between about 0.25 μm and about 2 μm wide.    
     
     
         29 . A method for processing a substrate, comprising: 
 positioning a substrate in the electrolyte cell adjacent a porous membrane;    supplying an electrolyte solution to the electrolyte cell and through the porous membrane to a substrate surface; and    delivering power to the substrate and an electrode disposed in the electrolyte cell to perform an electrochemical process.    
     
     
         30 . The method of  claim 29 , wherein a positive bias is applied to the second electrode and an electroplating process is performed on the substrate.  
     
     
         31 . The method of  claim 29 , wherein a positive bias is applied to the first electrode and an electropolishing process is performed on the substrate.  
     
     
         32 . The method of  claim 29  wherein an alternative bias is applied to the first electrode and the second electrode and alternating electroplating and electropolishing processes are performed on the substrate.  
     
     
         33 . The method of  claim 29 , further comprising chemical polishing the substrate by contacting and rotating the substrate against the porous membrane or polishing media.  
     
     
         34 . A contact ring for use in an apparatus for electroplating a metal onto a substrate having an electrically conductive portion, the contact ring comprising: 
 an annular insulative body defining a central opening;    a plurality of conductive elements disposed through the insulative member; and    a porous membrane assembly disposed on the annular insulative body, wherein the porous membrane assembly comprises a porous material disposed within the central opening.