Power conditioning substrate stiffener

Abstract

Utilization of the “dead space” previously occupied by a metal stiffener in an integrated circuit package as a location for power conditioning and converting mechanisms such as decoupling capacitors and planar transformers.

What is claimed is:  
     
         1 . A combination comprising: 
 an integrated circuit (IC) comprising a power input pad;    a power conditioning frame (PCF);    an interconnect having an IC mounting surface comprising an IC power output pad, a first conditioning pad and a second conditioning pad, the first conditioning pad electrically coupled to the IC power output pad, the second conditioning pad electrically coupled to an interconnect power input pad, the first and second conditioning pads being electrically connected through the power conditioning frame.    
     
     
         2 . The combination of  claim 1  wherein the PCF comprises an electrical component which is part of a power path from the first conditioning pad to the second conditioning pad through the PCF, the power path electrically connecting the first and second conditioning pads.  
     
     
         3 . The combination of  claim 2  wherein the component is an active device.  
     
     
         4 . The combination of  claim 2  wherein the component is one of a capacitor, a resistor, a conductor, or a network of capacitors, resistors, or conductors.  
     
     
         5 . The combination of  claim 2  wherein the component is a planar transformer.  
     
     
         6 . The combination of  claim 1  wherein the PCF comprises an inner hollow and the IC is positioned with the hollow.  
     
     
         7 . A method for assembling an IC package combination comprising: 
 providing a known good IC;    providing a known good interconnect;    providing a known good PCF;    coupling the IC to the interconnect;    coupling the PCF to the interconnect.    
     
     
         8 . A method of assembling a combination: 
 providing an integrated circuit (IC) comprising a power input pad;    providing a power conditioning frame (PCF);    providing an interconnect having an IC mounting surface comprising a first conditioning pad electrically coupled to an IC power output pad, an interconnect power input pad electrically coupled to a second conditioning pad, the first conditioning pad and second conditioning pad being electrically unconnected;    electrically coupling the PCF to the first conditioning pad and the second conditioning pad so as to electrically connect the first conditioning pad to the second conditioning pad through the power conditioning frame;    electrically coupling the IC power input pad to the interconnect power output pad.