US2003196779A1PendingUtilityA1

Heatsink device

35
Assignee: SUNONWEALTH ELECTR MACH IND COPriority: Apr 17, 2002Filed: Apr 17, 2002Published: Oct 23, 2003
Est. expiryApr 17, 2022(expired)· nominal 20-yr term from priority
Inventors:Alex HorngChing-Sheng HongYing Hong
H10W 40/43
35
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A heatsink device includes a base board provided with multiple fins and multiple channels formed between any two adjacent fins. Each of the channels has a first end formed with an air inlet and a second end formed with an air outlet. The base board is provided with a mounting portion. An impeller is combined on the mounting portion of the base board, and a cover plate is combined on a top of the base board. The impeller includes a power member to drive a blast type vane to rotate. The vane is aligned with the channels formed between the multiple fins, to drive an air flow from the air inlet at one side of the base board to the air outlet at the other side of the base board.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A heatsink device, comprising: 
 a base board, provided with multiple fins, and multiple channels formed between any two adjacent fins, each of the channels having a first end formed with an air inlet and a second end formed with an air outlet, the base board being provided with at least one mounting portion;    an impeller, combined on the mounting portion of the base board, the impeller including a power member to drive a blast type vane to rotate, the vane being aligned with the channels formed between the multiple fins, to drive an air flow from the air inlet at one side of the base board to the air outlet at the other side of the base board; and    a cover plate, combined on a top of the base board.    
     
     
         2 . The heatsink device as claimed in  claim 1 , wherein the channels are arranged in a linear manner.  
     
     
         3 . The heatsink device as claimed in  claim 1 , wherein the channels are arranged in an arcuate manner.  
     
     
         4 . The heatsink device as claimed in  claim 1 , wherein the channels are partially arranged in a linear manner and partially arranged in an arcuate manner, so that the air outlet of the channel is located at two sides of the base board.  
     
     
         5 . The heatsink device as claimed in  claim 1 , wherein the mounting portion is located at a position of the air inlet of the base board.  
     
     
         6 . The heatsink device as claimed in  claim 1 , wherein the mounting portion is located between the air inlet and the air outlet of the base board.  
     
     
         7 . The heatsink device as claimed in  claim 1 , wherein the base board is provided with multiple positioning holes for passage of positioning members which may be screwed into screw bores formed in the impeller, thereby fixing the impeller.  
     
     
         8 . The heatsink device as claimed in  claim 1 , wherein the base board is provided with at least one positioning portion, and the cover plate is provided with at least one positioning member which may be combined on the at least one positioning portion.  
     
     
         9 . The heatsink device as claimed in  claim 1 , wherein the vane of the impeller has a length substantially equal to a total width of the multiple fins.  
     
     
         10 . The heatsink device as claimed in  claim 1 , wherein the cover plate is provided with an air inlet aligning with the vane of the impeller.  
     
     
         11 . The heatsink device as claimed in  claim 1 , wherein the base board is provided with a receiving chamber to receive a circuit board.

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