Multiple polymer belt used as a carrier in a linear belt polishing system

Abstract

A support belt to be used with a polishing belt. The support belt includes an interior layer made of a polymer, wherein said interior layer has a first free end and a second free end that abut one another but are not attached to one another so as to form a first seam and an adhesive placed on an exterior surface of the interior layer. An exterior layer made of a polymer and attached to the adhesive, wherein the exterior layer has a first free end and a second free end that abut one another but are not attached to one another so as to form a second seam.

We claim:  
     
         1 . A support belt to be used with a polishing belt, comprising: 
 an interior layer made of a polymer, wherein said interior layer has a first free end and a second free end that abut one another but are not attached to one another so as to form a first seam;    an adhesive placed on an exterior surface of said interior layer; and    an exterior layer made of a polymer and attached to said adhesive, wherein said exterior layer has a first free end and a second free end that abut one another but are not attached to one another so as to form a second seam.    
     
     
         2 . The support belt of  claim 1 , wherein said polymer of said interior layer comprises Mylar.  
     
     
         3 . The support belt of  claim 2 , wherein said polymer of said exterior layer comprises Mylar.  
     
     
         4 . The support belt of  claim 1 , wherein no reinforcing internal layers are present.  
     
     
         5 . The support belt of  claim 1 , wherein said first seam and said second seam are offset with respect to each other.  
     
     
         6 . The support belt of  claim 5 , wherein said first seam and said second seam are displaced with respect to each other by an amount that ranges from approximately 15° to 180°.  
     
     
         7 . The support belt of  claim 6 , wherein said amount is approximately 15°.  
     
     
         8 . The support belt of  claim 6 , wherein said amount is approximately 180°.  
     
     
         9 . The support belt of  claim 1 , wherein said adhesive is placed over the entirety of said exterior surface.  
     
     
         10 . A polishing belt comprising: 
 a support belt comprising: 
 an interior layer made of a polymer, wherein said interior layer has a first free end and a second free end that abut one another but are not attached to one another so as to form a first seam;  
 an adhesive placed on an exterior surface of said interior layer; and  
 an exterior layer made of a polymer and attached to said adhesive, wherein said exterior layer has a first free end and a second free end that abut one another but are not attached to one another so as to form a second seam; and  
   a polishing material is deposited on a surface of said exterior layer that faces away from said adhesive.    
     
     
         11 . The polishing belt of  claim 10 , wherein said polymer of said interior layer comprises Mylar.  
     
     
         12 . The polishing belt of  claim 11 , wherein said polymer of said exterior layer comprises Mylar.  
     
     
         13 . The polishing belt of  claim 10 , wherein no reinforcing internal layers are present.  
     
     
         14 . The polishing belt of  claim 10 , wherein said first seam and said second seam are offset with respect to each other.  
     
     
         15 . The polishing belt of  claim 14 , wherein said first seam and said second seam are displaced with respect to each other by an amount that ranges from approximately 15° to 180°.  
     
     
         16 . The polishing belt of  claim 15 , wherein said amount is approximately 15°.  
     
     
         17 . The polishing belt of  claim 15 , wherein said amount is approximately 180°.  
     
     
         18 . The polishing belt of  claim 10 , wherein said adhesive is placed over the entirety of said exterior surface.  
     
     
         19 . The polishing belt of  claim 10 , further comprising a sub-pad attached to said surface of said exterior layer that faces away from said adhesive.  
     
     
         20 . A polishing system comprising: 
 a material to be polished;    a polishing belt that moves relative to said material and polishes said material as said polishing belt moves, wherein said polishing belt comprises: 
 a support belt comprising: 
 an interior layer made of a polymer, wherein said interior layer has a first free end and a second free end that abut one another but are not attached to one another so as to form a first seam;  
 an adhesive placed on an exterior surface of said interior layer; and  
 an exterior layer made of a polymer and attached to said adhesive, wherein said exterior layer has a first free end and a second free end that abut one another but are not attached to one another so as to form a second seam; and  
 
 a polishing material is deposited on a surface of said exterior layer that faces away from said adhesive.  
   
     
     
         21 . The polishing system of  claim 20 , wherein said first seam and said second seam are offset with respect to each other.  
     
     
         22 . The polishing system of  claim 20 , wherein said adhesive is placed over the entirety of said exterior surface.  
     
     
         23 . The polishing system of  claim 20 , further comprising a plurality of belt rollers upon which said polishing belt revolves.  
     
     
         24 . The polishing system of  claim 20 , wherein said material comprises a semiconductor wafer.  
     
     
         25 . The polishing system of  claim 20 , further comprising: 
 a support that places said material adjacent to said polishing belt; and    a base positioned on an opposite side of said polishing belt as said material, wherein said base prevents a surface of said polishing belt adjacent said material from being deformed by a force generated by said support.    
     
     
         26 . The polishing system of  claim 24 , further comprising: 
 a support that places said semiconductor wafer adjacent to said polishing belt; and    a base positioned on an opposite side of said polishing belt as said semiconductor wafer, wherein said base prevents a surface of said polishing belt adjacent said semiconductor wafer from being deformed by a force generated by said support.