US2003193793A1PendingUtilityA1

Board-to-board electrical coupling with conductive band

37
Priority: Sep 30, 1999Filed: Apr 30, 2003Published: Oct 16, 2003
Est. expirySep 30, 2019(expired)· nominal 20-yr term from priority
Inventors:David Dent
H05K 1/142H01R 12/52H05K 3/366H05K 2201/1028H05K 1/148H05K 3/321H05K 3/3405H05K 2203/049H05K 2201/10484H05K 3/3442
37
PatentIndex Score
0
Cited by
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References
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Claims

Abstract

A first printed circuit board has a contact area, and a second printed circuit board has a contact area. An electrically conductive band is to couple the contact area of the first printed circuit board to the contact area of the second printed circuit board. The conductive band may be selected from the group consisting essentially of a band formed from solder, a band coupled by a weld, a band coupled by a wire bond, a band comprising conductive film, and a band comprising conductive rope. The conductive band may couple the first printed circuit board and the second printed circuit board in a substantially coplanar position.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . An apparatus comprising: 
 a first printed circuit board having a contact area;    a second printed circuit board having a contact area; and    an electrically conductive band to couple the contact area of the first printed circuit board to the contact area of the second printed circuit board, wherein the conductive band couples the first printed circuit board and the second printed circuit board in a substantially coplanar position.    
     
     
         2 . The apparatus of  claim 1 , wherein the conductive band is to couple contact areas on one side of the first and second printed circuit boards, the apparatus comprising another conductive band to couple contact areas on another side of the first and second printed circuit boards.  
     
     
         3 . The apparatus of  claim 2 , wherein the first and second printed circuit boards each comprise a different number of layers.  
     
     
         4 . The apparatus of  claim 1 , comprising a plurality of conductive bands to couple contact areas of the first and second printed circuit boards.  
     
     
         5 . The apparatus of  claim 1 , wherein the first printed circuit board is a mother printed circuit board and the second printed circuit board is a daughter printed circuit board selected from the group consisting essentially of a processor board, a memory board, and a communications board.  
     
     
         6 . A method comprising: 
 positioning a first printed circuit board and a second printed circuit board in a substantially coplanar position; and    coupling a contact area of the first printed circuit board to a contact area of the second printed circuit board with a conductive band.    
     
     
         7 . The method of  claim 6 , wherein the coupling comprises coupling contact areas on one side of the first and second printed circuit boards, the method comprising coupling contact areas on another side of the first and second printed circuit boards with another conductive band.  
     
     
         8 . The method of  claim 6 , comprising coupling contact areas of the first and second printed circuit boards with a plurality of conductive bands.  
     
     
         9 . The method of  claim 6 , wherein the first printed circuit board is a mother board and the second printed circuit board is selected from the group consisting essentially of a processor board, a memory board, and a communications board.  
     
     
         10 . An apparatus comprising: 
 a first printed circuit board having a contact area;    a second printed circuit board having a contact area; and    an electrically conductive band to couple the contact area of the first printed circuit board to the contact area of the second printed circuit board, wherein the conductive band is selected from the group consisting essentially of a band coupled by a cold formed weld and a band coupled by a pin point spot weld.    
     
     
         11 . The apparatus of  claim 10 , wherein the conductive band couples the first printed circuit board and the second printed circuit board in a substantially coplanar position.  
     
     
         12 . The apparatus of  claim 10 , wherein the conductive band couples the first printed circuit board and the second printed circuit board in a non-coplanar position.  
     
     
         13 . The apparatus of  claim 10 , wherein at least a portion of the first printed circuit board is positioned over at least a portion of the second printed circuit board.  
     
     
         14 . The apparatus of  claim 10 , comprising a plurality of conductive bands to couple contact areas of the first and second printed circuit boards.  
     
     
         15 . The apparatus of  claim 10 , wherein the first printed circuit board is a mother printed circuit board and the second printed circuit board is a daughter printed circuit board selected from a group consisting of a processor board, a memory board, and a communications board.  
     
     
         16 . The apparatus of  claim 10 , wherein the first printed circuit board defines an opening and the second printed circuit board resides in the opening.  
     
     
         17 . The apparatus of  claim 10 , wherein the conductive band is to couple contact areas on one side of the first and second printed circuit boards, the apparatus comprising another conductive band to couple contact areas on another side of the first and second printed circuit boards.  
     
     
         18 . The apparatus of  claim 17 , wherein the first and second printed circuit boards each comprise a different number of layers.  
     
     
         19 . A method comprising: 
 positioning a first printed circuit board relative to a second printed circuit board; and    coupling a contact area of the first printed circuit board to a contact area of the second printed circuit board with a conductive band selected from the group consisting essentially of a band coupled by a cold formed weld and a band coupled by a pin point spot weld.    
     
     
         20 . The method of  claim 19 , wherein the positioning comprises positioning the first printed circuit board and the second printed circuit board in a substantially coplanar position.  
     
     
         21 . The method of  claim 19 , wherein the positioning comprises positioning the first printed circuit board and the second printed circuit board in a non-coplanar position.  
     
     
         22 . The method of  claim 19 , wherein the positioning comprises positioning at least a portion of the first printed circuit board over at least a portion of the second printed circuit board.  
     
     
         23 . The method of  claim 19 , wherein the coupling comprises coupling contact areas on one side of the first and second printed circuit boards, the method comprising coupling contact areas on another side of the first and second printed circuit boards with another conductive band.  
     
     
         24 . The method of  claim 19 , comprising coupling contact areas of the first and second printed circuit boards with a plurality of conductive bands.  
     
     
         25 . The method of  claim 19 , wherein the first printed circuit board is a mother board and the second printed circuit board is selected from the group consisting essentially of a processor board, a memory board, and a communications board.

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