US2003192669A1PendingUtilityA1

Micro-loop heat pipe

Assignee: MEMFUEL INTERNAT CORPPriority: Apr 10, 2002Filed: Apr 10, 2002Published: Oct 16, 2003
Est. expiryApr 10, 2022(expired)· nominal 20-yr term from priority
Inventors:Wen-Kuang Wu
F28D 15/0266F28D 15/0241F28D 2015/0225
16
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A MICRO-LOOP HEAT PIPE, under the condition of no additional acting-force, removes the waste heat from the devices needed heat-dissipation to the well heat-dissipating circumstance by flexible contact. The MICRO-LOOP HEAT PIPE comprising: at least a flexible metal film, which forms a closed space in which fluid may circulate, and has a heat-absorbing zone and a heat-dissipating zone that both are connected by flow path; at least a wick structure by metal net, which is a flexible structure arranged in the heat-absorbing zone, and in which the transferred-into heat may be conducted uniformly; and a working fluid, may be filled into the flexible metal film, absorbs heat in the heat-absorbing zone, vaporizes into gas state, and generates a pressure source that may make the working fluid circulate inside the flexible metal film; the gasified working fluid may be cooled (or heat-dissipated) in the heat-dissipating zone and changed back to liquid state.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A MICRO-LOOP HEAT PIPE, under the condition of no additional acting-force, removes the waste heat from the devices needed heat-dissipation to the well heat-dissipating circumstance by flexible contact, the MICRO-LOOP HEAT PIPE comprising: 
 at least a flexible metal film, which forms a closed space in which fluids may circulate, and has a heat-absorbing zone and a heat-dissipating zone that both are connected by flow path;    at least a wick structure by metal net, which is a flexible structure arranged in the heat-absorbing zone, and in which the transferred-into heat may be conducted uniformly; and,    a working fluid, may be filled into the flexible metal film, absorbs heat in the heat-absorbing zone, vaporizes into gas state, and generates a pressure source that may make the working fluid circulate inside the flexible metal film; the gasified working fluid may be cooled (or heat-dissipated) in the heat-dissipating zone and changed back to liquid state.    
     
     
         2 . The MICRO-LOOP HEAT PIPE of the  claim 1 , wherein the heat-dissipating zone of the flexible metal film has a structure of “S” shape that is applied for elongating the flow path of the working fluid within the heat-dissipating zone for enhancing the efficiency of heat-dissipation.  
     
     
         3 . The MICRO-LOOP HEAT PIPE of the  claim 1 , wherein the material of the flexible metal film is a material of high heat-conductance and at least one of silver, copper, and aluminum, etc.  
     
     
         4 . The MICRO-LOOP HEAT PIPE of the  claim 1 , wherein the material of the metal net structure is a material of high heat-conductance and at least one of silver, copper, and aluminum, etc.

Join the waitlist — get patent alerts

Track US2003192669A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.