Composite kinematic coupling

Abstract

A fitting for aligning wafer carriers as part of an automated manufacturing process may be referred to as a kinematic coupling. The kinematic coupling of the present invention may comprise a base plate of a first material and contact components of a second material. The contact components may be provided to the base plate as part of an overmolding operation and may be held in place by either chemical fastening or mechanical fastening.

1 . A method of providing a kinematic coupling to a wafer carrier, the method comprising the steps of: 
 providing a contact component comprising a first material, the contact component configured to operably cooperate with kinematic couplings on automated machinery;    placing the contact component in a mold apparatus; and    injecting a second material into the mold to form a wafer carrier component, wherein the contact component is secured to the wafer carrier component and wherein the second material has different characteristics than the first material.    
     
     
         2 . The method of  claim 1 , further comprising the step of molding the contact component of CF PTFE PEI.  
     
     
         3 . The method of  claim 1 , further comprising the step of molding the contact component of CF PTFE PEEK.  
     
     
         4 . The method of  claim 1 , further comprising the step of forming a pair of angled faces in the contact component.  
     
     
         5 . The method of  claim 1 , wherein the second material is a polycarbonate.  
     
     
         6 . The method of  claim 1 , wherein the integral wafer carrier component is a base plate.  
     
     
         7 . The method of  claim 1 , wherein the integral wafer carrier component is a container portion configured to retain semiconductor wafers.  
     
     
         8 . The method of  claim 1 , further comprising the step of mechanically interlocking the contact component to the carrier component.  
     
     
         9 . A method of providing a kinematic coupling to a wafer carrier, the method comprising the steps of: 
 securing a contact component to a wafer carrier component, the contact component comprising a pair of angled faces and formed of a first material, the wafer carrier component comprising of a second material having a different chemical composition than the first material, wherein the contact component is configured to operably cooperate with kinematic coupling projections on automated machinery.    
     
     
         10 . The method of  claim 9 , wherein the step of securing the contact component includes sonically welding the contact component to the carrier component.  
     
     
         11 . The method of  claim 9 , wherein the step of securing the contact component includes chemically bonding the contact component to the carrier component.  
     
     
         12 . The method of  claim 9 , wherein the step of securing the contact component includes staking the contact component to the carrier component.  
     
     
         13 . The method of  claim 9 , wherein the step of securing the contact component includes snapping the contact component in place on the carrier component.  
     
     
         14 . A method of providing a kinematic coupling to a wafer carrier, the method comprising the steps of: 
 mechanically interlocking three kinematic coupling contact components to a wafer carrier component, each contact component comprising a pair of angled faces and formed of a first material, the wafer carrier component comprised of a second material having a different chemical composition than the first material, wherein the contact component is configured to operably cooperate with kinematic coupling projections on automated machinery.    
     
     
         15 . The method of  claim 14 , wherein the mechanical interlocking comprises an extension of the contact component having one or more apertures therein for receiving the second material.  
     
     
         16 . The method of  claim 14 , wherein the contact component comprises an interior surface and a bore therein, the bore configured to mate with a protrusion on the carrier component.  
     
     
         20 . A wafer carrier apparatus configured for interfacing with automated machinery, the apparatus comprising: 
 a wafer carrier comprising a pod having an inside surface, an outside surface and an opening; a wafer support structure provided to the inside surface of the carrier and configured to support semiconductors wafers in a horizontal position; and a fitting configured to align the wafer carrier with the automated machinery, the fitting comprising: 
 a base plate having three recesses, the base plate comprising a first material;  
 three contact components configured to be securably received in the three recesses of the base plate, wherein the contact component comprises a second material having a lower coefficient of friction than the first material.  
   
     
     
         21 . The wafer carrier of  claim 20 , wherein the first material is polycarbonate.  
     
     
         22 . The wafer carrier of  claim 20 , wherein the second material is selected from a group consisting of CF PTFE PEI, CF PTFE PEEK.  
     
     
         23 . The wafer carrier of  claim 20 , wherein the contact component is securably received in the recess by fastening.  
     
     
         24 . The wafer carrier of  claim 20 , wherein the contact component is securably received in the recess by chemically bonding.  
     
     
         25 . The wafer carrier of  claim 20 , wherein the contact component is securably received in the recess by overmolding.  
     
     
         26 . The wafer carrier of  claim 20 , wherein the contact component further comprises a lateral extension having one or more slots therein, the slots configured to aid in securing the contact component into the recess.  
     
     
         27 . A wafer carrier apparatus configured for interfacing with automated machinery, the apparatus comprising: 
 a wafer carrier comprising a pod having an inside surface, an outside surface and an opening; a wafer support structure provided to the inside surface of the carrier and configured to support semiconductors wafers in a horizontal position; and a fitting configured to align the wafer carrier, the fitting comprising: 
 a contact component integrally provided to the carrier, wherein the carrier comprises a first material and the contact component comprises a second material, the second material having a lower coefficient of friction than the first material.  
   
     
     
         28 . A wafer carrier apparatus comprising: 
 means for contacting a pin component of a kinematic coupling, said contacting means comprising a first material;    means for carrying semiconductor wafers, said carrying means comprising a second material; and    means for securing said contacting means to said carrying means.    
     
     
         29 . The apparatus of  claim 28 , wherein the carrying means includes a base plate.  
     
     
         30 . A method of providing an integral kinematic coupling to a wafer carrier, the method comprising: 
 co-injection molding a contact component to a wafer carrier component, the contact component comprised of a first material and the wafer carrier component comprised of a second material having a different chemical composition than the first material, wherein the contact component is configured to operably cooperate with automated machinery.