Micro-electro mechanical system

Abstract

The organic MEMS according to the present invention comprises a polymeric substrate comprising a substrate surface including a first region and a second region. A polymer coating is applied to the first region to provide a coating surface that is spaced apart from the substrate surface. A terminal is disposed on the second region. A metallic trace is affixed to the coating surface such that the metallic trace forms a flexible extension over the second region. The extension has a rest position where the extension is spaced apart from the terminal, and a flexed position where the extension is disposed towards the terminal. An actuator is used to provide an electric field to deflect the extension from the rest position to the flexed position. By changing the spacing between the extension and the terminal, it is possible to change the electrical condition provided by the MEMS.

We claim:  
     
         1 . A method for manufacturing an electronic circuit element comprising: 
 providing a substrate comprising a surface including a first region and a second region,    fabricating an electrode on the second region;    applying a film of a photosensitive polymeric material on the first region, the second region and the electrode, the photosensitive polymeric material having a soluble state prior to irradiation and an insoluble state after irradiation;    selectively irradiating the film to form an insoluble coating on the first region, and a soluble coating on the second region and the electrode;    fabricating a metallic trace on the film, the metallic trace affixed to the insoluble coating and forming an extension on the soluble coating that overlaps the electrode; and    removing the soluble coating from the second region to expose the terminal, such that the electrode is spaced apart from the extension.    
     
     
         2 . The method of  claim 1  wherein the substrate is selected from the group consisting of polymer, ceramic, silicon, gallium arsenide, semiconductor, metal, and glass.  
     
     
         3 . The method of  claim 1  wherein the film is formed of a photoimageable polymer.  
     
     
         4 . The method of  claim 1  wherein the film is selected from the group consisting of a photoimageable polyimide, epoxy, and acrylate.  
     
     
         5 . The method of  claim 1  wherein a second electrode is formed on the second region prior to applying the film.  
     
     
         6 . The method of  claim 1  wherein the electrode is formed by plating a metal layer on the substrate and pattern etching the metal layer to define the electrode.  
     
     
         7 . The method of  claim 6  wherein the plating method is selected from the group consisting of electroplating and electroless plating.  
     
     
         8 . The method of  claim 6  wherein the metal layer is formed of a metal selected from the group consisting of copper, aluminum, platinum, gold, nickel, silver, chrome, palladium, tin, bismuth, indium, lead, gold-palladium, and alloys thereof.  
     
     
         9 . The method of  claim 6  wherein a second electrode is defined by pattern etching the metal layer.  
     
     
         10 . The method of  claim 1  wherein the electrode is formed by laminating a metal layer on the substrate and pattern etching the metal layer to define the electrode.  
     
     
         11 . The method of  claim 10  wherein the metal layer is formed of a metal selected from the group consisting of copper, aluminum, platinum, gold, nickel, silver, chrome, palladium, tin, bismuth, indium, lead, gold-palladium, and alloys thereof.  
     
     
         12 . The method of  claim 10  wherein a second electrode is defined by pattern etching the metal layer.  
     
     
         13 . The method of  claim 1  wherein the insoluble coating is cured after the soluble coating is removed.  
     
     
         14 . The method of  claim 1  wherein the metallic trace is fabricated by laminating a metal layer on the film and pattern etching the metal layer to define the metallic trace.  
     
     
         15 . The method of  claim 14  wherein the metallic trace is formed of metal selected from the group consisting of copper, aluminum, platinum, gold, nickel, silver, chrome, palladium, tin, bismuth, indium, lead, gold-palladium, and alloys thereof.  
     
     
         16 . The method of  claim 1  wherein the metallic trace is fabricated by plating a metal layer on the film and pattern etching the metal layer to define the metallic trace.  
     
     
         17 . The method of  claim 16  wherein the plating method is selected from the group consisting of electroplating and electroless plating.  
     
     
         18 . The method of  claim 16  wherein the metal layer is formed of a metal selected from the group consisting of copper, aluminum, platinum, gold, nickel, silver, chrome, palladium, tin, bismuth, indium, lead, gold-palladium, and alloys thereof.  
     
     
         19 . The method of  claim 1  wherein a metal layer is formed in the first region as the electrode is formed on the second region, and the film is applied over the metal layer.  
     
     
         20 . An electronic circuit element comprising: 
 a substrate comprising a substrate surface including a first region and a second region;    a polymer coating applied to the first region, the polymer coating including a coating surface spaced apart from the substrate surface;    a terminal disposed on the second region;    a metallic trace affixed to the coating surface such that the metallic trace forms an extension over the second region, whereby the extension has a rest position where the extension is spaced apart from the terminal, and a flexed position where the extension is disposed towards the terminal; and    an actuator disposed on the second region capable of creating an electric field effective to flex the extension from the rest position to the flexed position.    
     
     
         21 . The electronic circuit element of  claim 20  wherein the substrate is selected from the group consisting of polymer, ceramic, silicon, gallium arsenide, semiconductor, metal, and glass.  
     
     
         22 . The electronic circuit element of  claim 20  wherein the polymer coating is formed of a photopolymer.  
     
     
         23 . The electronic circuit element of  claim 20  wherein the polymer coating is formed of a material selected from the group consisting of polyimide and epoxy.  
     
     
         24 . The electronic circuit element of  claim 20  wherein the polymer coating is formed of photoimageable polymer.  
     
     
         25 . The electronic circuit element of  claim 20  wherein the substrate is a reinforced polymer composite.  
     
     
         26 . The electronic circuit element of  claim 20  wherein a metal layer is interposed between the substrate and the polymer coating.  
     
     
         27 . The electronic circuit element of  claim 20  wherein the extension has a free end that is remote from a fixed end on the polymer coating.  
     
     
         28 . The electronic circuit element of  claim 20  wherein the extension has a free end that is remote from a fixed end on the polymer coating and is simply supported.  
     
     
         29 . The electronic circuit element of  claim 20  wherein the polymer coating further comprises fixed first and second edges disposed about the second region, and the extension bridges the second region between the fixed first and second edges.  
     
     
         30 . The electronic circuit element of  claim 29  wherein the first and second edges surround the second region, and the extension forms a diaphragm over the second region.  
     
     
         31 . The electronic circuit element of  claim 29  wherein the first and second edges surround the second region, and the extension forms a plate over the second region.  
     
     
         32 . The electronic circuit element of  claim 20  wherein the polymer coating further comprises a fixed first edge and a simply supported second edge disposed about the second region, and the extension bridges the second region between the fixed first edge and the simply supported second edge.  
     
     
         33 . The electronic circuit element of  claim 20  wherein the terminal is also the actuator.  
     
     
         34 . The electronic circuit element of  claim 20  wherein the terminal is distinct from the actuator.  
     
     
         35 . The electronic circuit element of  claim 20  wherein the extension in the flexed position makes contact with the terminal.  
     
     
         36 . The electronic circuit element of  claim 20  wherein there is a gap between the extension and the terminal when the extension is in the flexed position.  
     
     
         37 . The electronic circuit element of  claim 20  wherein the extension forms a plate over the second region.  
     
     
         38 . The electronic circuit element of  claim 20  wherein the extension forms a diaphragm over the second region.  
     
     
         39 . The electronic circuit element of  claim 20  wherein the extension forms a cantilever having a free end over the second region.  
     
     
         40 . A printed wiring board having a switch, the switch comprising: 
 a substrate comprising a substrate surface including a first region and a second region;    a polymer coating applied to the first region, the polymer coating including a coating surface spaced apart from the substrate surface;    a terminal disposed on the second region;    a metallic trace affixed to the coating surface such that the metallic trace forms a extension over the second region, the extension having a rest position wherein the extension is spaced apart from the terminal and a flexed position wherein the extension is disposed towards the terminal; and    an actuator disposed on the second region capable of creating an electric field effective to flex the extension from the rest position to the flexed position.    
     
     
         41 . The printed wiring board of  claim 40  wherein the extension contacts the terminal in the flexed position.  
     
     
         42 . The printed wiring board of  claim 40  wherein there is a gap between the extension and the terminal when the extension is in the flexed position.  
     
     
         43 . The printed wiring board of  claim 40  wherein the extension forms a plate over the second region.  
     
     
         44 . The printed wiring board of  claim 40  wherein the extension forms a diaphragm over the second region.  
     
     
         45 . The printed wiring board of  claim 40  wherein the extension forms a cantilever having a free end over the second region.  
     
     
         45 . The printed wiring board of  claim 40  wherein the terminal is an electrode having a first gap from the extension in the resting position and the actuator is a second electrode having a second gap from the extension in the resting position, such that when the extension is in the flexed position, the extension makes contact with the terminal and there is a gap between the terminal and the actuator.  
     
     
         46 . The printed wiring board of  claim 40  wherein the extension is supported by an organic polymer backing.  
     
     
         47 . A printed wiring board having a variable capacitor, the variable capacitor comprising: 
 a substrate comprising a substrate surface including a first region and a second region;    a polymer coating applied to the first region, the polymer coating including a coating surface spaced apart from the substrate surface;    a terminal disposed on the second region;    a metallic trace affixed to the coating surface such that the metallic trace forms a extension over the second region, the extension having a rest position wherein the extension is spaced apart from the terminal and a flexed position wherein the extension is disposed towards the terminal; and    an actuator disposed on the second region capable of creating an electric field effective to flex the extension from the rest position to the flexed position.    
     
     
         48 . The printed wiring board of  claim 47  wherein the extension is spaced apart from the terminal by a first gap in the rest position and the extension is spaced apart from the terminal by a second gap less than the first gap in the flexed position.  
     
     
         49 . The printed wiring board of  claim 47  further comprising a dielectric layer disposed between the terminal and the extension, such that there is a gap between the extension and the dielectric layer when the extension is in the rest position and the extension contacts the dielectric layer when the extension is in the flexed position.  
     
     
         50 . The printed wiring board of  claim 49  wherein the dielectric layer is selected from the group consisting of ceramic, polymer, oxide, and a polymer-inorganic material  
     
     
         51 . The printed wiring board of  claim 47  wherein the substrate is selected from the group consisting of polymer, ceramic, silicon, gallium arsenide, semiconductor, metal, and glass.