Reactive hot-melt adhesive composition

Abstract

The invention is a reactive hot melt adhesive composition comprising a cationically polymerizable compound, on the average per molecule, having one or more cyclic ether groups such as epoxy groups, a phthalate diester compound expressed by the following formula (2) and a cationic photo-initiator: , wherein in the formula (2), R 5 indicates (C h H 2h O) i H and R 6 indicates (C k H 2k O) l H or (C k H 2k O) l C k H 2k+1 , provided that h, i, k and l each are an integer of 1 or more. The present invention provides a reactive hot melt adhesive, in which a curing reaction progresses under application of actinic radiation, and excellent in not only heat resistance but also adhesiveness to PET.

1 . A reactive hot melt adhesive composition comprising: 
 a cationically polymerizable compound, on the average per molecule, having one or more cationically polymerizable reactive groups of a structure of the following formula (1);    a phthalate diester compound of a structure of the following formula (2); and    a cationic photo-initiator:                          , where in the formula (1), R 1 , R 2 , R 3  and R 4  each indicate a hydrogen atom, a methyl group, an ethyl group, an isopropyl group, an isoamyl group or a phenyl group, provided that m and n each are an integer having a value of 0, 1 or 2, and                          , wherein in the formula (2), R 5  indicates (C h H 2h O) i H and R 6  indicates (C k H 2k O) l H or (C k H 2k O) l C k H 2k+1 , provided that h, i, k and l each are an integer having a value of 1 or more.    
     
     
         2 . A reactive hot melt adhesive composition comprising: 
 a cationically polymerizable compound, on the average per molecule, having one or more cationically polymerizable reactive groups of a structure of the following formula (1);    a phthalate diester compound of a structure of the following formula (3): and    a cationic photo-initiator:                          , where in the formula (1), R 1 , R 2 , R 3  and R 4  each indicate a hydrogen atom, a methyl group, an ethyl group, an isopropyl group, an isoamyl group or a phenyl group, provided that m and n each are an integer having a value of 0, 1 or 2,                          , wherein in the formula (3), R 7  indicates a cationically polymerizable group of a structure of the following formula (4), R 8  indicates a cationically polymerizable group of a structure of the following formula (4), H or an alkyl group, provided that h and k each are an integer having a value of 1 or more and i and l each are an integer having a value of 0 and 1 or more, and                          , wherein in the formula (4), R 1 , R 2 , R 3  and R 4  each indicate a hydrogen atom, a methyl group, an ethyl group, an isopropyl group, an isoamyl group or a phenyl group and R 9  indicates an alkyl group or a hydrogen atom, provided that j is an integer having a value of 0 and 1 or more and m and n each are an integer having a value of 0, 1 or 2.    
     
     
         3 . The reactive hot melt adhesive composition according to  claim 1  or  2  comprising: a thermoplastic resin.  
     
     
         4 . The reactive hot melt adhesive composition according to any of  claims 1  to  3 , wherein the cationically polymerizable reactive group of the cationically polymerizable compound is an epoxy group.