Electronic device manufacturing method, electronic device and resin filling method

Abstract

The present invention provides an electronic device manufacturing method and an electronic device which make it possible to reduce the waste of materials and the number of manufacturing steps required. Electronic devices are manufactured via a process including creating a collective substrate, in which a plurality of substrates corresponding to the electronic devices being manufactured are connected in the form of a matrix, mounting electronic parts on the upper surface of the collective substrate, forming a solidified resin layer using a vacuum printing method so that said resin layer covers the upper surface of the collective substrate on which the aforementioned parts have been mounted, or an intermediate layer consisting of an insulating elastic material, and so that said resin layer covers the electronic parts, and separating the collective substrate on which the above-mentioned resin layer has been formed into individual substrates. Since a collective substrate is used and electronic devices are obtained by ultimately separating this collective substrate, the waste of substrate material can be greatly reduced, and the number of manufacturing steps required can also be reduced.

We claim:  
     
         1 . An electronic device comprising: 
 a substrate having first and second generally planar surfaces, wherein the first generally planar surface is parallel to the second generally planar surface;    one or more electronic parts mounted on the first generally planar surface;    a resin layer disposed to surround at least one of the one or more electronic parts; and    a plurality of terminal electrodes disposed at the substrate and electrically coupled to the one or more electronic parts;    wherein the resin layer includes a substance selected from a group consisting of a ferrite filler and a metal filler.    
     
     
         2 . The electronic device of  claim 1 , wherein the substrate includes a rectangular substrate.  
     
     
         3 . The electronic device of  claim 1 , wherein the resin layer is disposed over the entire first generally planar surface.  
     
     
         4 . The electronic device of  claim 1 , wherein the resin layer includes an insulation material.  
     
     
         5 . The electronic device of  claim 1 , wherein the resin layer includes a heat resistant material.  
     
     
         6 . The electronic device of  claim 1 , wherein the resin layer includes a fluid impermeable material.  
     
     
         7 . The electronic device of  claim 1 , wherein the resin layer includes a chemical resistant material.  
     
     
         8 . An electronic device comprising: 
 a substrate having first and second generally planar surfaces, wherein the first generally planar surface is parallel to the second generally planar surface;    an electronic part mounted on the first generally planar surface;    a resin layer disposed over the first generally planar surface to surround the electronic part;    a protective layer selected from the group consisting of an electromagnetic field shielding film, a heat dissipation layer and a metal layer disposed over the resin layer; and    a terminal electrode disposed at the substrate and electrically coupled to the electronic part.    
     
     
         9 . The electronic device of  claim 8 , wherein the wherein the protective layer is disposed over a portion of the resin layer.  
     
     
         10 . The electronic device of  claim 8 , wherein the resin layer includes an insulation material.  
     
     
         11 . The electronic device of  claim 8 , wherein the resin layer includes a heat resistant material.  
     
     
         12 . The electronic device of  claim 8 , wherein the resin layer includes a fluid impermeable material.  
     
     
         13 . The electronic device of  claim 8 , wherein the resin layer includes a chemical resistant material.