Video game console cooler

Abstract

A heat dissipation structure for electronics including a first heat sink for dissipating heat produced by a first processing unit (e.g., a Central Processing Unit (CPU)), a second heat sink for dissipating heat produced by a second processing unit (e.g., a Graphics Processing Unit (GPU)) and, a heat pipe interconnecting the first and second heat sinks. By connecting the CPU and GPU heat sinks, heat generated by the GPU can be transferred to the CPU where it can be more effectively cooled.

What is claimed is:  
     
         1 . A heat dissipation structure for electronics comprising: 
 a first heat sink for dissipating heat produced by a first processing unit;    a second heat sink for dissipating heat produced by a second processing unit; and,    a heat pipe interconnecting the first and second heat sinks.    
     
     
         2 . The heat dissipation structure of  claim 1 , wherein the first processing unit comprises a central processing unit.  
     
     
         3 . The heat dissipation structure of  claim 2 , wherein the second processing unit comprises a graphics processing unit.  
     
     
         4 . The heat dissipation structure of  claim 1 , wherein the first heat sink comprises a substantially flat body member with at least one slot therein for receiving the heat pipe.  
     
     
         5 . The heat dissipation structure of  claim 1 , wherein the second heat sink comprises a substantially flat body member with at least one slot therein for receiving the heat pipe.  
     
     
         6 . The heat dissipation structure of  claim 4 , wherein the first heat sink includes at least one heat dissipating fin extending substantially orthogonally from said substantially flat body member.  
     
     
         7 . The heat dissipation structure of  claim 5 , wherein the second heat sink includes at least one heat dissipating fin extending substantially orthogonally from said substantially flat body member.  
     
     
         8 . A electronics console comprising: 
 a first processing unit;    a second processing unit;    a first heat sink for dissipating heat produced by the first processing unit;    a second heat sink for dissipating heat produced by the second processing unit; and,    a heat pipe interconnecting the first and second heat sinks.    
     
     
         9 . The electronics console of  claim 8 , wherein the first processing unit comprises a central processing unit.  
     
     
         10 . The electronics console of  claim 9 , wherein the second processing unit comprises a graphics processing unit.  
     
     
         11 . The electronics console of  claim 8 , wherein the first heat sink comprises a substantially flat body member with at least one slot therein for receiving the heat pipe.  
     
     
         12 . The electronics console of  claim 8 , wherein the second heat sink comprises a substantially flat body member with at least one slot therein for receiving the heat pipe.  
     
     
         13 . The electronics console of  claim 11 , wherein the first heat sink includes at least one heat dissipating fin extending substantially orthogonally from said substantially flat body member.  
     
     
         14 . The electronics console of  claim 12 , wherein the second heat sink includes at least one heat dissipating fin extending substantially orthogonally from said substantially flat body member.  
     
     
         15 . The electronics console of  claim 8 , wherein said first heat sink is disposed on a face of said first processing unit.  
     
     
         16 . The electronics console of  claim 15 , wherein said second heat sink is disposed on a face of said second processing unit.  
     
     
         17 . The electronics console of  claim 8 , further comprising: 
 a fan disposed in proximity to said first processing unit and said first heat sink, wherein said first processing unit and said first heat sink are in an air path of said fan and are cooled thereby.    
     
     
         18 . A method for cooling an electronics console, comprising the steps of: 
 connecting a heat pipe between first and second heat sinks of the electronics console.    
     
     
         19 . The method of  claim 18 , comprising the further steps of: 
 disposing a fan in proximity to said first heat sink, wherein said fan provides a cooling airflow to said first heat sink.    
     
     
         20 . A video game console, comprising: 
 a first processing unit;    a second processing unit;    a first heat sink for dissipating heat produced by the first processing unit;    a second heat sink for dissipating heat produced by the second processing unit; and,    a heat pipe interconnecting the first and second heat sinks.