US2003183368A1PendingUtilityA1
Diamond heat sink
Priority: Apr 2, 2002Filed: Apr 2, 2002Published: Oct 2, 2003
Est. expiryApr 2, 2022(expired)· nominal 20-yr term from priority
H10W 72/07336H10W 72/352H10W 72/073H10W 40/254H10W 40/47H10W 72/30H01S 5/02484H01S 5/4025F28F 3/04F28F 21/02F28D 2021/0029F28F 2260/02H01S 5/02423
38
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Claims
Abstract
A heat sink made of a natural or polycrystalline diamond substrate with fins formed thereon. Diamond is grown to form a substrate and a laser is used to cut channels in the substrate to form the fins.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A heat sink comprising:
a natural or polycrystalline diamond substrate with fins formed thereon.
2 . The heat sink of claim 1 in which the diamond is chemical-vapor-deposited diamond or diamond-like-carbon.
3 . The heat sink of claim 1 in which the fins extend continuously along the substrate.
4 . The heat sink of claim 1 in which the fins are pin fins.
5 . The heat sink of claim 1 in which the substrate and the fins are monolithic.
6 . The heat sink of claim 1 in which the substrate has a plurality of layers.
7 . The heat sink of claim 6 in which the fins are cut in all of the layers.
8 . The heat sink of claim 6 in which the fins are cut in a subset of all the layers.
9 . The heat sink of claim 1 in which the fins form microchannels in the substrate.
10 . The heat sink of claim 1 in which the substrate has opposing top and bottom planar surfaces, and the fins are formed in one said planar surface.
11 . The heat sink of claim 1 in which the fins are formed in an edge of the substrate.
12 . An integrated cooling system comprising:
a heat source; a heat sink made of a natural or synthetic diamond substrate with fins formed thereon mounted to the heat source; a metalization layer at the interface between the heat source and the heat sink; and a bonding layer between the metalization layer and the heat source for securing the heat source to the heat sink.
13 . The cooling system of claim 12 further including a metalization layer formed on the heat source and mated with the bonding layer.
14 . The cooling system of claim 12 in which the bonding layer is solder.
15 . The cooling system of claim 12 in which the bonding layer is braze.
16 . The cooling system of claim 12 in which the bonding layer is formed by compression bonding.
17 . The cooling system of claim 12 in which the diamond is chemical-vapor-deposited diamond or diamond-like-carbon.
18 . The cooling system of claim 12 in which the fins extend along the substrate.
19 . The cooling system of claim 12 in which the fins are pin fins.
20 . The cooling system of claim 12 in which the substrate and the fins are monolithic.
21 . The cooling system of claim 12 in which the substrate has a plurality of layers.
22 . The cooling system of claim 12 in which the fins are cut in all of the layers.
23 . The cooling system of claim 12 in which the fins are cut in a subset of all the layers.
24 . The cooling system of claim 12 in which the fins form microchannels in the substrate.
25 . The cooling system of claim 12 further including a diamond support disposed between the heat sink and the heat source.
26 . An optical device comprising:
a reflective surface; and a heat sink adjacent the optical surface, the heat sink including a natural or polycrystalline diamond substrate with fins formed thereon.
27 . A window comprising:
a natural or a polycrystalline diamond substrate with upper and lower surfaces; and fins formed in at least one edge of the substrate.
28 . An integrated cooling system comprising:
an integrated electronic or optical device; and a natural or polycrystalline diamond substrate mated on one surface with the device and including fins formed on the substrate for cooling the device.
29 . A method of manufacturing a diamond heat sink, the method comprising:
growing diamond to form a substrate; and using a laser to cut channels in the substrate to form fins thereon.
30 . The method of claim 29 further including growing multiple diamond layers and securing the multiple diamond layers together to form a substrate with discrete layers before the channels are cut.
31 . The method of claim 30 in which cutting includes cutting channels in all the layers.
32 . The method of claim 30 in which cutting includes cutting channels in a subset of the layers.
33 . The method of claim 29 in which growing includes chemical-vapor-deposition of diamond.
34 . The method of claim 29 in which the channels are cut to be 150 um or less in width to form microchannels.
35 . The method of claim 29 in which the channels are cut to extend in one direction to form straight fins.
36 . The method of claim 29 in which the channels are cut to extend in two different directions to form pin fins.
37 . The method of claim 29 further including the addition of a metalization layer to the substrate.
38 . The method of claim 29 in which the substrate is polished before it is cut.
39 . A heat sink assembly comprising:
a natural or polycrystalline diamond substrate with fins formed thereon; and a natural or polycrystalline diamond support attached to the substrate.
40 . The heat sink of claim 1 in which the diamond is chemical-vapor-deposited diamond or diamond-like-carbon.
41 . The heat sink assembly of claim 39 in which the fins extend continuously along the substrate.
42 . The heat sink assembly of claim 39 in which the fins are pin fins.
43 . The heat sink assembly of claim 39 in which the substrate and the fins are monolithic.
44 . The heat sink assembly of claim 39 in which the substrate has a plurality of layers.
45 . The heat sink assembly of claim 44 in which the fins are cut in all of the layers.
46 . The heat sink assembly of claim 44 in which the fins are cut in a subset of all the layers.
47 . The heat sink assembly of claim 39 in which the fins form microchannels in the substrate.
48 . The heat sink assembly of claim 39 in which the substrate has opposing top and bottom planar surfaces, and the fins are formed in one said planar surface.
49 . The heat sink assembly of claim 39 further including metalization on the support and metalization on the substrate.
50 . The heat sink assembly of claim 39 further including a heat source mounted on the support.
51 . The heat sink assembly of claim 50 further including metalization on the heat source.Join the waitlist — get patent alerts
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