US2003183368A1PendingUtilityA1

Diamond heat sink

Priority: Apr 2, 2002Filed: Apr 2, 2002Published: Oct 2, 2003
Est. expiryApr 2, 2022(expired)· nominal 20-yr term from priority
H10W 72/07336H10W 72/352H10W 72/073H10W 40/254H10W 40/47H10W 72/30H01S 5/02484H01S 5/4025F28F 3/04F28F 21/02F28D 2021/0029F28F 2260/02H01S 5/02423
38
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Claims

Abstract

A heat sink made of a natural or polycrystalline diamond substrate with fins formed thereon. Diamond is grown to form a substrate and a laser is used to cut channels in the substrate to form the fins.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A heat sink comprising: 
 a natural or polycrystalline diamond substrate with fins formed thereon.    
     
     
         2 . The heat sink of  claim 1  in which the diamond is chemical-vapor-deposited diamond or diamond-like-carbon.  
     
     
         3 . The heat sink of  claim 1  in which the fins extend continuously along the substrate.  
     
     
         4 . The heat sink of  claim 1  in which the fins are pin fins.  
     
     
         5 . The heat sink of  claim 1  in which the substrate and the fins are monolithic.  
     
     
         6 . The heat sink of  claim 1  in which the substrate has a plurality of layers.  
     
     
         7 . The heat sink of  claim 6  in which the fins are cut in all of the layers.  
     
     
         8 . The heat sink of  claim 6  in which the fins are cut in a subset of all the layers.  
     
     
         9 . The heat sink of  claim 1  in which the fins form microchannels in the substrate.  
     
     
         10 . The heat sink of  claim 1  in which the substrate has opposing top and bottom planar surfaces, and the fins are formed in one said planar surface.  
     
     
         11 . The heat sink of  claim 1  in which the fins are formed in an edge of the substrate.  
     
     
         12 . An integrated cooling system comprising: 
 a heat source;    a heat sink made of a natural or synthetic diamond substrate with fins formed thereon mounted to the heat source;    a metalization layer at the interface between the heat source and the heat sink; and    a bonding layer between the metalization layer and the heat source for securing the heat source to the heat sink.    
     
     
         13 . The cooling system of  claim 12  further including a metalization layer formed on the heat source and mated with the bonding layer.  
     
     
         14 . The cooling system of  claim 12  in which the bonding layer is solder.  
     
     
         15 . The cooling system of  claim 12  in which the bonding layer is braze.  
     
     
         16 . The cooling system of  claim 12  in which the bonding layer is formed by compression bonding.  
     
     
         17 . The cooling system of  claim 12  in which the diamond is chemical-vapor-deposited diamond or diamond-like-carbon.  
     
     
         18 . The cooling system of  claim 12  in which the fins extend along the substrate.  
     
     
         19 . The cooling system of  claim 12  in which the fins are pin fins.  
     
     
         20 . The cooling system of  claim 12  in which the substrate and the fins are monolithic.  
     
     
         21 . The cooling system of  claim 12  in which the substrate has a plurality of layers.  
     
     
         22 . The cooling system of  claim 12  in which the fins are cut in all of the layers.  
     
     
         23 . The cooling system of  claim 12  in which the fins are cut in a subset of all the layers.  
     
     
         24 . The cooling system of  claim 12  in which the fins form microchannels in the substrate.  
     
     
         25 . The cooling system of  claim 12  further including a diamond support disposed between the heat sink and the heat source.  
     
     
         26 . An optical device comprising: 
 a reflective surface; and    a heat sink adjacent the optical surface, the heat sink including a natural or polycrystalline diamond substrate with fins formed thereon.    
     
     
         27 . A window comprising: 
 a natural or a polycrystalline diamond substrate with upper and lower surfaces; and    fins formed in at least one edge of the substrate.    
     
     
         28 . An integrated cooling system comprising: 
 an integrated electronic or optical device; and    a natural or polycrystalline diamond substrate mated on one surface with the device and including fins formed on the substrate for cooling the device.    
     
     
         29 . A method of manufacturing a diamond heat sink, the method comprising: 
 growing diamond to form a substrate; and    using a laser to cut channels in the substrate to form fins thereon.    
     
     
         30 . The method of  claim 29  further including growing multiple diamond layers and securing the multiple diamond layers together to form a substrate with discrete layers before the channels are cut.  
     
     
         31 . The method of  claim 30  in which cutting includes cutting channels in all the layers.  
     
     
         32 . The method of  claim 30  in which cutting includes cutting channels in a subset of the layers.  
     
     
         33 . The method of  claim 29  in which growing includes chemical-vapor-deposition of diamond.  
     
     
         34 . The method of  claim 29  in which the channels are cut to be 150 um or less in width to form microchannels.  
     
     
         35 . The method of  claim 29  in which the channels are cut to extend in one direction to form straight fins.  
     
     
         36 . The method of  claim 29  in which the channels are cut to extend in two different directions to form pin fins.  
     
     
         37 . The method of  claim 29  further including the addition of a metalization layer to the substrate.  
     
     
         38 . The method of  claim 29  in which the substrate is polished before it is cut.  
     
     
         39 . A heat sink assembly comprising: 
 a natural or polycrystalline diamond substrate with fins formed thereon; and    a natural or polycrystalline diamond support attached to the substrate.    
     
     
         40 . The heat sink of  claim 1  in which the diamond is chemical-vapor-deposited diamond or diamond-like-carbon.  
     
     
         41 . The heat sink assembly of  claim 39  in which the fins extend continuously along the substrate.  
     
     
         42 . The heat sink assembly of  claim 39  in which the fins are pin fins.  
     
     
         43 . The heat sink assembly of  claim 39  in which the substrate and the fins are monolithic.  
     
     
         44 . The heat sink assembly of  claim 39  in which the substrate has a plurality of layers.  
     
     
         45 . The heat sink assembly of  claim 44  in which the fins are cut in all of the layers.  
     
     
         46 . The heat sink assembly of  claim 44  in which the fins are cut in a subset of all the layers.  
     
     
         47 . The heat sink assembly of  claim 39  in which the fins form microchannels in the substrate.  
     
     
         48 . The heat sink assembly of  claim 39  in which the substrate has opposing top and bottom planar surfaces, and the fins are formed in one said planar surface.  
     
     
         49 . The heat sink assembly of  claim 39  further including metalization on the support and metalization on the substrate.  
     
     
         50 . The heat sink assembly of  claim 39  further including a heat source mounted on the support.  
     
     
         51 . The heat sink assembly of  claim 50  further including metalization on the heat source.

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