Conductive particles and method and devices for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same

Abstract

The present invention has its object to provide a manufacturing device for making conductive particles that efficiently permit a placed layer of uniform thickness to be formed over each of all particles without aggregating the particles in a plating liquid. The manufacturing device for conductive fine particles of the present invention comprises a disk-shaped bottom plate secured to the upper end of a perpendicular driving shaft; a porous member that is placed on the outer circumferential upper face of the bottom plate and that allows only a plating solution to pass there through; a contact ring for conducting electricity placed on the upper face of the porous member; a hollow cover of a trapezoidal cone shape having an opening on an upper center portion thereof, to the upper end of which a hollow cylinder having the same pore diameter as the opening diameter is joined, with the upper end of the hollow cylinder being bent toward the inner wall side of the hollow cylinder; a rotatable treatment chamber formed in a manner so as to sandwich the porous member and the contact ring, between the outer circumferential portion of the hollow cover and the bottom plate; a supply tube for supplying the plating solution to the treatment chamber through the opening; a container for receiving plating solution scattered from the pores of the porous member; a drain tube for draining the plating solution accumulated in the container; and an electrode inserted through the opening to contact the plating solution.

1 . A manufacturing device for conductive fine particles comprising: 
 a disk-shaped bottom plate secured to the upper end of a perpendicular driving shaft;    a porous member that is placed on the outer circumferential upper face of the bottom plate and that allows only a plating solution to pass there through;    a contact ring for conducting electricity placed on the upper face of the porous member;    a hollow cover of a trapezoidal cone shape having an opening on an upper center portion thereof, to the upper end of which a hollow cylinder having the same pore diameter as the opening diameter is joined, with the upper end of the hollow cylinder being bent toward the inner wall side of the hollow cylinder;    a rotatable treatment chamber formed in a manner so as to sandwich the porous member and the contact ring, between the outer circumferential portion of the hollow cover and the bottom plate;    a supply tube for supplying the plating solution to the treatment chamber through the opening;    a container for receiving plating solution scattered from the pores of the porous member;    a drain tube for draining the plating solution accumulated in the container; and    an electrode inserted through the opening to contact the plating solution.    
     
     
         2 . A manufacturing device for conductive fine particles comprising: 
 a disk-shaped bottom plate secured to the upper end of a perpendicular driving shaft;    a porous member that is placed on the outer circumferential upper face of the bottom plate and that comprises a plate-shaped porous support and a sheet-shaped filter, affixed on inner side face thereof, having a thickness of 10 to 1000 μm with a pore size allowing only a plating solution to pass there through;    a contact ring for conducting electricity placed on the upper face of the porous member;    a hollow cover of a trapezoidal cone shape having an opening on an upper center portion thereof;    a rotatable treatment chamber formed in a manner so as to sandwich the porous member and the contact ring, between the outer circumferential portion of the hollow cover and the bottom plate;    a supply tube for supplying the plating solution to the treatment chamber through the opening;    a container for receiving plating solution scattered from the pores of the porous member;    a drain tube for draining the plating solution accumulated in the container; and    an electrode inserted through the opening to contact the plating solution.    
     
     
         3 . The manufacturing device for conductive fine particles according to  claim 1 , wherein the porous member comprises a plate-shaped porous support and a sheet-shaped filter, affixed on inner side face thereof, having a thickness of 10 to 1000 μm with a pore size allowing only a plating solution to pass there through.  
     
     
         4 . A manufacturing device for conductive fine particles comprising: 
 a disk-shaped bottom plate secured to the upper end of a perpendicular driving shaft;    a plate-shaped porous member that allows only a plating solution to pass there through and that is placed on the upper face of the bottom plate;    a contact ring for conducting electricity placed on the upper face of the porous member;    a hollow cover of a trapezoidal cone shape having an opening on an upper center portion thereof;    a rotatable treatment chamber formed in a manner so as to sandwich the porous member and the contact ring, between the outer circumferential portion of the hollow cover and the bottom plate;    a supply tube for supplying the plating solution to the treatment chamber through the opening;    a container for receiving plating solution scattered from the pores of the porous member;    a drain tube for draining the plating solution accumulated in the container; and    an electrode inserted through the opening to contact the plating solution.    
     
     
         5 . A manufacturing device for conductive fine particles comprising: 
 a disk-shaped bottom plate secured to the upper end of a perpendicular driving shaft;    a plate-shaped porous member that allows only a plating solution to pass there through and that is placed on the upper face of the bottom plate;    a contact ring for conducting electricity placed on the upper face of the porous member;    a hollow cover of a trapezoidal cone shape having an opening on an upper center portion thereof, to the upper end of which a hollow cylinder having the same pore diameter as the opening diameter is joined, with the upper end of the hollow cylinder being bent toward the inner wall side of the hollow cylinder;    a rotatable treatment chamber formed in a manner so as to sandwich the porous member and the contact ring, between the outer circumferential portion of the hollow cover and the bottom plate;    a supply tube for supplying the plating solution to the treatment chamber through the opening;    a container for receiving plating solution scattered from the pores of the porous member;    a drain tube for draining the plating solution accumulated in the container; and    an electrode inserted through the opening to contact the plating solution.    
     
     
         6 . The manufacturing device for conductive fine particles according to  claim 4  or  5 , wherein the porous member comprises a plate-shaped porous support and a sheet-shaped filter, affixed on upper face thereof, having a thickness of 10 to 1000 μm with a pore size allowing only a plating solution to pass there through.  
     
     
         7 . A manufacturing method for conductive fine particles, which comprises a plating process providing an electroplating layer on the surface of each of the fine particles and a process of: 
 applying at least one force selected from the group consisting of a shearing force, an impact force and cavitation, in order to disperse, pulverize and divide into individual particles, aggregated lumps of fine particles formed during the plating process.    
     
     
         8 . A manufacturing method for conductive fine particles, which comprises a plating process for making the fine particles collide with a cathode by a centrifugal force in a plating bath having the cathode and an anode, to form an electroplating layer on the surface of each of the fine particles, and a process of: 
 applying at least one force selected from the group consisting of a shearing force, an impact force and cavitation, in order to disperse, pulverize and divide into individual particles, aggregated lumps of fine particles formed during the plating process.    
     
     
         9 . A manufacturing method for conductive fine particles, 
 which comprises loading pre-treated fine particles into a treatment chamber and carrying out a plating process by allowing the treatment chamber to rotate centered on its rotation axis while supplying a plating solution into the treatment chamber to form an electroplating layer on each of the fine particles,    and applying at least one selected from the group consisting of a shearing force, an impact force and cavitation, in order to disperse, pulverize and divide into individual particles, aggregated lumps of fine particles formed during the plating process,    wherein the plating process is performed with use of an electroplating device comprising: 
 a disk-shaped bottom plate secured to the upper end of a perpendicular driving shaft; a porous member that is placed on the outer circumferential upper face of the bottom plate and that allows only a plating solution to pass there through; a contact ring for conducting electricity placed on the upper face of the porous member; a hollow cover of a trapezoidal cone shape having an opening on its upper center portion, to the upper end of which a hollow cylinder having the same pore diameter as the opening diameter is joined, with the upper end of the hollow cylinder being bent toward the inner wall side of the hollow cylinder; the rotatable treatment chamber formed in a manner so as to sandwich the porous member and the contact ring between the outer circumferential portion of the hollow cover and the bottom plate; a supply tube for supplying the plating solution to the treatment chamber through the opening; a container for receiving plating solution scattered from the pores of the porous member; a drain tube for draining the plating solution accumulated in the container; and an electrode inserted through the opening to contact the plating solution.  
   
     
     
         10 . A manufacturing device for conductive fine particles comprising: 
 a disk-shaped bottom plate secured to the upper end of a perpendicular driving shaft;    a porous member that is placed on the outer circumferential upper face of the bottom plate and that allows only a treatment liquid to pass there through; a contact ring for conducting electricity placed on the upper face of the porous member; a hollow cover of a trapezoidal cone shape having an opening on an upper center portion thereof, to the upper end of which a hollow cylinder having the same pore diameter as the opening diameter is joined, with the upper end of the hollow cylinder being bent toward the inner wall side of the hollow cylinder; a rotatable treatment chamber formed in a manner so as to sandwich the porous member and the contact ring, between the outer circumferential portion of the hollow cover and the bottom plate; a supply tube for supplying the treatment liquid to the plating vessel through the opening; a container for receiving treatment liquid scattered from the pores of the porous member; a drain tube for draining the treatment liquid accumulated in the container; an electrode inserted through the opening to contact the plating solution, and a pulverizing device for applying at least one selected from the group consisting of a shearing force, an impact force and cavitation, in order to disperse, pulverize and divide into individual particles, aggregated lumps of fine particles formed during the plating process.    
     
     
         11 . A manufacturing device for conductive fine particles comprising: 
 a disk-shaped bottom plate secured to the upper end of a perpendicular driving shaft;    a porous member that is placed on the outer circumferential upper face of the bottom plate and that allows only a plating solution to pass there through;    a contact ring for conducting electricity placed on the upper face of the porous member;    a hollow cover having an opening on its upper center portion;    a rotatable plating vessel formed in a manner so as to sandwich the porous member and the contact ring between the outer circumferential portion of the hollow cover and the bottom plate;    a treatment chamber, placed inside the plating vessel, that is formed with a partition plate for allowing only a plating solution to pass through, and comprises the inside face of the contact ring;    a supply tube for supplying the plating solution to the plating vessel through the opening;    a container for receiving plating solution scattered from the pores of the porous member;    a drain tube for draining the plating solution accumulated in the container; and    an electrode inserted through the opening to contact the plating solution.    
     
     
         12 . A manufacturing method for conductive fine particles for forming a plating layer on the surface of each of the fine particles by a plating process, 
 which comprises a power application process for applying power with the fine particles contacting the cathode to form a plating layer on the surface of each of the fine particles and a stirring process for stirring the fine particles,    wherein said plating process is performed with use of a manufacturing device for conductive fine particles comprising; a rotatable treatment chamber that has a cathode on its side face and a filter section allowing the plating solution to pass there through and to drain it; and an anode placed in the treatment chamber so as not to contact the cathode, is carried out by repeating rotation and stoppage of the treatment chamber.    
     
     
         13 . The manufacturing method for conductive fine particles according to  claim 12 , wherein said manufacturing device for conductive fine particles comprises: a disk-shaped bottom plate secured to the upper end of a perpendicular driving shaft; a porous member that is placed on the outer circumferential upper face of the bottom plate and that allows only a plating solution to pass there through; a contact ring for conducting electricity placed on the upper face of the porous member; a hollow cover having an opening on an upper center portion thereof; the rotatable treatment chamber formed in a manner so as to sandwich the porous member and the contact ring, between the outer circumferential portion of the hollow cover and the bottom plate; a supply tube for supplying the plating solution to the treatment chamber through the opening; a container for receiving plating solution scattered from the pores of the porous member; a drain tube for draining the plating solution accumulated in the container; and an electrode inserted through the opening to contact the plating solution.  
     
     
         14 . A manufacturing method for conductive fine particles for forming an electroplating layer on the surface of each of the fine particles by a plating process, 
 wherein the plating process, using a manufacturing device for conductive fine particles comprising a rotatable treatment chamber having a cathode on its side face and a filter section passing the plating solution to drain it, and an anode placed in the treatment chamber so as not to contact the cathode, comprises steps of applying power with the fine particles being made contact with the cathode by the effect of a centrifugal force caused by the rotation of the treatment chamber to form an electroplating layer on the surface of each of the fine particles, and stopping the rotation of the treatment chamber and the application of power, further repeating the rotation and stoppage of the treatment chamber, and    the difference in gravity between the fine particles and the plating solution is set in the range of 0.04 to 22.00.    
     
     
         15 . The manufacturing method for conductive fine particles according to  claim 14 , wherein the manufacturing device of the conductive fine particles comprises: a disk-shaped bottom plate secured to the upper end of a perpendicular driving shaft; a porous member that is placed on the outer circumferential upper face of the bottom plate and that allows only a plating solution to pass there through; a contact ring for conducting electricity placed on the upper face of the porous member; a hollow cover having a trapezoidal cone shape having an opening on its upper center portion; a rotatable treatment chamber formed in a manner so as to sandwich the porous member and the contact ring, between the outer circumferential portion of the hollow cover and the bottom plate; a supply tube for supplying the plating solution to the plating vessel through the opening; a container for receiving plating solution scattered from the pores of the porous member; a drain tube for draining the plating solution accumulated in the container; and an electrode inserted through the opening to contact the plating solution.  
     
     
         16 . A manufacturing method for conductive fine particles for forming an electroplating layer on the surface of each of the fine particles by a plating process, 
 wherein the plating process, using a manufacturing device for conductive fine particles that comprises; a rotatable treatment chamber that has a cathode on its side face and a filter section allowing the plating solution to pass there through and to drain it; and an anode placed in the treatment chamber so as not to contact the cathode, comprises the steps of applying power with the fine particles being made contact with the cathode by the effect of a centrifugal force caused by the rotation of the treatment chamber, so as to form an electroplating layer on the surface of each of the fine particles, and stopping the rotation of the treatment chamber and the application of power, and repeating the rotation and stoppage of the treatment chamber, and    the rotation of the treatment chamber is carried out with the number of revolutions so as to set the centrifugal effect at 2.0 to 40.0, the power application is started 0.5 to 10 seconds after the start of the rotation of the treatment chamber, and the time of stoppage of the treatment chamber is set to 0 to 10 seconds.    
     
     
         17 . A manufacturing method for conductive fine particles for forming an electroplating layer on the surface of each of the fine particles by a plating process, wherein the plating process, using a manufacturing device for conductive fine particles that comprises; a rotatable treatment chamber that has a cathode on its side face and a filter section allowing the plating solution to pass there through and to drain it; and an anode placed in the treatment chamber so as not to contact the cathode, comprises applying power with the fine particles being made contact with the cathode by the effect of a centrifugal force caused by the rotation of the treatment chamber to form an electroplating layer on the surface of each of the fine particles, and stopping the rotation of the treatment chamber and the application of power, and repeating the rotation and stoppage of the treatment chamber, and 
 the rotation of the treatment chamber is carried out with a number of rotations so as to provide a centrifugal effect of 2.0 to 40.0, the power application is started 3 to 10 seconds after the rotation start of the treatment chamber before the film thickness of the electroplating layer formed on the surface of each of the fine particles has become a constant value, and after the film thickness of the electroplating layer formed on the surface of each of the fine particles has become a constant value, the power application is started 0.5 to 10 seconds after the rotation start of the treatment chamber, and the starting time is earlier than the power application start time before the film thickness of the electroplating layer formed on the surface of each of the fine particles has become the constant value.    
     
     
         18 . The manufacturing method for conductive fine particles according to  claim 16  or  claim 17 , wherein the manufacturing device for conductive fine particles comprises: a disk-shaped bottom plate secured to the upper end of a perpendicular driving shaft; a porous member that is placed on the outer circumferential upper face of the bottom plate and that allows only a plating solution to pass there through; a contact ring for conducting electricity placed on the upper face of the porous member; a hollow cover having a trapezoidal cone shape having an opening on its upper center portion; a rotatable treatment chamber formed in a manner so as to sandwich the porous member and the contact ring, between the outer circumferential portion of the hollow cover and the bottom plate; a supply tube for supplying the plating solution to the plating vessel through the opening; a container for receiving plating solution scattered from the pores of the porous member; a drain tube for draining the plating solution accumulated in the container; and an electrode inserted through the opening to contact the plating solution.  
     
     
         19 . A conductive fine particle, which is subjected to electroplating on the outer surface thereof, wherein a particle size thereof is 0.5 to 500 μm, an aspect ratio of less than 1.5 and a variation coefficient of not more than 50%.  
     
     
         20 . The conductive fine particle according to  claim 19  which is subjected to electroplating by a rotatable plating device having a cathode on an outer circumferential portion thereof and an anode placed so as not to contact the cathode.  
     
     
         21 . The conductive fine particle according to  claim 19  or  claim 20 , wherein the electroplating is curried out with gold, platinum or palladium.  
     
     
         22 . The conductive fine particle according to  claim 19 ,  20  or  21 , wherein the electroplating has a thickness of 0.2 to 3 μm.  
     
     
         23 . An anisotropic conductive adhesive comprising the conductive fine particle according to  claim 19 ,  20 ,  21  or  22 .  
     
     
         24 . The anisotropic conductive adhesive according to  claim 23 , wherein each of the conductive fine particles is placed at a specific area.  
     
     
         25 . A conductive connecting element wherein connection is formed by using the anisotropic conductive adhesive disclosed in  claim 23  or  claim 24 .  
     
     
         26 . An electronic circuit part which is formed by electrically connecting an electrode section of an electronic circuit element and an electrode section of an electronic circuit substrate, 
 wherein the connection is formed by using a laminated conductive fine particle provided with a conductive metal layer on the surface of a spherical elastic base particle, and    the electrical connection is formed by a plurality of the laminated conductive fine particles per each connecting section at connecting sections between the electrode section of the electronic circuit element and the electrode section of the electronic circuit substrate.    
     
     
         27 . An electronic circuit part which is formed by electrically connecting an electrode section of an electronic circuit element and an electrode section of an electronic circuit substrate, 
 wherein the connection which is formed by using a double laminated conductive fine particle provided with a conductive metal layer on the surface of a spherical elastic base particle and, further on the surface of the conductive metal layer, a low-melting-point metal layer, and    the electrical connection being made by a plurality of the laminated conductive fine particles per each connecting section at connecting sections between the electrode section of the electronic circuit element and the electrode section of the electronic circuit substrate.    
     
     
         28 . The electronic circuit part according to  claim 26  or  27 , wherein the thickness (t: unit mm) of the conductive metal layer is set in a range represented by formula [1] 
         P×D/σ<t< 0.2 ×D   [formula 1] where P is a constant of pressure unit, 0.7 Kg/mm 2 , D is the diameter (unit: mm) of an elastic base particle, and σ is a tensile strength (unit: Kg/mm 2 ) of a metal material forming the conductive metal layer, and the tensile strength is measured under the condition that the sheet-shaped material having a thickness of 0.5 to 2 mm is tested at a tensile speed of 10 mm/min. by a tensile tester.    
     
     
         29 . An electronic circuit part which is formed by electrically connecting an electrode section of an electronic circuit element and an electrode section of an electronic circuit substrate, 
 wherein the connection is formed by using a laminated conductive fine particle provided with a conductive metal layer around of a spherical elastic base particle,    the electrical connection is formed by one laminated conductive fine particle per each connecting section at each of connecting sections between the conductive metal layer of the laminated conductive fine particle and the electrode section of the electrode circuit element, as well as by one laminated conductive fine particle per each connecting section at the connecting sections between the conductive metal layer of each of the laminated conductive fine particles and the electrode section of the electronic circuit substrate.    
     
     
         30 . An electronic circuit part which is formed by electrically connecting an electrode section of an electronic circuit element and an electrode section of an electronic circuit substrate, 
 wherein the connection is formed by using a double laminated conductive fine particle provided with a conductive metal layer around a spherical elastic base particle and, further on the surface of the conductive metal layer, a low-melting-point metal layer, and    the electrical connection is formed by one double laminated conductive fine particle per each connecting section at connecting sections between the conductive metal layer and the low-melting-point metal layer of each of the double laminated conductive fine particles and the electrode section of the electrode circuit element, as well as by one double laminated conductive fine particle per each connecting section at the connecting sections between the conductive metal layer the double laminated conductive fine particle and the electrode section of the electrode circuit substrate.    
     
     
         31 . The electronic circuit part according to  claim 26 ,  27 ,  28 ,  29  or  30 , wherein the spherical elastic base particles have a thermal conductivity of not less than 0.30 W/m K.  
     
     
         32 . The electronic circuit part according to claims  26 ,  27 ,  28 ,  29 ,  30  or  31 , wherein the spherical elastic base particles is a resin material or an organic/inorganic hybrid material.  
     
     
         33 . The electronic circuit part according to  claim 26 ,  27 ,  28 ,  29 ,  30 ,  31  or  32 , wherein a spherical elastic base particle further includes an inorganic filler.  
     
     
         34 . The electronic circuit part according to any one of  claims 29  to  33 , wherein the thickness (t: unit mm) of the conductive metal layer is set in a range represented by formula [1] 
         P×D/σ<t< 0.2 ×D   [Formula 1] where P is a constant of pressure unit, 1.0 Kg/mm 2 , D is the diameter (unit: mm) of an elastic base particle, σ is a tensile strength (unit: Kg/mm 2 ) of a metal material forming the conductive metal layer, and the tensile strength is measured under the condition that the sheet-shaped material having a thickness of 0.5 to 2 mm is tested at a tensile speed of 10 mm/min. by a tensile tester.    
     
     
         35 . The electronic circuit part according to any one of  claims 26  to  35 , wherein the conductive metal layer comprises at least one component selected from the group consisting of nickel, palladium, gold, silver, copper, aluminum and platinum.  
     
     
         36 . The electronic circuit part according to any one of  claims 26  to  35 , wherein the conductive metal layer comprises a plurality of metal layers.  
     
     
         37 . The electronic circuit part according to any one of  claims 26  to  36 , wherein at least one of the metal layers constituting a conductive metal layer is formed by electroplating.  
     
     
         38 . The electronic circuit part according to any one of  claims 29  to  37 , wherein at least one metal layer constituting the conductive metal layer is formed by electroplating using an electroplating device, 
 the electroplating device comprises a disk-shaped bottom plate secured to the upper end of a perpendicular driving shaft; a porous member that is placed on the outer circumferential upper face of the bottom plate and that allows only a plating solution to pass there through; a contact ring for conducting electricity placed on the upper face of the porous member; a hollow cover of a trapezoidal cone shape having an opening on an upper center portion thereof, to the upper end of which a hollow cylinder having the same pore diameter as the opening diameter is joined, with the upper end of the hollow cylinder being bent toward the inner wall side of the hollow cylinder; a rotatable treatment chamber formed in a manner so as to sandwich the porous member and the contact ring, between the outer circumferential portion of the hollow cover and the bottom plate; a supply tube for supplying the plating solution to the treatment chamber through the opening; a container for receiving plating solution scattered from the pores of the porous member; a drain tube for draining the plating solution accumulated in the container; and an electrode inserted through the opening to contact the plating solution.  
 
     
     
         39 . The electronic circuit part according to any one of  claims 26  to  38 , wherein a low-melting-point metal layer has a thickness of not more than 50% of the diameter of the elastic base particles.  
     
     
         40 . The electronic circuit part according to any one of  claims 26  to  39 , wherein a low-melting-point metal layer has a thickness of not less than 3% of the diameter of the elastic base particles.  
     
     
         41 . The electronic circuit part according to any one of  claims 26  to  40 , wherein a metal constituting the low-melting-point metal layer has a melting point of not more than 260° C.  
     
     
         42 . The electronic circuit part according to any one of  claims 26  to  41 , wherein a metal constituting the low-melting-point metal layer comprises at least one metal selected from the group consisting of tin, lead, bismuth, silver, zinc, indium and copper.  
     
     
         43 . The electronic circuit part according to any one of  claims 26  to  42 , wherein a metal constituting the low-melting-point metal layer comprises at least one metal selected from the group consisting of tin and alloys of tin.  
     
     
         44 . The electronic circuit part according to any one of  claims 26  to  43 , wherein a metal constituting the low-melting-point metal layer comprises at least one metal selected from the group consisting of tin and alloys of tin, and further comprises at least one metal selected from the group consisting of lead, bismuth, silver, zinc, indium and copper.  
     
     
         45 . The electronic circuit part according to any one of  claims 26  to  44 , wherein the low-melting-point metal layer is constituted by a plurality of metal layers.  
     
     
         46 . The electronic circuit part according to any one of  claims 26  to  45 , wherein at least one portion constituting a low-melting-point metal layer is formed by electroplating.  
     
     
         47 . The electronic circuit part according to any one of  claims 26  to  46 , wherein at least one metal layer constituting the conductive metal layer is formed by electroplating using an electroplating device, 
 the electroplating device comprises a disk-shaped bottom plate secured to the upper end of a perpendicular driving shaft; a porous member that is placed on the outer circumferential upper face of the bottom plate and that allows only a plating solution to pass there through; a contact ring for conducting electricity placed on the upper face of the porous member; a hollow cover of a trapezoidal cone shape having an opening on an upper center portion thereof, to the upper end of which a hollow cylinder having the same pore diameter as the opening diameter is joined, with the upper end of the hollow cylinder being bent toward the inner wall side of the hollow cylinder; a rotatable treatment chamber formed in a manner so as to sandwich the porous member and the contact ring, between the outer circumferential portion of the hollow cover and the bottom plate; a supply tube for supplying the plating solution to the treatment chamber through the opening; a container for receiving plating solution scattered from the pores of the porous member; a drain tube for draining the plating solution accumulated in the container; and an electrode inserted through the opening to contact the plating solution.  
 
     
     
         48 . The electronic circuit part according to any one of  claims 26  to  47 , wherein an elastic base particles has a diameter in a range of 5 to 700 μm.  
     
     
         49 . The electronic circuit part according to any one of  claims 26  to  48 , wherein an elastic base particles has a diameter in a range of 10 to 150 μm.  
     
     
         50 . The electronic circuit part according to any one of  claims 26  to  49 , wherein even in the case when, of the electrode section of the electronic circuit element and the electrode section of the electronic circuit substrate, one is dislocated in parallel with the other due to a physical force in the parallel direction, a laminated conductive fine particle or a double laminated conductive fine particle exert an elastic shearing deformation, thereby providing a recovering capability.  
     
     
         51 . An electronic circuit element or an electronic circuit substrate, which is connected by a conductive fine particle, wherein a bonding strength F (unit: gr) between the conductive fine particle and an electrode section of an electronic circuit element or an electrode section of an electronic circuit substrate is set in a range represented by [formula 2]: 
       500 ×D′×D′  (gr/mm mm)< F< 8000 ×D′×D′  (gr/mm mm)  [Formula 2] wherein D′ represents the diameter (unit: mm) of the conductive fine particles.    
     
     
         52 . The electronic circuit part according to any one of  claims 26  to  51 , wherein the current flowing between an electrode section of an electronic circuit element and an electrode section of an electronic circuit substrate has a limited value in a range of 0.5 to 10 Amp per the electrode section.  
     
     
         53 . The electronic circuit part according to any one of  claims 26  to  52 , wherein an electronic circuit element is an IC bear chip and a flip chip bonding is formed between the electronic circuit element and an electronic circuit substrate.  
     
     
         54 . The electronic circuit part according to any one of  claims 26  to  53 , wherein an electronic circuit element is a chip size package (CSP), and a ball grid array (BGA) bonding is formed between the electronic circuit element and an electronic circuit substrate.  
     
     
         55 . A manufacturing method of an electronic circuit part for manufacturing the electronic circuit part according to any one of  claims 26  to  54 , 
 which comprises 
 a first step of applying a conductive material comprising either a conductive adhesive or cream solder onto either an electrode section of an electronic circuit element or an electrode section of an electronic circuit substrate;  
 a second step of placing a laminated conductive fine particles on the electrode section to which the conductive material has been applied;  
 a third step of heating the electrode section on which the laminated conductive fine particles have been placed to form electrical connection; and  
 a fourth step of cooling while maintaining the electrical connection to fix the electrical connection.  
 
 
     
     
         56 . A manufacturing method of an electronic circuit part for manufacturing the electronic circuit part according to any one of  claims 26  to  54 , 
 comprising a step in which one conductive fine particle, made by coating with a conductive metal layer around a spherical elastic base particle, is heated and pressed on either of an electrode section of an electronic circuit element or an electrode section of an electronic circuit substrate to be secured thereon so that the conductive metal layer of the conductive fine particle and the electrode section maintains the electrical connection through the conductive material.  
 
     
     
         57 . A manufacturing method of an electronic circuit part for manufacturing the electronic circuit part according to any one of  claims 26  to  54 , comprising 
 a first step of placing a double laminated conductive fine particle on either an electrode section of an electronic circuit element or an electrode section of an electronic circuit substrate;  
 a second step of heating the vicinity of an electrode section on which the double laminated conductive fine particle has been placed to fuse an low-melting-point metal layer of the double laminated conductive fine particle, thereby electrically connecting the conductive metal layer of the double laminated conductive fine particle and the electrode section;  
 a third step of cooling while maintaining the electrical connection to secure the electrical connection;  
 a fourth step of superposing the other electrode section on the double laminated conductive fine particle secured on one of the electrodes; and  
 a fifth step of electrically connecting the other electrode section and the double laminated conductive fine particle secured on the one of the electrodes.  
 
     
     
         58 . A manufacturing method of an electronic circuit part for manufacturing the electronic circuit part according to any one of  claims 26  to  54 , comprising the steps of: 
 upon placing a laminated conductive fine particle or a double laminated conductive fine particle on either an electrode section of an electronic circuit element or an electrode section of an electronic circuit substrate,  
 at a position corresponding to either the electrode section of the electrode circuit element or the electrode section of the electronic circuit substrate, placing the laminated conductive fine particle or the double laminated conductive fine particle in a recess of a mold having recesses smaller than the diameter of the laminated conductive fine particle or the double laminated conductive fine particle; and  
 after adhering liquid has been applied to one portion of the exposed surface of the laminated conductive fine particle or the double laminated conductive fine particle positioned on the mold, allowing the mold to contact either of the electrode section so that the laminated conductive fine particle or the double laminated conductive file particle is transferred on the electrode section.  
 
     
     
         59 . A laminated conductive fine particle or a double laminated conductive fine particle which is used in the electronic circuit part according to any one of  claims 26  to  54 .  
     
     
         60 . An electronic circuit element which is used in the electronic circuit part according to any one of  claims 26  to  54 .  
     
     
         61 . An electronic circuit substrate which is used in the electronic circuit part according to any one of  claims 26  to  54 .