Cooling device for cooling components of the power electronics, said device comprising a micro heat exchanger

Abstract

The present invention relates to a cooling device, in particular for cooling of components of power electronics, using a coolant which flows through a micro heat exchanger ( 10 ) having a good heat contact with the component ( 1 ), and wherein the coolant is selected in such a way that it evaporates in the micro heat exchanger ( 10 ) at the desired component temperature.

What is claimed is:  
     
         1 . A cooling device, in particular for cooling of components of power electronics, using a coolant which flows through a micro heat exchanger which has a good heat contact with the component, 
 wherein the coolant is selected in such a way that it evaporates in the micro heat exchanger at the desired component temperature.    
     
     
         2 . The cooling device as recited in  claim 1 , 
 wherein the micro heat exchanger ( 10 ) is situated opposite the component on the back of a circuit board substrate ( 2 ) which carries the power electronic component ( 1 ) on its front.    
     
     
         3 . The cooling device as recited in  claim 1 , 
 wherein the micro heat exchanger ( 11 ) is situated directly on and above the component ( 1 ).    
     
     
         4 . The cooling device as recited in one of the preceding claims, 
 wherein the dimensions of the micro heat exchanger ( 10 ,  11 ) are adapted to the dimensions of the component ( 1 ).    
     
     
         5 . The cooling device as recited in  claim 1 , 
 wherein the micro heat exchanger ( 12 ) is situated adjacent to component ( 1 ) in a circuit board substrate ( 3 ) carrying the component in such a way that the coolant flows through the substrate ( 3 ) in the substrate plane.    
     
     
         6 . The cooling device as recited in one or several of claims  1  through  5 , 
 wherein the micro heat exchanger ( 10 ,  11 ,  12 ) is subdivided into several sections which are each situated on the back of the circuit board substrate which carries the component on its front and/or directly on and above the component and/or in the circuit board substrate carrying the component.  
 
     
     
         7 . The cooling device as recited in one of claims  1  through  6 , 
 wherein the micro heat exchanger is an element of a coolant circuit.  
 
     
     
         8 . The cooling device as recited in  claim 7 , 
 wherein a condenser for the coolant, which has evaporated in the micro heat exchanger, is connected in series to the micro heat exchanger in the flow direction within the coolant circuit.    
     
     
         9 . The cooling device as recited in  claim 7  or  8 , 
 wherein the return transport of the coolant to the micro heat exchanger takes place actively via a pump which is situated in the coolant circuit.  
 
     
     
         10 . The cooling device as recited in one of the preceding claims, 
 wherein the structure and the positioning of the micro heat exchanger, the coolant, and the system pressure are selected in such a way that a maximum allowed temperature of the component to be cooled is not exceeded.