US2003174553A1PendingUtilityA1

Semiconductor memory device and method of operation thereof

Priority: Aug 3, 1990Filed: Nov 25, 2002Published: Sep 18, 2003
Est. expiryAug 3, 2010(expired)· nominal 20-yr term from priority
G11C 11/22G11C 11/5657G11C 16/08G11C 8/14H10B 53/00H10B 12/30
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Claims

Abstract

A semiconductor memory device has a plurality of memory cells in an array, into which the memory cells data is writable, and which can subsequently be read. Each memory cell has a switching element with one terminal connected to a bit line of the array another terminal connected to at least one ferroelectric capacitor, and a control terminal connected to a word line. The cell may then be operated to detect the change in polarization of the ferroelectric capacitor when a voltage is applied which is not sufficient to cause a change of state of the ferroelectric capacitor. Alternatively, a ferroelectric capacitor and a capacitor other than a ferroelectric capacitor is connected to the switching element. In a further alternative, a plurality of ferroelectric capacitors are connected to the switching element, so that different data are writable into each.

Claims

exact text as granted — not AI-modified
1 . A semiconductor memory device having at least one memory cell, said at least one memory cell including a switching element and a capacitive element connected in series with said switching element, wherein said capacitive element has a ferroelectric body, and the polarization axis of said ferroelectric body is substantially parallel to a predetermined direction of an electric field across said capacitive element, and wherein said capacitive element is provided above said switching element.  
     
     
         2 . A semiconductor memory device having at least one memory cell, said at least one memory cell including a switching element, said switching element having a first electrode, a second electrode and a gate electrode, and a capacitive element connected to said first electrode in series with said switching element, wherein said capacitive element has a ferroelectric body, and the polarization axis of said ferroelectric body is substantially parallel to a predetermined direction of an electric field across said capacitive element, and wherein said ferroelectric body is provided above said first electrode.  
     
     
         3 . A semiconductor memory device according to  claim 1  or  2 , wherein said ferroelectric body is comprised of a plurality of ferroelectric crystals and each of said crystals has a surface parallel to said polarization axis.  
     
     
         4 . A semiconductor device comprising: 
 a substrate,    a connector attached to the substrate, and    a plurality of memories provided on the substrate,    wherein each of the memories includes a semiconductor memory device according to  claim 1  or  2 .    
     
     
         5 . A semiconductor device according to  claim 4 , wherein the semiconductor device is a semiconductor disk.  
     
     
         6 . A semiconductor device according to  claim 4 , wherein the semiconductor device is a semiconductor memory card.  
     
     
         7 . A microprocessor including a cache memory having the semiconductor memory device according to  claim 1  or  claim 2 .  
     
     
         8 . A computer system comprising: 
 a microprocessor,    a memory, and    a system bus to which said microprocessor and said memory are connected,    wherein said microprocessor includes a cache memory having the semiconductor memory device according to  claim 1  or  claim 2 .    
     
     
         9 . A computer system comprising: 
 a microprocessor,    a memory, and    a system bus to which said microprocessor and said memory are connected,    wherein said memory includes the semiconductor memory device according to  claim 1  or  claim 2 .    
     
     
         10 . A computer system comprising: 
 a microprocessor,    a memory connected to said microprocessor, and    an I/O control connected to said microprocessor,    wherein said microprocessor includes a cache memory having the semiconductor memory device according to  claim 1  or  claim 2 .    
     
     
         11 . A computer system comprising: 
 a microprocessor,    a memory connected to said microprocessor, and    an I/C control connected to said microprocessor,    wherein said memory includes the semiconductor memory device according to  claim 1  or  claim 2 .    
     
     
         12 . An engine control apparatus comprising: 
 an I/O control,    a microprocessor connected to said I/O control, and    a memory connected to said I/O control,    wherein an engine is controlled via said I/O control by said microprocessor and said memory, and    wherein said microprocessor includes a cache memory having the semiconductor memory device according to  claim 1  or  claim 2 .    
     
     
         13 . An engine control apparatus comprising: 
 an I/O control,    a microprocessor connected to said I/O control, and    a memory connected to said I/O control,    wherein an engine is controlled via said I/O control by said microprocessor and said memory, and    wherein said memory includes the semiconductor memory device according to  claim 1  or  claim 2 .    
     
     
         14 . An engine control apparatus according to  claim 12 , wherein said engine is installed in any one of a vehicle, an air craft, an artificial satellite, a space station and a rocket.  
     
     
         15 . An engine control apparatus according to  claim 13 , wherein said engine is installed in any one of a vehicle, an air craft, an artificial satellite, a space station and a rocket.  
     
     
         16 . A method of controlling an engine which is coupled to a microprocessor, and I/O control and a memory, wherein said memory includes a switching element and a capacitive element connected in series with said switching element, wherein said capacitive element has a ferroelectric body, and the polarization axis of said ferroelectric body is substantially parallel to a predetermined direction of an electric field across said capacitive element, and wherein said capacitive element is provided above said switching element, said method comprising: 
 controlling said engine by said microprocessor and said memory through said I/O control by detecting a change in polarization of the ferroelectric capacitor when a voltage is applied which is not sufficient to cause a change of state of the ferroelectric capacitor.    
     
     
         17 . A method according to  claim 16 , wherein a plurality of said ferroelectric capacitors are connected to said switching element, said method further comprising: 
 writing different data into different ones of said ferroelectric capacitors.

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