US2003168170A1PendingUtilityA1

Wafer protection apparatus

37
Assignee: BENQ CORPPriority: Mar 7, 2002Filed: Mar 6, 2003Published: Sep 11, 2003
Est. expiryMar 7, 2022(expired)· nominal 20-yr term from priority
Inventors:Wei-Lin ChenHung-Sheng Hu
H10P 72/0416H10P 72/0441
37
PatentIndex Score
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Cited by
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References
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Claims

Abstract

A wafer protection apparatus for holding a wafer in a liquid. The wafer includes a first surface and a second surface opposite the first surface, and the second surface includes a first portion and a second portion. A reaction rate to the liquid of the second portion is faster than that of the first portion. The wafer protection apparatus comprises a first base, a second base, and a first sealing member. The first base holds the wafer in a manner such that the first base is in contact with the first surface of the wafer. The second base is connected with the first base. The first sealing member is disposed on the second base so as to abut the first portion of the second surface of the wafer.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A wafer protection apparatus for holding a wafer in a liquid, wherein the wafer includes a first surface and a second surface opposite the first surface, and the second surface includes a first portion and a second portion, a reaction rate to the liquid of which is faster than that of the first portion, and the wafer protection apparatus comprises: 
 a first base holding the wafer in a manner such that the first base is in contact with the first surface of the wafer;    a second base connected with the first base; and    a first sealing member disposed on the second base so as to abut the first portion of the second surface of the wafer.    
     
     
         2 . The wafer protection apparatus as claimed in  claim 1 , further comprising: 
 a second sealing member disposed between the first base and the second base so as to prevent the liquid from passing between the first base and the second base due to capillarity.    
     
     
         3 . The wafer protection apparatus as claimed in  claim 2 , wherein the second sealing member is of elastic material so as to closely abut the first base and the second base respectively.  
     
     
         4 . The wafer protection apparatus as claimed in  claim 3 , wherein the second sealing member is an O-ring.  
     
     
         5 . The wafer protection apparatus as claimed in  claim 1 , wherein the first sealing member is of elastic material so as to closely abut the second base and the wafer respectively.  
     
     
         6 . The wafer protection apparatus as claimed in  claim 5 , wherein the first sealing member is an O-ring.  
     
     
         7 . The wafer protection apparatus as claimed in  claim 1 , wherein the second base includes a groove for the first sealing member to be disposed therein.  
     
     
         8 . The wafer protection apparatus as claimed in  claim 7 , wherein the first sealing member is disposed in the groove in a close fit manner.  
     
     
         9 . The wafer protection apparatus as claimed in  claim 1 , wherein the first base includes a step portion in a manner such that the first surface of the wafer faces the step portion to form a space therebetween.  
     
     
         10 . The wafer protection apparatus as claimed in  claim 1 , further comprising: 
 a fixed member connecting the first base and the second base so that the second base is closely adjacent to the first sealing member.    
     
     
         11 . The wafer protection apparatus as claimed in  claim 10 , wherein the fixed member is a bolt.  
     
     
         12 . A wafer protection apparatus for holding a wafer in an etchant, wherein the wafer includes a first surface and a second surface opposite the first surface, and the second surface includes a first portion and a second portion, an etching rate to the etchant of which is faster than that of the first portion, and the wafer protection apparatus comprises: 
 a first base holding the wafer in a manner such that the first base is in contact with the first surface of the wafer;    a second base connected with the first base; and    a first sealing member disposed on the second base so as to abut the first portion of the second surface of the wafer.    
     
     
         13 . The wafer protection apparatus as claimed in  claim 12 , further comprising: 
 a second sealing member disposed between the first base and the second base so as to prevent the etchant from passing between the first base and the second base due to capillarity.    
     
     
         14 . The wafer protection apparatus as claimed in  claim 13 , wherein the second sealing member is of elastic material so as to closely abut the first base and the second base respectively.  
     
     
         15 . The wafer protection apparatus as claimed in  claim 14 , wherein the second sealing member is an O-ring.  
     
     
         16 . The wafer protection apparatus as claimed in  claim 12 , wherein the first sealing member is of elastic material so as to closely abut the second base and the wafer respectively.  
     
     
         17 . The wafer protection apparatus as claimed in  claim 16 , wherein the first sealing member is an O-ring.  
     
     
         18 . The wafer protection apparatus as claimed in  claim 12 , wherein the second base includes a groove for the first sealing member to be disposed therein.  
     
     
         19 . The wafer protection apparatus as claimed in claim  18 , wherein the first sealing member is disposed in the groove in a close fit manner.  
     
     
         20 . The wafer protection apparatus as claimed in  claim 12 , wherein the first base includes a step portion in a manner such that the first surface of the wafer faces the step portion to form a space therebetween.  
     
     
         21 . The wafer protection apparatus as claimed in  claim 12 , further comprising: 
 a fixed member connecting the first base and the second base so that the second base is closely adjacent to the first sealing member.    
     
     
         22 . The wafer protection apparatus as claimed in  claim 21 , wherein the fixed member is a bolt.  
     
     
         23 . A wafer protection apparatus for holding a wafer in an electroplating liquid, wherein the wafer includes a first surface and a second surface opposite the first surface, and the second surface includes a first portion and a second portion, a reaction rate to the electroplating liquid of which is faster than that of the first portion, and the wafer protection apparatus comprises: 
 a first base holding the wafer in a manner such that the first base is in contact with the first surface of the wafer;    a second base connected with the first base; and    a first sealing member disposed on the second base so as to abut the first portion of the second surface of the wafer.    
     
     
         24 . The wafer protection apparatus as claimed in  claim 23 , further comprising: 
 a second sealing member disposed between the first base and the second base so as to prevent the electroplating liquid from passing between the first base and the second base due to capillarity.    
     
     
         25 . The wafer protection apparatus as claimed in  claim 24 , wherein the second sealing member is of elastic material so as to closely abut the first base and the second base respectively.  
     
     
         26 . The wafer protection apparatus as claimed in  claim 25 , wherein the second sealing member is an O-ring.  
     
     
         27 . The wafer protection apparatus as claimed in  claim 23 , wherein the first sealing member is of elastic material so as to closely abut the second base and the wafer respectively.  
     
     
         28 . The wafer protection apparatus as claimed in  claim 27 , wherein the first sealing member is an O-ring.  
     
     
         29 . The wafer protection apparatus as claimed in  claim 23 , wherein the second base includes a groove for the first sealing member to be disposed therein.  
     
     
         30 . The wafer protection apparatus as claimed in  claim 29 , wherein the first sealing member is disposed in the groove in a close fit manner.  
     
     
         31 . The wafer protection apparatus as claimed in  claim 23 , wherein the first base includes a step portion in a manner such that the first surface of the wafer faces the step portion to form a space therebetween.  
     
     
         32 . The wafer protection apparatus as claimed in  claim 23 , further comprising: 
 a fixed member connecting the first base and the second base so that the second base is closely adjacent to the first sealing member.    
     
     
         33 . The wafer protection apparatus as claimed in  claim 32 , wherein the fixed member is a bolt.

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