Method of film laminating

Abstract

A method of film laminating which comprises superposing an adhesive film comprising a base film and a resin composition layer on a circuit board so that the resin composition layer is in contact with at least the pattern-bearing part thereof, pressing the adhesive film against the circuit board with a laminating apparatus having a press plate made of a heat-resistant rubber, and then pressing the resultant structure with a laminating apparatus having a press plate made of a metal; and the method of film laminating in which the adhesive film comprising a base film and formed thereon a resin composition layer having a melt viscosity at 120 ° C. of 10,000 to 100,000 Pa s is superposed on the circuit board so that the resin composition layer overlies at least the circuit pattern part thereof, and the adhesive film is laminated to the circuit board with a press plate and an underlay plate which has a modulus at 120 ° C. of 1 to 500 MPa and is disposed between the press plate and the base film of the adhesive film. Thus, a multilayer circuit board is obtained which is excellent in buried-layer state and surface smoothness.

1 . A method of laminating a film comprising: 
 superposing an adhesive film A which includes a base film and a resin composition layer A formed on the surface of the base film on a circuit board so that the resin composition layer A is in contact with at least a pattern of the circuit board,    pressing the adhesive film A against the circuit board by using a laminating apparatus including at least one operable pressing plate which is made of heat-resistant rubber and is capable of applying heat and pressure, and    pressing the adhesive film A against the circuit board by using a laminating apparatus including at least one operable pressing plate which is made of a metal and is capable of applying heat and pressure.    
     
     
         2 . A method of laminating a film comprising: 
 superposing an adhesive film A which includes a base film and a resin composition layer A formed on the surface of the base film on a circuit board so that the resin composition layer A is in contact with at least a pattern of the circuit board,    pressing the adhesive film A against the circuit board by using a laminating apparatus including at least one operable pressing plate which is made of heat-resistant rubber and is capable of applying heat and pressure,    removing the base film from the adhesive film A, superposing an adhesive film B which includes a base film and a resin composition layer B formed on the surface of the base film on the adhesive film A so that the resin composition layer B is in contact with the resin composition layer A, and    pressing the adhesive film B against the resin composition layer A by using a laminating apparatus including at least one operable pressing plate which is made of a metal and is capable of applying heat and pressure.    
     
     
         3 . The method of laminating a film according to  claim 1  or  2 , 
 wherein the pressing using the laminating apparatus including the pressing plate made of heat-resistant rubber is performed at a temperature of 70-150° C. and a pressure of 0.05-0.9 MPa, and  
 the pressing using the laminating apparatus including the pressing plate made of a metal is performed at a temperature of 70-170° C. and a pressure of 0.1-5 MPa.  
 
     
     
         4 . The method of laminating a film according to any one of  claims 1  to  3 , wherein the resin composition layer of the adhesive film A or B is in a B stage state.  
     
     
         5 . A method of laminating a film in a vacuum lamination method of an adhesive film in which a resin composition layer of an adhesive film including a base film and a resin composition layer having a melt viscosity at 120° C. of 10,000 to 100,000 Pa·s laminated on the base film is laminated on at least a circuit pattern of a circuit board under vacuum by using a vacuum laminating apparatus including at least one operable pressing plate capable of applying heat and pressure, the method comprising: 
 installing an underlay plate having a modulus of elasticity at 120° C. of 1-500 MPa between the pressing plate and the upper side of the base film of the adhesive film when laminating the resin composition layer of the adhesive film on at least the circuit pattern of the circuit board.  
 
     
     
         6 . The method of laminating a film according to  claim 5 , wherein the resin composition layer of the adhesive film is in a B stage state.