Multilayer wiring board, manufacturing method therefor and test apparatus thereof

Abstract

A built-in component type multilayer wiring board includes at least one resin layer and at least one frame resin layer. The resin layer includes electronic components buried therein. The frame resin layer includes at least one of glass cloth, filler and nonwoven fabric. The frame resin layer includes no electronic component.

What is claimed is:  
     
         1 . A multilayer wiring board, comprising: 
 a resin layer including electronic components buried therein; and    a frame resin layer including at least one of glass cloth, filler and nonwoven fabric, said frame resin layer including no electronic component therein.    
     
     
         2 . The multilayer wiring board as claimed in  claim 1 , wherein the resin layer includes at least one of filler and nonwoven fabric.  
     
     
         3 . The multilayer wiring board as claimed in  claim 1 , wherein the frame resin layer includes glass cloth as a frame and a resin surrounding said glass cloth is completely cured.  
     
     
         4 . The multilayer wiring board as claimed in  claim 1 , wherein: 
 the resin layer is completely cured with fragments of said one of filler and nonwoven fabric included in a resin; and    the frame resin layer is completely cured with fragments of said at least one of glass cloth, filler and nonwoven fabric included in a resin.    
     
     
         5 . A manufacturing method of a multilayer wiring board, comprising: 
 a first step of mounting an electronic component on a frame resin layer including at least one of glass cloth, filler and nonwoven fabric, said frame resin layer including no electronic component therein; and    a second step of forming a resin layer by placing a semi-cured resin sheet on said frame resin layer so as to contact the mounted electronic component, and completely curing said semi-cured resin sheet with the electronic component buried therein.    
     
     
         6 . The manufacturing method as claimed in  claim 5 , wherein the semi-cured resin sheet includes fragments of at least one of filler and nonwoven fabric.  
     
     
         7 . A test apparatus used for evaluating a multilayer wiring board formed by successively stacking layers, comprising: 
 a probe part configured to be connected to an incomplete multilayer wiring board that is in a half finished state before completion; and    a supplementary part supplementing an element of the multilayer wiring board, said incomplete multilayer wiring board lacking said element.    
     
     
         8 . The test apparatus as claimed in  claim 7 , wherein the supplementary part includes layer wiring of the multilayer wiring board, said incomplete multilayer wiring board lacking said layer wiring.  
     
     
         9 . A manufacturing method of a multilayer wiring board, wherein: 
 said multilayer wiring board is manufactured as successively testing an incomplete multilayer wiring board using a test apparatus used for evaluating the multilayer wiring board; and    said test apparatus comprises: 
 a probe part configured to be connected to said incomplete multilayer wiring board in a half finished state before completion; and  
 a supplementary part supplementing an element of the multilayer wiring board, said incomplete multilayer wiring board lacking said element.  
   
     
     
         10 . The manufacturing method as claimed in  claim 9 , wherein the supplementary part includes layer wiring of the multilayer wiring board, said incomplete multilayer wiring board lacking said layer wiring.