US2003156360A1PendingUtilityA1
Magnetoresistance effect device, magnetoresistance head and method for producing magnetoresistance effect device
Priority: Sep 29, 1997Filed: Mar 11, 2003Published: Aug 21, 2003
Est. expirySep 29, 2017(expired)· nominal 20-yr term from priority
G11B 5/3903H10N 50/85B82Y 25/00G11B 2005/3996H01F 10/3268G11B 5/3932B82Y 10/00G11B 5/3967G11B 5/3929H01F 41/303G01R 33/093H01F 10/3272G11B 5/3909G11B 5/3163
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Claims
Abstract
A magnetoresistance effect device of the present invention includes a multilayer film. The multilayer film includes an antiferromagnetic film, a first ferromagnetic film, a non-magnetic film and a second ferromagnetic film, which are provided in this order on a non-magnetic substrate directly or via an underlying layer. The antiferromagnetic film comprises an α-Fe 2 O 3 film. A surface roughness of the multilayer film is about 0.5 nm or less.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A magnetoresistance effect device, comprising a multilayer film, the multilayer film comprising an antiferromagnetic film, a first ferromagnetic film, a non-magnetic film and a second ferromagnetic film, which are provided in this order on a non-magnetic substrate directly or via an underlying layer, wherein:
the antiferromagnetic film comprises an α-Fe 2 O 3 film; and a surface roughness of the multilayer film is about 0.5 nm or less.
2 . A magnetoresistance effect device according to claim 1 , wherein the first ferromagnetic film comprises a Co 1−x Fe x alloy film (0<x≦0.5, where x denotes an atomic composition ratio).
3 . A magnetoresistance effect device according to claim 1 , wherein the first ferromagnetic film is formed by providing a Co 1−x Fe x alloy layer (0<x≦0.5, where x denotes an atomic composition ratio) on an Ni—Fe alloy layer or an Ni—Fe—Co alloy layer.
4 . A magnetoresistance effect device according to claim 1 , wherein a main component of the underlying layer is Pt or Au.
5 . A magnetoresistance effect device according to claim 1 , wherein a thickness of the α-Fe 2 O 3 film is in a range between about 5 nm and about 40 nm.
6 . A magnetoresistance effect device according to claim 1 , wherein an easy axis of the second ferromagnetic film is arranged so as to be substantially perpendicular to a direction of a signal magnetic field to be detected.
7 . A magnetoresistance effect device, comprising a multilayer film, the multilayer film comprising an antiferromagnetic film, a first ferromagnetic film, a non-magnetic film and a second ferromagnetic film, which are provided in this order on a non-magnetic substrate directly or via an underlying layer, wherein:
the antiferromagnetic film comprises a layered structure including an α-Fe 2 O 3 film and a second anti-ferromagnetic film.
8 . A magnetoresistance effect device according to claim 7 , wherein the second antiferromagnetic film comprises an NiO film or a CoO film.
9 . A magnetoresistance effect device according to claim 7 , wherein the second antiferromagnetic film is overlying the α-Fe 2 O 3 film.
10 . A magnetoresistance effect device according to claim 7 , wherein the α-Fe 2 O 3 film is overlying the NiO film.
11 . A magnetoresistance effect device according to claim 7 , wherein an easy axis of the second ferromagnetic film is arranged so as to be substantially perpendicular to a direction of a signal magnetic field to be detected.
12 . A magnetoresistance effect device, comprising a multilayer film, the multilayer film comprising an antiferromagnetic film, a first ferromagnetic film, a non-magnetic film and a second ferromagnetic film, which are provided in this order on a non-magnetic substrate directly or via an underlying layer, wherein:
the antiferromagnetic film comprises an α-Fe 2 O 3 film; and a thickness of the α-Fe 2 O 3 film is in a range between about 5 nm and about 40 nm.
13 . A magnetoresistance effect device according to claim 12 , wherein an easy axis of the second ferromagnetic film is arranged so as to be substantially perpendicular to a direction of a signal magnetic field to be detected.
14 . A magnetoresistance effect device, comprising a multilayer film, the multilayer film comprising a first antiferromagnetic film, a first ferromagnetic film, a first non-magnetic film, a second ferromagnetic film, a second non-magnetic film, a third ferromagnetic film and a second antiferromagnetic film, which are provided in this order on a non-magnetic substrate directly or via an underlying layer, wherein:
the first antiferromagnetic film comprises an α-Fe 2 O 3 film; and a surface roughness of the multilayer film is about 0.5 nm or less.
15 . A magnetoresistance effect device according to claim 14 , wherein an easy axis of the second ferromagnetic film is arranged so as to be substantially perpendicular to a direction of a signal magnetic field to be detected.
16 . A magnetoresistance effect device, comprising a multilayer film, the multilayer film comprising a first antiferromagnetic film, a first ferromagnetic film, a first non-magnetic film, a second ferromagnetic film, a second non-magnetic film, a third ferromagnetic film and a second antiferromagnetic film, which are provided in this order on a non-magnetic substrate directly or via an underlying layer, wherein:
the first antiferromagnetic film comprises a layered structure including an α-Fe 2 O 3 film and a third antiferromagnetic film.
17 . A magnetoresistance effect device according to claim 16 , wherein the second antiferromagnetic comprises an Ir—Mn film.
18 . A magnetoresistance effect device according to claim 17 , wherein an easy axis of the second ferromagnetic film is arranged so as to be substantially perpendicular to a direction of a signal magnetic field to be detected.
19 . A magnetoresistance effect device according to claim 16 , wherein at least one of the first ferromagnetic film and the third ferromagnetic film comprises an indirect exchange coupling film.
20 . A magnetoresistance head, comprising:
a magnetoresistance effect device according to claim 6; and a shield gap section for insulating the magnetoresistance effect device from a shield section.
21 . A magnetoresistance head, comprising:
a magnetoresistance effect device according to claim 11; and a shield gap section for insulating the magnetoresistance effect device from a shield section.
22 . A magnetoresistance head, comprising:
a magnetoresistance effect device according to claim 13; and a shield gap section for insulating the magnetoresistance effect device from a shield section.
23 . A magnetoresistance head, comprising:
a magnetoresistance effect device according to claim 15; and a shield gap section for insulating the magnetoresistance effect device from a shield section.
24 . A magnetoresistance head, comprising:
a magnetoresistance effect device according to claim 18; and a shield gap section for insulating the magnetoresistance effect device from a shield section.
25 . A method for producing a magnetoresistance effect device, the device comprising a multilayer film, the multilayer film comprising an antiferromagnetic film, a first ferromagnetic film, a non-magnetic film and a second ferromagnetic film, which are provided in this order on a non-magnetic substrate directly or via an underlying layer, the method comprising:
a first step of forming the antiferromagnetic film having a thickness in a range between about 5 nm and about 40 nm on the non-magnetic substrate directly or via the underlying layer; and a second step of depositing, on the antiferromagnetic film, the first ferromagnetic film, the non-magnetic film and the second ferromagnetic film in this order so that a surface roughness of the multilayer film is about 0.5 nm or less, wherein the first step comprises a step of sputtering a target whose main component is α-Fe 2 O 3 .
26 . A method for producing a magnetoresistance effect device, the device comprising a multilayer film, the multilayer film comprising a first antiferromagnetic film, a first ferromagnetic film, a first non-magnetic film, a second ferromagnetic film, a second non-magnetic film, a third ferromagnetic film and a second antiferromagnetic film, which are provided in this order on a non-magnetic substrate directly or via an underlying layer, the method comprising:
a first step of forming the first antiferromagnetic film on the non-magnetic substrate directly or via the underlying layer; a second step of depositing, on the antiferromagnetic film, the first ferromagnetic film, the first nonmagnetic film, the second ferromagnetic film, the second non-magnetic film, the third ferromagnetic film and the second antiferromagnetic film in this order so that a surface roughness of the multilayer film is about 0.5 nm or less, wherein the first step comprises a step of sputtering a target whose main component is α-Fe 2 O 3 .Join the waitlist — get patent alerts
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