Packaging of low application hot melt adhesive formulations

Abstract

Films having a melting point below about 100° C. are used to package low temperature hot melt adhesives. The packaging film does not require removal prior to use of the adhesive. The packaged adhesive is easy to handle and units are non-blocking.

1 . A packaged low temperature hot melt adhesive comprising a low temperature hot melt adhesive encased in a thermoplastic film having a melting point below about 100° C.  
     
     
         2 . The packaged adhesive of  claim 1  wherein the film has a melting point below about 90° C.  
     
     
         3 . The packaged adhesive of  claim 1  wherein the film comprises a copolymer of ethylene or propylene with another comonomer.  
     
     
         4 . The packaged adhesive of  claim 3  wherein the film comprises a copolymer of ethylene with from about 10 to about 45% methyl acrylate, n-butyl acrylate or vinyl acetate comonomers.  
     
     
         5 . The packaged adhesive of  claim 4  wherein the film comprises ethylene methyl acrylate.  
     
     
         6 . The packaged adhesive of  claim 4  wherein the film comprises ethylene vinyl acetate.  
     
     
         7 . The packaged adhesive of  claim 5  wherein the film comprises more that 10% methyl acrylate comonomer.  
     
     
         8 . The packaged adhesive of  claim 6  wherein the film comprises more than about 10% of vinyl acetate comonomer.  
     
     
         9 . The packaged adhesive of  claim 3  wherein the film further comprises an antiblocking agent.  
     
     
         10 . A method of packaging a low temperature hot melt adhesive comprising wrapping a low temperature hot melt adhesive in a thermoplastic film having a melting point below about 100° C.  
     
     
         11 . The method of  claim 10  wherein the film has a melting point below about 90° C.  
     
     
         12 . The method of  claim 10  wherein the adhesive is wrapped in the molten state.  
     
     
         13 . The method of  claim 12  wherein the molten hot melt adhesive is pumped or poured into a cylindrical plastic film having a melting point of below about 100° C., the cylindrical tube being in direct contact with a heat sink, the molten hot melt adhesive filled cylinder is sealed and allowed to cool.  
     
     
         14 . The method of  claim 11  wherein the film comprises a copolymer of ethylene or propylene with another comonomer.  
     
     
         15 . The method of  claim 14  wherein the film comprises a copolymer of ethylene with from about 10 to about 45% methyl acrylate, n-butyl acrylate or vinyl acetate comonomers.  
     
     
         16 . The method of  claim 15  wherein the film comprises ethylene methyl acrylate.  
     
     
         17 . The method of  claim 15  wherein the film comprises ethylene vinyl acetate comonomer.  
     
     
         18 . The method  claim 17  wherein the film comprises more that 10% methyl acrylate comonomer.  
     
     
         19 . The method of  claim 17  wherein the film comprises more than about 10% of vinyl acetate comonomes.  
     
     
         20 . The method of  claim 14  wherein the film further comprises an antiblocking agent.