Electrochemical nanostructuring method and device

Abstract

The present invention relates to a method for producing surface-structured substrates, wherein a predetermined defined surface structuring is transferred to the surface of a substrate by activating the substrate surface using at least one fine probe that interacts with the substrate surface, and material of a liquid, solid, or molten salt electrolyte is electrochemically deposited in a selective manner on the regions of the substrate surface that are activated thereby. The invention also relates to a device for surface structuring of substrates.

1 . Method for producing surface-structured substrates, wherein a predetermined defined surface structuring is transferred to the surface of a substrate by activating the substrate surface using at least one fine probe that interacts with the substrate surface, and material of a liquid, solid, or molten salt electrolyte is electrochemically deposited in a selective manner on the regions of the substrate surface which are thus activated.  
     
     
         2 . Method according to  claim 1 , characterized in that the tip of a scanning probe microscope is used as a probe.  
     
     
         3 . Method according to  claim 1  or  2 , characterized in that the tip of a scanning force microscope, a scanning tunnel microscope, an optical near-field microscope, a scanning ion conductivity microscope, or a scanning electrochemical microscope is used as a probe.  
     
     
         4 . Method according to one of claims  1  through  3 , characterized in that the selective deposition is carried out by applying a voltage between the substrate surface and another electrode, without applying a voltage to the probe used for the activation.  
     
     
         5 . Method according to one of claims  1  through  3 , characterized in that the selective deposition is carried out by applying a voltage between the substrate surface and another electrode, and by also applying a voltage to the probe used for the activation.  
     
     
         6 . Method according to one of claims  1  through  3 , characterized in that the selective deposition is carried out by applying a voltage between the substrate surface and the probe used for the activation.  
     
     
         7 . Method according to one of claims  1  through  3 , characterized in that the selective deposition is carried out by electroless deposition.  
     
     
         8 . Method according to one of claims  1  through  7 , characterized in that lateral forces between the probe and the substrate surface are used for the activation.  
     
     
         9 . Method according to one of claims  1  through  7 , characterized in that normal forces between the probe and the substrate surface are used for the activation.  
     
     
         10 . Method according to one of claims  1  through  7 , characterized in that the activation is carried out by creating atomic or microscopic defects in the range of 0.1 nm to 100 nm on the substrate surface.  
     
     
         11 . Method according to one of claims  1  through  7 , characterized in that the substrate surface is covered by an organic or inorganic adsorbate layer, a self-assembled monolayer, a polymer film, or an inorganic or organic film, and the activation of the substrate surface is carried out by localized impairment or removal of this film or layer, or by creating defects in this film or layer.  
     
     
         12 . Method according to one of claims  1  through  11 , characterized in that the activation is carried out continuously or discontinuously during the electrochemical deposition.  
     
     
         13 . Method according to one of claims  1  through  11 , characterized in that first the activation is carried out continuously or discontinuously, and then electrochemical deposition is carried out by applying a voltage.  
     
     
         14 . Method according to one of claims  1  through  11 , characterized in that the deposition is carried out during as well as after the activation.  
     
     
         15 . Method according to one of claims  1  through  14 , characterized in that an arrangement of two or more probes is used.  
     
     
         16 . Method according to one of claims  1  through  15 , characterized in that first a predetermined defined structure is deposited on the substrate surface by applying a deposition voltage with simultaneous activation by the probe, and after the predetermined structure has been deposited the applied electrochemical voltage is set at a holding voltage and the substrate surface is allowed to passivate, followed by the creation of a subsequent structure in the same manner, resulting in sequential deposition of different structures.  
     
     
         17 . Method according to one of claims  1  through  16 , characterized in that solutions of copper salts, lead salts, silver salts, or gold salts are used as electrolyte.  
     
     
         18 . Method according to one of claims  1  through  17 , characterized in that the substrate is chosen from a monocrystalline or polycrystalline metal, or metal films or metal island films or alloys thereof that are vapor-deposited or produced by sputtering, or graphite, ITO, semiconductors, or electrically conductive polymers.  
     
     
         19 . Device for surface structuring of substrates, comprising at least one fine probe which interacts with the substrate surface and which transfers a predetermined defined surface structuring to the surface of a substrate by activating the substrate surface, and 
 at least one electrolyte supply which furnishes a liquid, solid, or molten salt electrolyte for the electrochemical deposition of material in a selective manner on the regions of the substrate surface activated by the probe,    a device for computerized tracing of a preprogrammed contour line,    and a device which simultaneously controls a superimposed periodic or nonperiodic lateral movement of the probe.