Chip clamshell packaging
Abstract
A protective plastic package for storage, transportation and display of electronic components, particularly integrated circuits. The package has a top and bottom cover, is slightly larger than the electronic component, and centers the electronic component within it to prevent damage. The package is also has anti-static properties to prevent static electricity damage. The electronic component is retained within the package when open, and may be ejected from the package without touching the electronic component. The protective plastic package may also be used within larger display packaging to provide an added level of protection against damage and theft. If individualized identification tags are placed on individual items within transparent display packaging, they can be individually read without opening the package or placing corresponding tags on the package exterior.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A plastic protective package for an individual electronic component, comprising
an upper cover; and a lower cover, the lower cover adapted to fit an electronic component, the upper cover adapted to mate with the lower cover and simultaneously fit the electronic component, the upper cover and lower cover being slightly larger than the electronic component and having a substantially rigid structure to prevent crushing, and the upper cover and lower cover having anti-static properties.
2 . The protective package of claim 1 , wherein the electronic component is an integrated circuit with a top planar surface, a bottom planar surface, and an outer perimeter of the planar surface, with terminal pins on the bottom planar surface and an absence of pins in the center portion of that bottom planar surface, with the lower cover having
a raised annulus on which the center portion of the bottom planar surface rests; a pin protection plane distal to the raised annulus, said pin protection plane positioned some distance from the terminal pins; and a containment wall distal to the pin protection plane, said containment wall providing contact points that contact the outer perimeter of the integrated circuit's planar surface; a bottom outer portion distal to the containment wall; and a raised perimeter wall distal to the bottom outer portion.
3 . The protective package of claim 2 , wherein the lower cover further comprises:
at least one detent on the containment wall to retain the integrated circuit in the lower cover.
4 . The protective package of claim 3 , further comprising a bottom center portion inside the raised annulus of the lower cover, said bottom center portion being substantially planar and approximately the same elevation as the pin protection plane, wherein the bottom center portion can be pushed to cause the raised annulus to exert force on the center portion of the bottom planar surface of the integrated circuit, sufficient to push the integrated circuit past the at least one detent on the containment wall.
5 . The protective package of claim 2 , with the upper cover having
a top center portion positioned some distance above the top planar surface of the integrated circuit; a recessed annulus distal to the top center portion, said recessed annulus adapted to contact the top planar surface of the integrated circuit; a top outer portion distal to the recessed annulus, said top outer portion adapted to contact the bottom outer portion when the upper cover and lower cover are mated; and a recessed perimeter wall distal to the top outer portion, said recessed perimeter wall adapted to contact the raised perimeter wall when the upper cover and lower cover are mated.
6 . The protective package of claim 5 , further comprising
a lower joining plane distal to the raised perimeter wall of the lower cover; an upper joining plane distal to the recessed perimeter wall of the upper cover; wherein the lower joining plane and upper joining plane are adapted to contact each other when the top cover and lower cover are mated.
7 . The protective package of claim 5 , further comprising
a hinge connecting the upper cover and lower cover.
8 . The protective package of claim 5 , wherein the upper cover and lower cover are adapted to remain mated in the closed position without sealing.
9 . The protective package of claim 8 , wherein the upper and lower cover remain mated when in the closed position due to a friction fit between the raised perimeter wall of the lower cover and the recessed perimeter wall of the upper cover.
10 . A method of removing an electronic component restrained in a plastic protective package by detents, comprising
using a plastic protective package with an annulus that is in contact with the electronic component, and the annulus is raised relative to connected substantially planar surfaces on either side of the annulus, pushing on the substantially planar surfaces, causing the annulus to push against the electronic component and force the electronic component past the detents.
11 . An ejection structure in a protective package for an electronic component that is held in place by restraints in the protective package, comprising
a button top that is located some distance from the electronic component, a button bottom that is located close to the electronic component, where the button top is connected with the button bottom, and placing pressure on the button top will in turn cause the button bottom to exert force on the electronic component sufficient to force the electronic component out of the restraints.
12 . The ejection structure of claim 11 , wherein the button bottom is shaped to spread the force exerted on the electronic component over a wide area.
13 . The ejection structure of claim 11 , wherein the button top is shaped to define a protective space between it and the electronic component, and so that the button top never contacts the electronic component before or during ejection of the electronic component.
14 . The ejection structure of claim 11 , wherein the button bottom is a raised annulus and the button top is a bottom center portion of the protective package.
15 . A display package for displaying at least one electronic component, comprising
a front member with a substantially planar portion; a rear member with a substantially planar portion and adapted to mate with the front member; and a chip clamshell, wherein the front member and rear member are adapted to closely fit around the chip clamshell.
16 . The display package of claim 15 , wherein the first front member and first rear member are sealed to prevent easy removal of the chip clamshell.
17 . The display package of claim 15 , wherein the front member and rear member are adapted to closely fit at least one additional item of retail merchandise.
18 . A display package for displaying at least one electronic component, comprising
a front member with a substantially planar portion; a rear member with a substantially planar portion and adapted to mate with the front member; a middle member adapted to fit securely within the first members; a chip clamshell, wherein the middle member is adapted to closely fit the chip clamshell, and the front member and rear member are adapted to securely hold the chip clamshell and the middle member.
19 . The display package of claim 18 , wherein the front member and rear member are sealed to prevent easy removal of the chip clamshell.
20 . The display package of claim 18 , wherein the middle member and rear member are adapted to closely fit at least one additional item of retail merchandise.
21 . The display package of claim 18 , further comprising a product insert card between the front member and the middle member.
22 . The display package of claim 18 , further comprising a product insert card between the rear member and the middle member.
23 . A method of tracking an individual item within display packaging comprising
placing an optically readable tag on the individual item; placing the individual item within display packaging that contains a transparent portion so that the optically readable tag is visible; reading the optically readable tag with optical tag reading equipment.
24 . The method of claim 23 , wherein the optically readable tag contains a variety of information related to the individual item, including a serial number.
25 . The method of claim 23 , further comprising
placing an individualized optically readable tag on at least one additional merchandise item; placing the at least one additional merchandise item in the display packaging that contains a transparent portion so that the optically readable tag on the at least one additional merchandise item is visible; and using the optical tag reading equipment to individually read the optically readable tags on the individual item and the at least one additional merchandise item.Join the waitlist — get patent alerts
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