Thermal transfer interface system and methods

Abstract

The invention provides a thermal transfer interface for dissipating heat from an object to a thermal spreader and/or heat sink. The spreader forms a plurality of passageways. A spring element couples with the spreader. A plurality of thermally conductive pins moves along the passageways, extending outwardly via the spring element for conformal and thermal contact with the object. Thermal energy transfers from the object to the spreader through the collective area defining the interface between the pins and the spreader. The spring element is preferably thermally conductive; and thermal grease added to the interface may beneficially decrease thermal resistances due to microscopic unevenness at the contact between the object and the pins and/or spring element. An additional heat sink may couple to the spreader to dissipate additional thermal energy.

What is claimed is:  
     
         1 . A thermal transfer interface, comprising: 
 a thermal spreader forming a plurality of passageways;    a spring element coupled with the spreader; and    a plurality of thermally conductive pins for the passageways, each of the pins having a head and a shaft moving with the spring element, at least part of the shaft being internal to the passageway and forming a gap with an internal surface of the passageway, wherein the pin heads collectively and macroscopically conform to an object coupled thereto to transfer heat from the object to the spreader through the passageway gap formed between the spreader and each of the plurality of pins.    
     
     
         2 . An interface of  claim 1 , the spring element forming a layer with a substantially planar face, each of the pin heads protruding from the face in a direction away from the spreader.  
     
     
         3 . An interface of  claim 1 , the spring element forming a layer with a substantially planar face, each of the pin heads being substantially flush with the face.  
     
     
         4 . An interface of  claim 1 , the spring element forming a layer with a substantially planar face, each of the pin heads recessed within the spring element.  
     
     
         5 . An interface of  claim 1 , each of the pin shafts being substantially cylindrical, each of the passageways being substantially perpendicular to a planar surface of the spring element and being substantially cylindrical to accommodate motion of the shafts therethrough.  
     
     
         6 . An interface of  claim 1 , each of the pin shafts being substantially rectangular, each of the passageways being substantially perpendicular to a planar surface of the spring element and being substantially rectangular to accommodate motion of the shafts therethrough.  
     
     
         7 . An interface of  claim 1 , the object comprising one or more semiconductor packages and dies.  
     
     
         8 . An interface of  claim 1 , further comprising a heat sink coupled with the spreader to dissipate heat generated from the object and traveling through the pins and spreader.  
     
     
         9 . An interface of  claim 1 , the spring element comprising a thermally conductive sponge-like material.  
     
     
         10 . An interface of  claim 1 , one or both of the pins and the spreader forming a heat sink.  
     
     
         11 . An interface of  claim 1 , the spring element formed of non-conductive material and forming one or more apertures for thermal energy transfer between the object and the pin heads.  
     
     
         12 . An interface of  claim 1 , the spreader comprising a ventilated metal block.  
     
     
         13 . An interface of  claim 1 , the spring element comprising a plurality of springs disposed with the passageways for biasing the pins outwardly from the spreader towards the object.  
     
     
         14 . An interface of  claim 1 , the spring element comprising a plurality of springs disposed between the pin heads and the spreader for biasing the pins outwardly from the spreader towards the object.  
     
     
         15 . An interface of  claim 13  or  14 , each of the pins forming a shoulder, and further comprising a retaining element for abutting the shoulder in defining a maximal extension of pins.  
     
     
         16 . A thermal transfer interface, comprising: a plurality of thermally conductive pins for macroscopically conforming to a surface of an object, each of the pins having a pin head and shaft, the pin heads substantially and macroscopically conforming with uneven surfaces of an object so as to transfer heat from the object, through the pins to a heat sink.  
     
     
         17 . A method for transferring thermal energy from a body to a heat sink, comprising the steps of: biasing a plurality of pins against a surface of the object so that the plurality of pins contact with, and substantially conform to, a macroscopic surface of the object, and communicating thermal energy from the object through the pins to a thermal spreader forming a plurality of air gaps with the plurality of pins.  
     
     
         18 . A method of  claim 17 , the step of biasing comprising biasing the plurality of pins arranged substantially perpendicular to the surface.  
     
     
         19 . A method of  claim 17 , the step of biasing comprising biasing a plurality of pin heads against the object, the step of biasing further comprising utilizing a thermally conductive sponge material coupled between the spreader and the pin heads.  
     
     
         20 . A method of  claim 17 , the step of biasing comprising biasing a plurality of pin heads against the object utilizing a plurality of springs.