Voltage reference circuit layout inside multi-layered substrate
Abstract
A multi-layered substrate having a voltage reference signal circuit layout therein. A major change in the design of the multi-layered substrate is the moving of a voltage reference signal trace from a signal layer to a non-signaling layer. Once the voltage reference signal trace is moved, the signal traces within the signal layer can have a larger layout area. Similarly, the voltage reference signal trace within the non-signaling layer can have greater layout flexibility in addition to electromagnetic shielding from other signal traces. Moreover, the voltage reference signal trace having a greater width may be used to reduce parasitic resistance within the voltage reference signal circuit.
Claims
exact text as granted — not AI-modified1 . A multi-layered substrate having a voltage reference signal circuit layout therein, comprising:
a first layer having a plurality of signal traces; a second layer having at least one conductive plane; a third layer having at least one conductive plane and a voltage reference signal trace; and a fourth layer having a plurality of signal traces.
2 . The multi-layered substrate of claim 1 , wherein the conductive plane at the second layer is a ground plane.
3 . The multi-layered substrate of claim 1 , wherein the conductive plane at the second layer is a power plane.
4 . The multi-layered substrate of claim 1 , wherein the conductive plane at the third layer is a ground plane.
5 . The multi-layered substrate of claim 1 , wherein the conductive plane at the third layer is a power plane.
6 . The multi-layered substrate of claim 1 , wherein the voltage reference signal trace is surrounded by the conductive plane at the third layer.
7 . The multi-layered substrate of claim 1 , wherein the substrate further at least one layer having a plurality of signal traces between the second layer and the third layer.
8 . The multi-layered substrate of claim 1 , wherein the substrate further a layer having at least one ground plane and a plurality of signal traces between the first layer and the second layer.
9 . The multi-layered substrate of claim 1 , wherein the substrate further a layer having at least one power plane and a plurality of signal traces between the third layer and the fourth layer.
10 . The multi-layered substrate of claim 1 , wherein the first layer further includes a voltage reference signal trace.
11 . A multi-layered substrate having a voltage reference signal circuit layout therein, comprising:
a first signal layer having a plurality of signal traces; a second signal layer having a plurality of signal traces; and at least one non-signaling layer between the first signal layer and the second signal layer, wherein a voltage reference signal trace is in one of the non-signaling layers.
12 . The multi-layered substrate of claim 11 , wherein the non-signaling layer includes at least one power plane.
13 . The multi-layered substrate of claim 11 , wherein the non-signaling layer includes at least one ground layer plane.
14 . The multi-layered substrate of claim 11 , wherein the non-signaling layer includes at least one power plane and a plurality of signal traces.
15 . The multi-layered substrate of claim 11 , wherein the non-signaling layer includes at least one ground layer plane and a plurality of signal traces.
16 . A multi-layered substrate having a voltage reference signal circuit layout therein, comprising:
at least one signal layer having a plurality of signal traces; a non-signaling layer having a voltage reference signal trace; and a conductive plane between the signal layer and the non-signaling layer.
17 . The multi-layered substrate of claim 16 , wherein the non-signaling layer includes at least one power plane.
18 . The multi-layered substrate of claim 16 , wherein the non-signaling layer includes at least one ground layer plane.
19 . The multi-layered substrate of claim 16 , wherein the non-signaling layer includes at least one power plane and a plurality of signal traces.
20 . The multi-layered substrate of claim 16 , wherein the non-signaling layer includes at least one ground layer plane and a plurality of signal traces.
21 . The multi-layered substrate of claim 16 , wherein the conductive plane includes a ground plane.
22 . The multi-layered substrate of claim 16 , wherein the conductive plane includes a power plane.
23 . A multi-layered substrate having a voltage reference signal circuit layout therein, comprising:
at least one signal layer having a plurality of signal traces; and at least one non-signaling layer having a voltage reference signal trace.
24 . The multi-layered substrate of claim 23 , wherein the non-signaling layer includes at least one ground layer plane.
25 . The multi-layered substrate of claim 23 , wherein the non-signaling layer includes at least one power plane and a plurality of signal traces.
26 . The multi-layered substrate of claim 23 , wherein the non-signaling layer includes at least one ground layer plane and a plurality of signal traces.Join the waitlist — get patent alerts
Track US2003149942A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.