Polymer compositions having high thermal conductivity and dielectric strength and molded packaging assemblies produced therefrom

Abstract

A polymer composition having high thermal conductivity and dielectric strength is provided. The polymer composition comprises a base polymer matrix and a thermally-conductive, electrically-insulating material. A reinforcing material such as glass can be added to the composition. The polymer composition can be molded into packaging assemblies for electronic devices such as capacitors, transistors, and resistors.

What is claimed is:  
     
         1 . A thermally-conductive, electrically-insulating polymer composition, comprising: 
 a) 20% to 80% by weight of a polymer matrix, and b) 20% to 80% by weight of a thermally-conductive, electrically-insulating ceramic material.    
     
     
         2 . The composition of  claim 1 , wherein the polymer matrix is a thermoplastic polymer.  
     
     
         3 . The composition of  claim 2 , wherein the polymer matrix is polyphenylene sulfide.  
     
     
         4 . The composition of  claim 1 , wherein the thermally-conductive, electrically-insulating ceramic material is selected from the group consisting of alumina, calcium oxide, titanium oxide, silicon oxide, zinc oxide, silicon nitride, aluminum nitride, boron nitride, and mixtures thereof.  
     
     
         5 . The composition of  claim 1 , further comprising a reinforcing material.  
     
     
         6 . The composition of  claim 5 , wherein the reinforcing material is glass.  
     
     
         7 . An electronic device package assembly, comprising: 
 an electronic device having a front side, rear side, left side, right side, bottom side, and top side;    a molded cover disposed about said electronic device and in thermal communication with at least said front side, rear side, left side, right side, and top side of said electronic device, and    at least two wire leads, said wire leads emanating from said electronic device and protruding through said molded cover, said molded cover comprising a thermally-conductive, electrically-insulating polymer composition comprising: a) 20% to 80% by weight of a polymer matrix, and b) 20% to 80% by weight of a thermally-conductive, electrically-insulating material.    
     
     
         8 . The package assembly of  claim 7 , wherein the polymer matrix is a thermoplastic polymer.  
     
     
         9 . The package assembly of  claim 8 , wherein the polymer matrix is polyphenylene sulfide.  
     
     
         10 . The package assembly of  claim 7 , wherein the thermally-conductive, electrically-insulating ceramic material is selected from the group consisting of alumina, calcium oxide, titanium oxide, silicon oxide, zinc oxide, silicon nitride, aluminum nitride, boron nitride, and mixtures thereof.  
     
     
         11 . The package assembly of  claim 7 , further comprising a reinforcing material.  
     
     
         12 . The package assembly of  claim 11 , wherein the reinforcing material is glass.  
     
     
         13 . A method of manufacturing an electronic device package assembly, comprising the steps of: 
 a) providing an electronic device having a front side, rear side, left side, right side, bottom side and top side and at least two wire leads, said wire leads emanating from said electronic device; and    b) molding a thermally-conductive, electrically-insulating polymer composition over the electronic device so that the composition is in contact with at least the front side, rear side, left side, right side, and top side of the electronic device, and the wire leads protrude through the composition, said polymer composition comprising: a) 20% to 80% by weight of a polymer matrix, b) 20% to 80% by weight of a thermally-conductive, electrically-insulating material.    
     
     
         14 . The method of  claim 13 , wherein the polymer matrix is a thermoplastic polymer.  
     
     
         15 . The method of  claim 14 , wherein the polymer matrix is polyphenylene sulfide.  
     
     
         16 . The method of  claim 13 , wherein the thermally-conductive, electrically-insulating ceramic material is selected from the group consisting of alumina, calcium oxide, titanium oxide, silicon oxide, zinc oxide, silicon nitride, aluminum nitride, boron nitride, and mixtures thereof.