Light emission device, method of manufacturing same, electro-optical device and electronic device

Abstract

An organic EL display unit is manufactured in an efficient manner. A light emission device ( 1000 ) is manufactured by bonding together a driving circuit substrate ( 100 ) formed with driving circuit constituted by thin film transistors 11 , and a light emission substrate ( 300 ) comprising a successively laminated transparent electrode layer 31 , bank layer 32 made from insulating material, positive hole injection layer 33 , organic EL layer 34 and cathode layer 36. Translation of the Drawings FIG. 7 S 10 FORM SEMICONDUCTOR LAYER S 11 FORM GATE INSULATING LAYER S 12 FORM GATE ELECTRODES S 13 INTRODUCE IMPURITY S 14 FORM FIRST PROTECTIVE LAYER S 15 FORM WIRING LAYER S 16 FORM SECOND PROTECTIVE LAYER S 17 FORM PICTURE ELEMENT ELECTRODE S 20 FORM TRANSAPRENT ELECTRODE LAYER S 21 FORM BANKS S 22 FORM POSITIVE HOLE INJECTION LAYER S 23 FORM EL LAYER S 24 FORM CATHODE LAYER S 30 CONNECTION PROCESS S 31 SEALING PROCESS FIG. 15 1430 TV REPRODUCTION CIRCUIT

1 . A light emission device comprising: 
 a light emission substrate constituted by interposing a light emission layer containing an EL layer in between an optically transmissive anode layer and a cathode layer; and    a driving circuit substrate on which a driving circuits for driving said light emission layer is formed;    wherein the outputs of said driving circuit is electrically connected to said cathode layer, and means for preventing oxidization of said cathode layer is provided between said light emission substrate and said driving circuit substrate.    
     
     
         2 . The light emission device according to  claim 1 , wherein said light emission layer is superimposed partially or completely over said driving circuit, when viewed from an approximately perpendicular direction to the substrate plane.  
     
     
         3 . The light emission device according to  claim 1  or  2 , wherein said means for preventing oxidization of said cathode layer is constituted by encapsulating an adhesive in between said light emission substrate and said driving circuit substrate for hermetically sealing said cathode layer.  
     
     
         4 . The light emission device according to  claim 1  or  2 , wherein said means for preventing oxidization of said cathode layer is constituted by encapsulating an inert gas in between said light emission substrate and said driving circuit substrate for preventing oxidization of said cathode layer.  
     
     
         5 . The light emission deice according to  claim 1  or  2 , wherein said light emission layer comprises, at the least, a positive hole injection layer formed on said anode layer side, and said EL layer formed on said positive hole injection layer.  
     
     
         6 . The light emission device according to  claim 1  or  2 , wherein said cathode layer comprises an exposure prevention structure which covers said light emission layer and prevents exposure of the end portions of the substrate.  
     
     
         7 . The light emission device according to any one of  claims 1  to  6 , wherein said driving circuit substrate comprises electrodes which connect to said cathode layer and to which the output is supplied.  
     
     
         8 . The light emission device according to  claim 7 , wherein said electrodes and said cathode layer are electrically connected by means of an electrically conductive material.  
     
     
         9 . An electro-optical device comprising the light emission device according to any one of  claims 1  to  8 .  
     
     
         10 . An electronic device comprising the light emission device according to any one of  claim 1  to  8 .  
     
     
         11 . A method of manufacturing a light emission device comprising the steps of: 
 forming a light emission substrate constituted by interposing a light emission layer containing an EL layer in between an optically transmissive anode layer and a cathode layer;    forming a driving circuit substrate on which a driving circuit for driving said light emission layer is formed;    electrically connecting the output of said driving circuit in said driving circuit substrate to said cathode layer in said light emission substrate; and    sealing said light emission substrate and said driving circuit substrate together in such a manner that oxidization of said cathode layer is prevented.    
     
     
         12 . The method of manufacturing a light emission device according to  claim 11 , wherein, in the step of forming said driving circuit substrate, when said light emission substrate and said driving circuit substrate are connected, a portion or the entirety of said driving circuit in said driving circuit substrate is superimposed with said light emission substrate in said light emission substrate, when viewed from an approximately perpendicular direction to the substrate plane.  
     
     
         13 . The method of manufacturing a light emission device according to  claim 11  or  12 , wherein, in said sealing step, an adhesive which hermetically seals said cathode layer is filled in between light emission substrate and said driving circuit substrate.  
     
     
         14 . The method of manufacturing a light emission device according to  claim 11  or  12 , wherein, in said sealing step, an inert gas which prevents oxidization of said cathode layer is encapsulated in between said light emission substrate and said driving circuit substrate.  
     
     
         15 . The method of manufacturing a light emission device according to  claim 11  or  12 , wherein said step of forming said light emission substrate comprises, at the least, a step of forming a positive hole injection layer on said anode layer side, and a step of forming said EL layer on said positive hole injection layer.  
     
     
         16 . The method of manufacturing a light emission device according to  claim 11  or  12 , wherein, in said step of forming said light emission substrate, said cathode layer is formed in an exposure preventing shape which covers said light emission layer and prevents exposure of the end portions of the substrate.  
     
     
         17 . The method of manufacturing a light emission device according to  claim 11  or  12 , wherein, in said step of forming said driving circuit substrate, electrodes are formed, which connect to said cathode layer and to which the output of said driving circuit is supplied.  
     
     
         18 . The method of manufacturing a light emission device according to  claim 17 , wherein, in said step of connecting said light emission substrate and said driving circuit substrate, said electrodes and said cathode layer are electrically connected by means of an electrically conductive material.  
     
     
         19 . A light emission device, being a display unit using organic EL elements in a display section, formed by respectively preparing a driving circuit substrate incorporating a driving circuit for said organic EL element, and an EL substrate incorporating said organic EL element, and bonding said substrates together.  
     
     
         20 . A method of manufacturing a light emission device wherein a driving circuit substrate incorporating driving circuits for an organic EL element, and an EL substrate incorporating said organic EL element, are bonded together.