Heat sink for heat-susceptible electronic devices

Abstract

A heat-sink for heat-liable electronic devices provides multiples of lateral holes in each vertical fin to separately create a lateral passage in relation with longitudinal troughs to guide air currents flowing in various directions to boost the air conduction thus to improve heat dissipation effects.

I claim,  
     
         1 . A heat sink for heat-liable electronic devices comprising multiples of vertical fins separating from one another for a certain spacing being provided on a body of the heat sink characterized by that: 
 multiples of holes being laterally provided in each of said fins provided on the body of the heat sink to separately define a lateral passage in related to longitudinally troughs formed between abutted fins for guiding air currents flowing in various directions.    
     
     
         2 . A heat sink for heat-liable electronic devices as claimed in  claim 1 , wherein, a flange is formed by punching on one side of each of said lateral holes provided in each of said fins.  
     
     
         3 . A heat sink for heat-liable electronic devices as claimed in  claim 1 , wherein, each said lateral hole is formed an opening at an upper end of each of said fins.