Device for chemical mechanical polishing

Abstract

The present invention provides a chemical mechanical polishing device for polishing a wafer. The chemical mechanical polishing device comprises a platen, an outer polishing pad, an inner polishing pad, a slurry providing system, and a rotating carrier. The inner polishing pad is located on the platen. The outer polishing pad is mounted on the outer polishing pad and peeled off when abraded from overuse. The slurry providing system provides a slurry to the surface of the outer polishing pad. The rotating carrier holds the wafer and contacts the surface of the wafer with the slurry and the polishing pad to carry out the chemical mechanical polishing process.

What is claimed is:  
     
         1 . A chemical mechanical polishing device for polishing a wafer, comprising: 
 a platen;    an inner polishing pad locating on the platen;    an outer polishing pad removeably located on the outer polishing pad;    a slurry providing system, which provides a slurry to the surface of the outer polishing pad; and    a rotating carrier for holding the wafer and contacting the surface of the wafer with the slurry and the polishing pad to carry out the chemical mechanical polishing process.    
     
     
         2 . The chemical mechanical polishing device as claimed in  claim 1 , wherein the outer polishing pad and the inner polishing pad are stacked on the platen.  
     
     
         3 . The chemical mechanical polishing device as claimed in  claim 2 , wherein the bottoms of the outer polishing pad and the inner polishing pad have adhesive tape fixing the outer polishing pad and the inner polishing pad.  
     
     
         4 . A chemical mechanical polishing method for polishing a wafer, comprising the following steps: 
 providing a plurality of stacked polishing pads, whereby the outer polishing pad contacts the wafer;    providing a slurry to the surface of the outer polishing pad;    polishing the wafer by the relative motion between the wafer and the polishing pad; and    peeling the outer polishing pad when abraded from overuse, and polishing the wafer by inner polishing pad.    
     
     
         5 . The chemical mechanical polishing method as claimed in  claim 4 , wherein adhesive tapes are located between the polishing pads to fix the polishing pads.  
     
     
         6 . The chemical mechanical polishing method as claimed in  claim 5 , wherein the adhesive tapes are located on the respective undersides of the polishing pads.