Heat sinks and method of formation

Abstract

A heat sink (and method of forming a heat sink) is provided that includes a core having a central axis and a plurality of cooling fins arranged about the core. Each fin has a base and a tip. The fins may be shaped to capture a tangential component of air from the fan. At least one portion (such as upper portion) of the fins may be bent. A lower portion of each fin may also be bent.

What is claimed is:  
     
         1 . A heat sink comprising: 
 a core having a central axis; and    a plurality of cooling fins arranged about the core, each fin having a base and a tip, wherein said fins are shaped to capture a tangential component of air from the fan and wherein at least one portion of each of said fins is bent.    
     
     
         2 . The heat sink recited in  claim 1 , wherein the fins are curved towards the tangential component.  
     
     
         3 . The heat sink recited in  claim 1 , wherein an upper portion of each of the fins is bent towards the tangential component.  
     
     
         4 . The heat sink recited in  claim 3 , wherein a lower portion of each of said fins is also bent towards the tangential component.  
     
     
         5 . The heat sink recited in  claim 1 , wherein another portion of each of said fins is bent.  
     
     
         6 . The heat sink recited in  claim 1 , wherein each of said fins is provided in a swept manner about said core.  
     
     
         7 . A heat sink for use with an axial flow fan comprising: 
 a core having a central axis; and    a plurality of cooling fins arranged about the core, each fin having a base and a tip, wherein each of said fins is provided in a swept manner about said core.    
     
     
         8 . The heat sink recited in  claim 7 , wherein an upper portion of each of the fins is bent.  
     
     
         9 . The heat sink recited in  claim 8 , wherein a lower portion of each of said fins is also bent.  
     
     
         10 . The heat sink recited in  claim 7 , further comprising: 
 a first face having a semi-rectangular periphery that is defined by the fin tips, and which is to thermally contact a heat-generating electrical component.    
     
     
         11 . The heat sink recited in  claim 10 , further comprising: 
 a second face, substantially opposite the first face, and having a periphery that is defined by the fin tips.    
     
     
         12 . The heat sink recited in  claim 7 , wherein the core comprises a central cavity to receive a thermal plug formed of a material having a high thermal conductivity.  
     
     
         13 . An electronic assembly comprising: 
 a substrate;    an electronic component mounted on a surface of the substrate;    an axial flow fan to move air towards the substrate, the air having an axial component and a tangential component; and    a heat sink including: 
 a first face in thermal contact with the electronic component;  
 a second face facing the fan;  
 a core having a central axis; and  
 a plurality of cooling fins arranged about the core, wherein at least one portion of each of said fins is bent.  
   
     
     
         14 . The electric assembly recited in  claim 13 , wherein an upper portion of each of the fins is bent.  
     
     
         15 . The electric assembly recited in  claim 14 , wherein a lower portion of each of said fins is also bent.  
     
     
         16 . The electric assembly recited in  claim 13 , wherein another portion of each of said fins is bent.  
     
     
         17 . The electric assembly recited in  claim 13 , wherein each of said fins is provided in a swept manner about said core.  
     
     
         18 . The electronic assembly recited in  claim 13 , wherein the electronic component comprises an integrated circuit (IC).  
     
     
         19 . An electronic system comprising: 
 a circuit board;    a processor integrated circuit (IC) mounted on the circuit board;    at least one chipset mounted on the circuit board and electrically coupled to the processor IC for operation in conjunction with the processor IC;    at least one axial flow fan to move air towards the circuit board; and    at least one heat sink including 
 a first face in thermal contact with either the processor IC or the chipset;  
 a second face facing the at least one fan;  
 a core having a central axis; and  
 a plurality of cooling fins arranged about the core, each fin having a base and a tip, wherein at least one portion of each of said fins is bent.  
   
     
     
         20 . The electric assembly recited in  claim 19 , wherein an upper portion of each of the fins is bent.  
     
     
         21 . The electric assembly recited in  claim 20 , wherein a lower portion of each of said fins is also bent.  
     
     
         22 . The electric assembly recited in  claim 19 , wherein another portion of each of said fins is bent.  
     
     
         23 . The electric assembly recited in  claim 19 , wherein each of said fins is provided in a swept manner about said core.  
     
     
         24 . A method of forming a heat sink, said method comprising: 
 obtaining a quantity of thermally conductive metal;    forming from the quantity a plurality of fins extending outwardly from a core, the core having a central axis, each fin having a base coupled to the core; and    forming a bend in each of said fins.    
     
     
         25 . The method recited in  claim 24 , wherein forming said bend in each of said fins comprises coupling said heat sink to a die and rotating said die relative to a fixed position so as to create said bend in each of said fins.  
     
     
         26 . The method recited in  claim 24 , wherein forming said bend in each of said fins comprises coupling said heat sink to a first die and to a second die, and rotating said first die relative to said second die so as to create said bend in each of said fins.  
     
     
         27 . The method recited in  claim 24 , wherein before forming said bend, said method comprises: 
 separating a portion of each fin from the core.    
     
     
         28 . The method recited in  claim 24 , wherein forming said plurality of fins comprises extruding the quantity of thermally conductive metal through an extrusion die.  
     
     
         29 . The method recited in  claim 28 , wherein the thermally conductive metal comprises aluminum.  
     
     
         30 . The method recited in  claim 28 , wherein said plurality of fins are formed in a swept manner about said core.  
     
     
         31 . The method recited in  claim 28 , wherein each of said plurality of fins are curved.  
     
     
         32 . The method recited in  claim 24 , further comprising forming another bend in each of said fins.  
     
     
         33 . A method of making an electronic assembly, the method comprising: 
 mounting an electronic component on a circuit board;    providing an axial flow fan, the fan capable of moving air; and    mounting a heat sink between the electronic component and the fan, the heat sink comprising a plurality of cooling fins arranged about a core having a central axis, each fin having a base coupled to the core, wherein a portion of each of said fins is bent.    
     
     
         34 . The method recited in  claim 32 , wherein the electronic component is from the group consisting of a processor, a chipset integrated circuit (IC), a digital switching circuit, a radio frequency (RF) circuit, a memory circuit, a custom circuit, an application specific IC (ASIC), and an amplifier.  
     
     
         35 . The method recited in  claim 32 , wherein each fin has a tip, wherein a first face of the heat sink is in thermal contact with the electronic component and has a periphery that is defined by the fin tips, and wherein a second face of the heat sink, substantially opposite the first face, faces the fan and has a periphery that is defined by the fin tips.