IC chip tester with heating element for preventing condensation

Abstract

An IC chip testing apparatus provided with an IC socket 206 to which an IC chip is brought into electrical contact, a printed circuit board 205 with one terminal which is electrically connected to a terminal of a test head and with another terminal which is electrically connected to a terminal of the IC socket 206, and a heating element 208 provided at the printed circuit board 205. The IC chip testing apparatus may be provided with a socket 320 to which an IC chip to be tested is detachably mounted; a socket guide 382 holding the socket 320; a chamber 306 to the opening 392 of which the socket guide 382 is attached so that an IC chip mounting opening of the socket 320 faces inside the chamber and able to maintain the inside at a predetermined state less than ordinary temperature; a printed circuit board 400 which is electrically connected to a terminal of the socket 320 and which is arranged at the outside of the chamber opening 392 of the chamber 6; and a heating board 406 which is provided around the chamber opening 392 of the chamber 306 and heats the printed circuit board 400 by heat conduction. It is possible to prevent condensation of the printed circuit board which tends to occur at the time of application of a low temperature and radiation of heat from the IC socket which tends to occur at the time of application of a high temperature or low temperature.

1 . An electronic device testing apparatus comprising: 
 a socket to which an electronic device is brought into electrical contact,    a circuit board with one terminal which is electrically connected to a terminal of a test head and with another terminal which is electrically connected to a terminal of the socket, and    a heating element provided at the circuit board.    
     
     
         2 . The electronic device testing apparatus as set forth in  claim 1 , wherein the heating element is on the circuit board.  
     
     
         3 . The electronic device testing apparatus as set forth in  claim 1 , wherein the printed circuit board is provided in proximity to the socket.  
     
     
         4 . An electronic device testing apparatus comprising: 
 a socket to which an electronic device to be tested is detachably mounted;    a socket guide holding the socket;    a chamber to the opening of which said socket guide is attached so that an electronic device mounting opening of the socket faces inside the chamber and able to maintain the inside at a predetermined state less than ordinary temperature;    a circuit board which is electrically connected to a terminal of the socket and which is arranged at the outside of the chamber opening of the chamber; and    a heating board which is provided around the chamber opening of the chamber and heats the circuit board by heat conduction.    
     
     
         5 . The electronic device testing apparatus as set forth in  claim 4 , wherein the heating board is attached around the chamber opening of the chamber through a mounting base.  
     
     
         6 . The electronic device testing apparatus as set forth in  claim 5 , wherein the socket guide is detachably attached to the mounting base.  
     
     
         7 . The electronic device testing apparatus as set forth in  claim 4 , wherein the circuit board contacts the heating board through a circuit board holding ring so as to form a first air-tight space at the circuit board side of the socket guide.  
     
     
         8 . The electronic device testing apparatus as set forth in  claim 7 , wherein a first seal member is interposed at the portion of contact of the circuit board holding ring and the heating board.  
     
     
         9 . The electronic device testing apparatus as set forth in  claim 7 , wherein a second seal member is interposed at the portion of contact of the circuit board and the circuit board holding ring.  
     
     
         10 . The electronic device testing apparatus as set forth in  claim 4 , wherein at the anti-chamber side of the circuit board is attached a reinforcing plate so as to form a second air-tight space with the circuit board and the reinforcing plate is provided with a drying nozzle for feeding dry gas into the second air-tight space.  
     
     
         11 . The electronic device testing apparatus as set forth in  claim 10 , wherein the circuit board is electrically connected through a plurality of movable pins on a movable pin holding ring projecting out in a ring-shape from a test head sending test drive signals to the electronic device mounted at the socket, the reinforcing plate is provided at the inside of the movable pin holding ring, and the second air-tight space formed between the circuit board and the reinforcing plate is made air-tight by a seal ring provided at the inside of the movable pin holding ring.  
     
     
         12 . The electronic device testing apparatus as set forth in  claim 4 , wherein the circuit board is brought in contact with the heating board through a seal member so as to form a first air-tight space at the circuit board side of the socket guide.  
     
     
         13 . The electronic device testing apparatus as set forth in  claim 7 , wherein the heating board is formed with a drying passage for feeding dry gas into the first air-tight space.