Heat transport device

Abstract

A heat mass transport device, utilizing microchannels and micropumps, achieving a thinner form and offers a higher thermal conductance. The heat mass transport device ( 1 ) has a structure in which the microchannels for passing through a coolant and the micropumps for transporting the coolant form a single unit. For example, a channel layer ( 2 ), in which the microchannels ( 2 a ) are formed, and a pump layer ( 4 ), in which the micropumps ( 4 a ) are formed, may be laminated in a multi-layer structure, or a large number of single units in which a microchannel and a micropump are combined, may be placed in an array. Moreover, the heat mass transport device is made flexible, as the microchannels and micropumps are formed on a resin substrate utilizing flexible material.

1 . A heat mass transport device characterized by having a microchannel for passing through a coolant, and a micropump for passing through said coolant, wherein said microchannel and said micropump are formed into a single unit, and said coolant transports heat by circulating through said microchannel.  
     
     
         2 . The heat mass transport device of  claim 1 , characterized by having a channel layer, in which said microchannel is formed, and a pump layer, in which said micropump is formed, wherein said heat mass transport device comprises a multi-layer structure in which said channel layer and said pump layer are laminated.  
     
     
         3 . The heat mass transport device of  claim 1 , characterized by comprising a unit structure in which said microchannel and said micropump form a single unit, wherein said heat mass transport device includes a plurality of said single unit structures.  
     
     
         4 . The heat mass transport device of  claim 1 , characterized by having said micropump formed by making a portion of said microchannel narrower by constriction.  
     
     
         5 . The heat mass transport device of  claim 4 , characterized by having said microchannel and the said micropump formed in closed loop form.  
     
     
         6 . The heat mass transport device of  claim 1 , characterized by having a constituting material for said microchannel and said micropump formed of a flexible material.  
     
     
         7 . The heat transport device of  claim 2 , characterized by having a constituting material for said channel layer and said pump layer formed of a flexible material.  
     
     
         8 . The heat mass transport device of  claim 3 , characterized by having a constituting material for said microchannel and said micropump formed of a flexible material.  
     
     
         9 . The heat mass transport device of  claim 4 , characterized by having a constituting material for said microchannel and said micropump formed of a flexible material.