Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components

Abstract

A beating and pressurizing apparatus ( 101 ), to which a circuit board ( 70 ) with electronic components ( 8 ) pre-bonded thereto via bonding elements ( 9 ) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member ( 1211 ) having a heating device ( 122 ). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

What is claimed is:  
     
         1 . An electronic component mounting apparatus for producing a plurality of circuit boards, in which an electronic component pre-bonded on each circuit board of the boards via a bonding element is heated and pressurized so as to be post-bonded, the apparatus comprising: 
 a pre-bonding unit for pre-bonding the electronic component onto each circuit board; and    an electronic-component post-bonding unit which is separate from and independent of the pre-bonding unit and operates simultaneously with the pre-bonding unit, and which heats and pressurizes the pre-bonded electronic component so that the pre-bonded electronic component is post-bonded on the circuit board.    
     
     
         2 . An electronic component mounting apparatus according to  claim 1 , further comprising a carrying unit for carrying the circuit board produced by the pre-bonding unit with the electronic component pre-bonded thereon, from the pre-bonding unit to the post-bonding unit.  
     
     
         3 . A heating and pressurizing apparatus for use in mounting electronic components, comprising: 
 a placement table for placing thereon a circuit board on which an electronic component has been pre-bonded via a bonding element applied onto the circuit board; and    a mounting finishing unit which is provided separately from the placement table and which heats the electronic component pre-bonded onto the circuit board placed on the placement table and pressurizes the electronic component in a direction of thickness of the circuit board, whereby the electronic component is post-bonded on the circuit board.    
     
     
         4 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 3 , wherein the mounting finishing unit comprises: 
 a pressurizing device which has a contact member having a contact surface to be brought into contact with the pre-bonded electronic component, and which moves the contact member in the direction of thickness of the circuit board to press the pre-bonded electronic component against the circuit board; and    a heating device for heating the contact member to post-cure the bonding element.    
     
     
         5 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 4 , wherein the pressurizing device further comprises: 
 a parallelism adjuster for adjusting parallelism between the contact surface of the contact member and the pre-bonded electronic component; and    a pressurizing-force adjuster for adjusting pressurizing force of the contact member.    
     
     
         6 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 3 , wherein the placement table has a placement-table heating device which is movable in both X and Y directions each perpendicular to the direction of thickness of the circuit board and which serves an auxiliary role in curing the bonding element.  
     
     
         7 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 4 , wherein assuming that the contact member, the heating device, and the pressurizing device are taken as one set, the mounting finishing unit has a plurality of sets of the contact member, the heating device, and the pressurizing device, each set being operative independently of one another.  
     
     
         8 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 4 , wherein the heating device comprises a ceramic heater for reducing temperature-increasing time and cooling time.  
     
     
         9 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 3 , wherein the mounting finishing unit further comprises: 
 a contamination-preventing member supply unit which, when the contact member pressurizes the electronic component, supplies a contamination preventing member for preventing a contact surface of the contact member from being contaminated by the bonding element so that the contamination preventing member is interposed between the contact surface and the electronic component.    
     
     
         10 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 9 , wherein the contamination preventing member is formed of a sheet material.  
     
     
         11 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 3 , wherein the placement table is equipped with a fixing unit for positioning and fixing the circuit board.  
     
     
         12 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 3 , wherein the heating and pressurizing apparatus comprises a plurality of the units, assuming that the placement table and the mounting finishing unit are taken as each unit of the units.  
     
     
         13 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 4 , wherein the placement table has a placement-table heating device which is movable in both X and Y directions each perpendicular to the direction of thickness of the circuit board and which serves an auxiliary role in curing the bonding element.  
     
     
         14 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 5 , wherein the placement table has a placement-table heating device which is movable in both X and Y directions each perpendicular to the direction of thickness of the circuit board and which serves an auxiliary role in curing the bonding element.  
     
     
         15 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 5 , wherein assuming that the contact member, the heating device, and the pressurizing device are taken as one set, the mounting finishing unit has a plurality of sets of the contact member, the heating device, and the pressurizing device, each set being operative independently of one another.  
     
     
         16 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 6 , wherein assuming that the contact member, the heating device, and the pressurizing device are taken as one set, the mounting finishing unit has a plurality of sets of the contact member, the heating device, and the pressurizing device, each set being operative independently of one another.  
     
     
         17 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 5 , wherein the heating device comprises a ceramic heater for reducing temperature-increasing time and cooling time.  
     
     
         18 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 6 , wherein the heating device comprises a ceramic heater for reducing temperature-increasing time and cooling time.  
     
     
         19 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 7 , wherein the heating device comprises a ceramic heater for reducing temperature-increasing time and cooling time.  
     
     
         20 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 4 , wherein the mounting finishing unit further comprises: 
 a contamination-preventing member supply unit which, when the contact member pressurizes the electronic component, supplies a contamination preventing member for preventing a contact surface of the contact member from being contaminated by the bonding element so that the contamination preventing member is interposed between the contact surface and the electronic component.    
     
     
         21 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 5 , wherein the mounting finishing unit further comprises: 
 a contamination-preventing member supply unit which, when the contact member pressurizes the electronic component, supplies a contamination preventing member for preventing a contact surface of the contact member from being contaminated by the bonding element so that the contamination preventing member is interposed between the contact surface and the electronic component.    
     
     
         22 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 6 , wherein the mounting finishing unit further comprises: 
 a contamination-preventing member supply unit which, when the contact member pressurizes the electronic component, supplies a contamination preventing member for preventing a contact surface of the contact member from being contaminated by the bonding element so that the contamination preventing member is interposed between the contact surface and the electronic component.    
     
     
         23 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 7 , wherein the mounting finishing unit further comprises: 
 a contamination-preventing member supply unit which, when the contact member pressurizes the electronic component, supplies a contamination preventing member for preventing a contact surface of the contact member from being contaminated by the bonding element so that the contamination preventing member is interposed between the contact surface and the electronic component.    
     
     
         24 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 8 , wherein the mounting finishing unit further comprises: 
 a contamination-preventing member supply unit which, when the contact member pressurizes the electronic component, supplies a contamination preventing member for preventing a contact surface of the contact member from being contaminated by the bonding element so that the contamination preventing member is interposed between the contact surface and the electronic component.    
     
     
         25 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 4 , wherein the placement table is equipped with a fixing unit for positioning and fixing the circuit board.  
     
     
         26 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 5 , wherein the placement table is equipped with a fixing unit for positioning and fixing the circuit board.  
     
     
         27 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 6 , wherein the placement table is equipped with a fixing unit for positioning and fixing the circuit board.  
     
     
         28 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 7 , wherein the placement table is equipped with a fixing unit for positioning and fixing the circuit board.  
     
     
         29 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 8 , wherein the placement table is equipped with a fixing unit for positioning and fixing the circuit board.  
     
     
         30 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 9 , wherein the placement table is equipped with a fixing unit for positioning and fixing the circuit board.  
     
     
         31 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 10 , wherein the placement table is equipped with a fixing unit for positioning and fixing the circuit board.  
     
     
         32 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 4 , wherein the heating and pressurizing apparatus comprises a plurality of the units, assuming that the placement table and the mounting finishing unit are taken as each unit of the units.  
     
     
         33 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 5 , wherein the heating and pressurizing apparatus comprises a plurality of the units, assuming that the placement table and the mounting finishing unit are taken as each unit of the units.  
     
     
         34 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 6 , wherein the heating and pressurizing apparatus comprises a plurality of the units, assuming that the placement table and the mounting finishing unit are taken as each unit of the units.  
     
     
         35 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 7 , wherein the heating and pressurizing apparatus comprises a plurality of the units, assuming that the placement table and the mounting finishing unit are taken as each unit of the units.  
     
     
         36 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 8 , wherein the heating and pressurizing apparatus comprises a plurality of the units, assuming that the placement table and the mounting finishing unit are taken as each unit of the units.  
     
     
         37 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 9 , wherein the heating and pressurizing apparatus comprises a plurality of the units, assuming that the placement table and the mounting finishing unit are taken as each unit of the units.  
     
     
         38 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 10 , wherein the heating and pressurizing apparatus comprises a plurality of the units, assuming that the placement table and the mounting finishing unit are taken as each unit of the units.  
     
     
         39 . A heating and pressurizing apparatus for use in mounting electronic components according to  claim 11 , wherein the heating and pressurizing apparatus comprises a plurality of the units, assuming that the placement table and the mounting finishing unit are taken as each unit of the units.