Semiconductor device and a method of manufacturing the same

Abstract

On an adapter mounting portion 3 a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.

1 . A semiconductor device in which, on a portion of a resin-made case body applied to cover a part mounting surface of a substrate on which a semiconductor chip is mounted, a mounting portion is formed having a projecting cross section on which a recessed portion of a metal-made auxiliary piece used for increasing a planar dimension of the case body is fitted.  
     
     
         2 . A semiconductor device according to  claim 1 , wherein one mounting portion having the projecting cross section is formed in the thickness direction of the case body.  
     
     
         3 . A semiconductor device according to  claim 1 , wherein a dimension of one third of a thickness of the mounting portion having the projecting cross section is set equal to or larger than a dimension of an indentation from the case body at the mounting portion having the projecting cross section.  
     
     
         4 . A semiconductor device according to  claim 1 , wherein with respect to the mounting portion having the projecting cross section, a length thereof in the direction in which the recessed portion of the auxiliary piece is fitted on the mounting portion is greater than a thickness of the mounting portion having the projecting cross section.  
     
     
         5 . A semiconductor device according to  claim 1 , wherein a state of the mounting portion having the projecting cross section is asymmetrical with respect to a front surface side and a rear surface side of the case body.  
     
     
         6 . A semiconductor device according to  claim 5 , wherein a width of the mounting portion having the projecting cross section at the front surface side of the case body is set wider than the width of mounting portion having the projecting cross section at a face side opposite to the front surface of the case body.  
     
     
         7 . A semiconductor device according to  claim 1 , wherein a groove portion is formed in the case body, the groove portion catching a pawl portion of the auxiliary piece so as to fix the auxiliary piece to the case body in a replaceable manner.  
     
     
         8 . A semiconductor device according to  claim 1 , wherein a pawl portion is formed on the auxiliary piece, the pawl portion being caught by a groove portion formed in the case body so as to fix the auxiliary piece to the case body in a replaceable manner.  
     
     
         9 . A semiconductor device according to  claim 8 , wherein the pawl portion is mounted on a distal end of a support portion formed on the auxiliary piece.  
     
     
         10 . A semiconductor device according to  claim 9 , wherein the supporting portion has a resilient force.  
     
     
         11 . A semiconductor device according to  claim 10 , wherein the support portion is formed of a leaf spring.  
     
     
         12 . A semiconductor device according to  claim 9 , wherein the pawl portion and the supporting portion are integrally formed with the auxiliary piece.  
     
     
         13 . A semiconductor device according to  claim 1 , wherein the mounting portions having the projecting cross section are mounted on two corner portions at a face side on which the auxiliary piece is fitted with respect to the case body.  
     
     
         14 . A semiconductor device according to  claim 13 , wherein a thickness of a portion sandwiched by the mounting portions having the projecting cross section is set relatively larger than a thickness of the mounting portions.  
     
     
         15 . A semiconductor device according to  claim 14 , wherein a groove portion which catches a pawl portion of the auxiliary piece and fixes the auxiliary piece to the case body in a replaceable manner is formed on a portion sandwiched by the mounting portions having the projecting cross section.  
     
     
         16 . A semiconductor device according to  claim 1 , wherein a memory circuit is formed in the semiconductor chip.  
     
     
         17 . A semiconductor device in which a mounting portion having a projecting cross section is formed on a case body which is applied to a part mounting surface of a substrate on which a semiconductor chip is mounted, and a recessed portion of a metal-made auxiliary piece for increasing a planar dimension of the case body is fitted on the mounting portion having the projecting cross section such that the auxiliary piece can be mounted on the case body in a replaceable manner.  
     
     
         18 . A semiconductor device in which the semiconductor device includes a resin-made case body which is applied to cover a part mounting surface of a substrate on which a semiconductor chip is mounted, and an area of the substrate is equal to or less than one half of an area of the case body.  
     
     
         19 . A semiconductor device according to  claim 18 , wherein a memory circuit is formed in the semiconductor chip.  
     
     
         20 . A method of manufacturing a semiconductor device comprising a step in which when a resin-made case body for covering a part mounting surface of a substrate on which semiconductor chip is mounted is molded, a mold in which a depth of a cavity of a lower mold which forms an inner side face of the case body is set larger than a depth of a cavity of an upper mold for forming an outer front surface of the case body is used.  
     
     
         21 . A method of manufacturing a semiconductor device according to  claim 20 , wherein a major portion of a gate which constitutes a passage when resin is allowed to flow into the cavity is formed at the lower mold side.  
     
     
         22 . A method of manufacturing a semiconductor device according to  claim 21 , wherein a thickness of the cavity portion where the gate is positioned is set larger than a thicknesses of the cavity portions above and below the cavity portion.  
     
     
         23 . A method of manufacturing a semiconductor device according to  claim 20 , wherein, in order to allow a metal-made auxiliary piece for increasing a planar dimension of the case body to be mounted on the case body in a replaceable manner, the mounting portions having a projecting cross section on which recessed portions of the auxiliary piece are fitted are formed on the case body.  
     
     
         24 . A semiconductor device comprising a case body, a groove formed on one face of the case body, a substrate which is mounted in the inside of the groove in a state that the substrate faces a part mounting surface, and a plurality of semiconductor chips which are mounted on a part mounting surface, 
 wherein, with respect to the groove and the substrate, a length along the longitudinal direction of the case body is set shorter than a total length in the longitudinal direction of the case body, and    wherein, with respect to the groove and the substrate, both corner portions positioned at the center side of the case body have corners thereof eliminated thus forming first chamfered portions.    
     
     
         25 . A semiconductor device according to  claim 24 , wherein in the first chamfered portion, the length in the direction along the longitudinal direction of the case body and a length in the direction which crosses the longitudinal direction at a right angle are set smaller than a length of an oblique surface of a second chamfered portion formed by eliminating one corner portion of the frontal face side of the case body.  
     
     
         26 . A semiconductor device according to  claim 24 , wherein in the first chamfered portion, the length in the direction along the longitudinal direction of the case body and the length in the direction which crosses the longitudinal direction at a right angle are set equal.  
     
     
         27 . A semiconductor device according to  claim 24 , wherein the first chamfered portions at both corner portions are formed to have a left-and-right symmetry from each other.  
     
     
         28 . A semiconductor device according to  claim 24 , wherein the plurality of semiconductor chips are arranged in parallel in the direction which crosses the longitudinal direction of the case body.  
     
     
         29 . A semiconductor device according to  claim 28 , wherein a third chamfered portion is formed by eliminating a corner of one corner portion at the frontal face side of the substrate, a semiconductor chip having a controller circuit is mounted on the part mounting surface in the vicinity of the third chamfered portion, and a semiconductor chip having a memory circuit whose operation is controlled by the controller circuit is mounted on the part mounting surface at a position apart from the third chamfered portion.  
     
     
         30 . A semiconductor device according to  claim 28 , wherein a third chamfered portion is formed by eliminating a corner of one corner portion at the frontal face side of the substrate, the relatively small semiconductor chip out of the plurality of semiconductor chips is mounted on the part mounting surface in the vicinity of the third chamfered portion, and the relatively large semiconductor chip out of the plurality of semiconductor chips is mounted on the part mounting surface at a position apart from the third chamfered portion.  
     
     
         31 . A semiconductor device according to  claim 30 , wherein a controller circuit is formed on the relatively small semiconductor chip, and a memory circuit whose operation is controlled by the controller circuit is formed on the relatively large semiconductor chip.  
     
     
         32 . A semiconductor device comprising a case body, a groove formed on one face of the case body, a substrate which is mounted in the inside of the groove in a state that the substrate faces a part mounting surface, and a plurality of semiconductor chips which are mounted on a part mounting surface, 
 wherein, with respect to the groove and the substrate, a length along the longitudinal direction of the case body is set shorter than a total length in the longitudinal direction of the case body, and    wherein, with respect to the groove and the substrate, indentations and projections are formed on at least a portion of a side positioned at the center side of the case body.    
     
     
         33 . A semiconductor device according to  claim 32 , wherein the plurality of semiconductor chips are arranged in parallel in a direction which crosses the longitudinal direction of the case body.  
     
     
         34 . A semiconductor device according to  claim 33 , wherein a third chamfered portion is formed by eliminating a corner of one corner portion at the frontal face side of the substrate, a semiconductor chip having a controller circuit is mounted on the part mounting surface in the vicinity of the third chamfered portion, and a semiconductor chip having a memory circuit whose operation is controlled by the controller circuit is mounted on the part mounting surface at a position apart from the third chamfered portion.  
     
     
         35 . A semiconductor device according to  claim 33 , wherein a third chamfered portion is formed by eliminating a corner of one corner portion at the frontal face side of the substrate, the relatively small semiconductor chip out of the plurality of semiconductor chips is mounted on the part mounting surface in the vicinity of the third chamfered portion, and the relatively large semiconductor chip out of the plurality of semiconductor chips is mounted on the part mounting surface at a position apart from the third chamfered portion.  
     
     
         36 . A semiconductor device according to  claim 35 , wherein a controller circuit is formed on the relatively small semiconductor chip, and a memory circuit whose operation is controlled by the controller circuit is formed on the relatively large semiconductor chip.  
     
     
         37 . A semiconductor device comprising a case body, a groove formed on one face of the case body, a substrate which is mounted in the inside of the groove in a state that the substrate faces a part mounting surface, and a plurality of semiconductor chips which are mounted on a part mounting surface, 
 wherein, with respect to the groove and the substrate, a length along the longitudinal direction of the case body is set shorter than a total length in the longitudinal direction of the case body, and    wherein the plurality of semiconductor chips are arranged in the direction which crosses the longitudinal direction of the case body.    
     
     
         38 . A semiconductor device according to  claim 37 , wherein a third chamfered portion is formed by eliminating a corner of one corner portion at the frontal face side of the substrate, a semiconductor chip having a controller circuit is mounted on the part mounting surface in the vicinity of the third chamfered portion, and a semiconductor chip having a memory circuit whose operation is controlled by the controller circuit is mounted on the part mounting surface at a position apart from the third chamfered portion.  
     
     
         39 . A semiconductor device according to  claim 37 , wherein a third chamfered portion is formed by eliminating a corner of one corner portion at the frontal face side of the substrate, the relatively small semiconductor chip out of the plurality of semiconductor chips is mounted on the part mounting surface in the vicinity of the third chamfered portion, and the relatively large semiconductor chip out of the plurality of semiconductor chips is mounted on the part mounting surface at a position apart from the third chamfered portion.  
     
     
         40 . A semiconductor device according to  claim 39 , wherein a controller circuit is formed on the relatively small semiconductor chip and a memory circuit whose operation is controlled by the controller circuit is formed on the relatively large semiconductor chip.  
     
     
         41 . A method of manufacturing a semiconductor device comprising the steps of: 
 (a) preparing a substrate forming body integrally having a plurality of substrates therewith;    (b) mounting a plurality of semiconductor chips on a part mounting surface of each substrate of the substrate forming body;    (c) electrically connecting the plurality of semiconductor chips to the substrate on each substrate;    (d) sealing the plurality of semiconductor chips on each substrate;    (e) cutting each substrate from the substrate forming body after the step (d);    (f) mounting the substrate after the step (e) on a first case body; and    (g) mounting the substrate after the step (e) on a second case body whose planar surface dimension is smaller than a planar surface dimension of the first case, wherein the step (f) includes the steps of: 
 (f1) preparing a first case having a first groove which is formed on a face of the first case body for mounting the substrate, wherein with respect to the groove, a length of a side along the longitudinal direction of the first case body is set shorter than a total length in the longitudinal direction of the first case body; and  
 (f2) mounting the substrate in the inside of the first groove in a state that the part mounting surface faces the first groove, and the step (g) includes the steps of:  
 (g1) preparing the second case body having a second groove similar to the first groove; and  
 (g2) mounting the substrate in the inside of the second groove in a state that the part mounting surface faces the second groove.  
   
     
     
         42 . A method of manufacturing a semiconductor device according to  claim 41 , wherein a planar dimension of the second case is set one half of a planar dimension of the first case.  
     
     
         43 . A method of manufacturing a semiconductor device according to  claim 41 , wherein first chamfered portions are formed by eliminating corners on the first and second grooves and both corner portions positioned at the center side of the first case body of each substrate.  
     
     
         44 . A method of manufacturing a semiconductor device according to  claim 41 , wherein indentations and projections are formed on the first and second grooves and at least a portion of a side which is positioned at the center side of the first case body of each substrate.  
     
     
         45 . A method of manufacturing a semiconductor device according to  claim 41 , wherein in the step (b), the plurality of semiconductor chips are mounted so as to be arranged in parallel along the longitudinal direction of each substrate.  
     
     
         46 . A method of manufacturing a semiconductor device according to  claim 45 , wherein a third chamfered portion is formed by eliminating a corner of one corner portion at the frontal face side of the substrate, a semiconductor chip having a controller circuit is mounted on the part mounting surface in the vicinity of the third chamfered portion, and a semiconductor chip having a memory circuit whose operation is controlled by the controller circuit is mounted on the part mounting surface at a position apart from the third chamfered portion.  
     
     
         47 . A method of manufacturing a semiconductor device according to  claim 45 , wherein a third chamfered portion is formed by eliminating a corner of one corner portion at the frontal face side of the substrate, the relatively small semiconductor chip out of the plurality of semiconductor chips is mounted on the part mounting surface in the vicinity of the third chamfered portion, and the relatively large semiconductor chip out of the plurality of semiconductor chips is mounted on the part mounting surface at a position apart from the third chamfered portion.  
     
     
         48 . A method of manufacturing a semiconductor device according to  claim 47 , wherein a controller circuit is formed on the relatively small semiconductor chip, and a memory circuit whose operation is controlled by the controller circuit is formed on the relatively large semiconductor chip.  
     
     
         49 . A multi media card comprising: 
 a card body having: 
 a base substrate having a plurality of external terminals formed on one surface thereof;  
 a first semiconductor chip disposed on the other surface of said base substrate and being electrically connected to said plurality of external terminals, said first semiconductor chip including a control circuit;  
 a second semiconductor chip disposed on the other surface of said base substrate and being electrically connected to said first semiconductor chip, said second semiconductor chip including a memory circuit which is under said control circuit of said first semiconductor chip; and  
 a cap member formed on the other surface of said base substrate to cover said first and second semiconductor chips;  
 wherein said first semiconductor chip is arranged between said plurality of external terminals of said base substrate and said second semiconductor chip in a plane view.  
   
     
     
         50 . A multi media card according to  claim 49 , wherein said second semiconductor chip includes a flash memory circuit.  
     
     
         51 . A multi media card according to  claim 50 , further comprising a third semiconductor chip including the same function as that of said second semiconductor chip, and wherein said third semiconductor chip is stacked on said second semiconductor chip.  
     
     
         52 . A multi media card according to  claim 51 , wherein each of said second and third semiconductor chips includes a plurality of bonding pads, and wherein said plurality of bonding pads of each of said second and third semiconductor chips are electrically connected to a plurality of electrodes formed on the other surface of said base substrate via a plurality of first bonding wires.  
     
     
         53 . A multi media card according to  claim 52 , wherein said first semiconductor chip includes a plurality of bonding pads, and wherein said plurality of bonding pads of said first semiconductor chip are electrically connected to said plurality of electrodes formed on the other surface of said base substrate via a plurality of second bonding wires.