Apparatus for polishing semiconductor wafer

Abstract

A wafer planarizing apparatus includes a cleaner that prevents contamination caused by a fume phenomenon occurring when slurry is cleaned from a base of a polishing station. The cleaner has spout holes through which a cleaning solution is applied to a side of a platen of the polishing station. As the cleaning solution flows along the side of the platen, the side of the platen is cleaned. Beneficially, a main body of the cleaner has an arch-shaped upper side so as to stream down foreign materials.

What is claimed is:  
     
         1 . A wafer planarizing apparatus comprising: 
 a polishing station with a base on which a platen having a polishing pad is placed;    a polishing head for polishing a wafer on the polishing pad of the platen; and    a cleaner disposed upon the base of the polishing station,    wherein the cleaner has a main body and a first cleaning unit installed in the main body, the first cleaning unit being adapted to clean a side of the platen.    
     
     
         2 . The wafer planarizing apparatus of  claim 1 , wherein the first cleaning unit includes at least one spout hole adapted to pour a cleaning solution to the side of the platen such that the cleaning solution flows along the side of the platen.  
     
     
         3 . The wafer planarizing apparatus of  claim 2 , wherein the spout hole is formed in the main body adjacent to the side of the platen.  
     
     
         4 . The wafer planarizing apparatus of  claim 1 , wherein the main body is located between adjacent platens.  
     
     
         5 . The wafer planarizing apparatus of  claim 1 , wherein the main body has an arch-shaped upper side.  
     
     
         6 . The wafer planarizing apparatus of  claim 1 , wherein the main body has an inclined upper side so as to stream down foreign materials.  
     
     
         7 . The wafer planarizing apparatus of  claim 1 , wherein the cleaner further includes: 
 a second cleaning unit adapted to clean the base of the polishing station; and    a third cleaning unit adapted to clean a polished surface of a wafer supported by the polishing head and a carrier head.    
     
     
         8 . The wafer planarizing apparatus of  claim 7 , wherein the second cleaning unit includes second nozzles disposed at a side of the main body.  
     
     
         9 . The wafer planarizing apparatus of  claim 7 , wherein the main body has an arch-shaped upper side, and the third cleaning unit includes a plurality of third nozzles disposed at the arch-shaped upper side.  
     
     
         10 . The wafer planarizing apparatus of  claim 7 , wherein the cleaner further includes: 
 a first waterway fluid pathway disposed in the main body and connected to the first and second cleaning units;    a second fluid pathway disposed in the main body and connected to the third cleaning unit; and    first and second cleaning solution supply pipes that are coupled to the first and second fluid pathways to supply a cleaning solution, respectively.    
     
     
         11 . The wafer planarizing apparatus of  claim 10 , wherein the first cleaning solution supply pipe supplies the cleaning solution in a manual manner.  
     
     
         12 . The wafer planarizing apparatus of  claim 1 , wherein the cleaning solution employs deionized water (DI water).  
     
     
         13 . A wafer planarizing apparatus, comprising: 
 a polishing station, comprising, 
 a base,  
 a platen mounted on the base, the platen having a polishing means thereon; and  
   a polishing head adapted to polish a wafer on the polishing means; and    a cleaner disposed on the base of the polishing station, the cleaner having a first cleaning unit adapted to apply a cleaning solution to clean a side of the platen.    
     
     
         14 . The apparatus of  claim 13 , wherein the cleaner includes a main body having an upper side that is arched.  
     
     
         15 . The apparatus of  claim 13 , wherein the cleaner further comprises a second cleaning unit adapted to clean the base of the polishing station.  
     
     
         16 . The apparatus of  claim 15 , wherein the cleaner further comprises a third cleaning unit adapted to clean a polished surface of a wafer.  
     
     
         17 . The apparatus of  claim 16 , wherein the cleaner further includes: 
 a first fluid pathway connected to the first and second cleaning units; and    a second fluid pathway connected to the third cleaning unit.    
     
     
         18 . The apparatus of  claim 13 , wherein the cleaner further includes a fluid pathway connected between the first cleaning unit and a cleaning solution supply pipe.  
     
     
         19 . The apparatus of  claim 13 , wherein the cleaner comprises a main housing and the first cleaning unit includes a main spout formed in the housing.