US2003108746A1PendingUtilityA1
Halogen free flame retardant adhesive resin coated composite
Priority: Mar 31, 2000Filed: Mar 30, 2001Published: Jun 12, 2003
Est. expiryMar 31, 2020(expired)· nominal 20-yr term from priority
C09J 163/00C09J 2463/00H05K 2201/0209C08K 2003/026H05K 2203/122H05K 1/0373C08K 5/0066H05K 2201/012C08K 5/5333C08K 5/34928C08K 3/016C09J 7/28C08K 5/523C09J 11/06C08K 3/02Y10T428/31529Y10T428/31511
41
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Claims
Abstract
Fire resistant adhesive resins that include a halogen-free and bromine-free flame retardant ingredient and conductive foils coated with the halogen-free fire resistant adhesive resin coated compositions of this invention as well as printed circuit boards manufactured using the adhesive resin coated conductive foils.
Claims
exact text as granted — not AI-modifiedWe claim:
1 . A flame-retardant adhesive resin composition comprising:
at least one resin; and at least one halogen-free flame retardant composition wherein the resin composition includes essentially no halogen containing flame-retardant compositions.
2 . The flame-retardant adhesive resin composition of claim 1 wherein the resin is an epoxy resin.
3 . The flame-retardant adhesive resin composition of claim 1 wherein the halogen-free flame retardant composition is selected from the group consisting of melamine cyanurate, melamine cyanurate encapsulated red phosphorous, phosphoric acid, 1,3-phenylenetetraphenyl ester, Di-polyoxyethylene, hydroxymethylphosphonate, aluminum trihydrate, and mixtures thereof.
4 . The flame-retardant adhesive resin composition of claim 1 wherein the halogen-free flame retardant composition is melamine cyanurate.
5 . The flame-retardant adhesive resin composition of claim 4 wherein the melamine cyanurate is present in the composition in an amount ranging from about 10 to about 20 wt %.
6 . The flame-retardant adhesive resin composition of claim 1 wherein the halogen-free flame retardant is melamine cyanurate which is present in the composition in an amount ranging from about 12 to about 17 wt %.
7 . The flame-retardant adhesive resin composition of claim 1 wherein the halogen-free flame retardant is melamine cyanurate having a particle size of from 1 to about 20 microns.
8 . The flame-retardant adhesive resin composition of claim 7 wherein the melamine cyanurate particle size is less than about 12 microns.
9 . The flame-retardant adhesive resin composition comprising at least one resin and from about 12 to about 17 wt % melamine cyanurate having a particle size of from about 1 micron to about 12 microns.
10 . The flame-retardant adhesive resin composition of claim 1 wherein the halogen-free flame retardant composition is aluminum trihydrate.
11 . The flame-retardant adhesive resin composition of claim 10 wherein the aluminum trihydrate is present in the composition in an amount ranging from about 20 to about 30 wt %.
12 . The flame-retardant adhesive resin composition of claim 10 wherein the aluminum trihydrate is present in the composition in an amount ranging from about 23 to about 28 wt %.
13 . The flame-retardant adhesive resin composition of claim 10 wherein the aluminum trihydrate has an average particle size of from 0.1 to about 20 microns.
14 . The flame-retardant adhesive resin composition of claim 10 wherein the aluminum trihydrate has an average particle size of from about 1 to about 10 microns.
15 . The flame-retardant adhesive resin composition of claim 10 wherein the aluminum trihydrate has an average particle size of about 1.5 to about 2.0 microns.
16 . The flame-retardant adhesive resin composition of claim 10 wherein the aluminum trihydrate has an average particle size of about 1.8 microns.
17 . The flame-retardant adhesive resin composition of claim 10 wherein the aluminum trihydrate has the following formula Al 2 O 3 ×nH 2 O where n ranges from about 2.4 to about 3.
18 . The flame-retardant adhesive resin composition of claim 17 wherein n ranges from about 2.6 to about 2.9.
19 . The flame-retardant adhesive resin composition of claim 17 wherein n is about 2.7.
20 . An adhesive resin coated conductive metal foil having a first surface and a second surface wherein the first surface includes a flame-retardant resin layer comprising at least one resin, and at least one halogen-free flame retardant composition wherein the resin composition includes essentially no halogen containing flame-retardant compositions.
21 . The adhesive resin coated conductive metal foil of claim 20 wherein the conductive metal is copper.
22 . The adhesive resin coated conductive metal foil of claim 20 wherein the resin has a thickness of from about 35 to about 100 microns.
23 . The adhesive resin coated conductive metal foil of claim 20 wherein the resin is applied as a single layer having a thickness of from about 20 to about 100 microns.
24 . The adhesive resin coated conductive metal foil of claim 20 wherein the resin layer includes a first resin layer and a second resin layer wherein the first resin layer is at least partially cured before the second resin layer is applied to the top of the first resin layer.
25 . The adhesive resin coated conductive metal foil of claim 20 wherein the flame-retardant resin includes at least one epoxy resin.
26 . The adhesive resin coated conductive metal foil of claim 20 wherein the resin halogen-free flame retardant is selected from the group consisting of melamine cyanurate, melamine cyanurate encapsulated red phosphorous, phosphoric acid, 1,3-phenylenetetraphenyl ester, Di-polyoxyethylene, hydroxymethylphosphonate, aluminum trihydrate, and mixtures thereof.
27 . The adhesive resin coated conductive metal foil of claim 20 wherein the halogen-free flame retardant composition is melamine cyanurate.
28 . The adhesive resin coated conductive metal foil of claim 20 wherein the halogen-free flame retardant is present in the resin composition in an amount ranging from about 10 to about 30 wt %.
29 . The flame-retardant adhesive resin composition of claim 20 wherein the halogen-free flame retardant is melamine cyanurate which is present in the composition in an amount ranging from about 12 to about 17 wt %.
30 . The flame-retardant adhesive resin composition of claim 20 wherein the halogen-free flame retardant is melamine cyanurate having a particle size of from 1 to about 20 microns.
31 . The flame-retardant adhesive resin composition of claim 30 wherein the melamine cyanurate particle size is less than about 12 microns.
32 . The flame-retardant adhesive resin:composition of claim 20 comprising at least one resin and from about 12 to about 17 wt % melamine cyanurate having a particle size of from about 1 micron to about 12 microns.
33 . The flame-retardant adhesive resin composition of claim 20 wherein the halogen-free flame retardant composition is aluminum trihydrate.
34 . The flame-retardant adhesive resin composition of claim 33 wherein the aluminum trihydrate is present in the composition in an amount ranging from about 20 to about 30 wt %.
35 . The flame-retardant adhesive resin composition of claim 33 wherein the aluminum trihydrate is present in the composition in an amount ranging from about 23 to about 28 wt %.
36 . The flame-retardant adhesive resin composition of claim 20 wherein the aluminum trihydrate has an average particle size of from 0.1 to about 20 microns.
37 . The flame-retardant adhesive resin composition of claim 20 , wherein the aluminum trihydrate has an average particle size of from about 1 to about 10 microns.
38 . The flame-retardant adhesive resin composition of claim 20 wherein the aluminum trihydrate has an average particle size of about 1.5 to about 2.0 microns.
39 . The flame-retardant adhesive resin composition of claim 20 wherein the aluminum trihydrate has an average particle size of about 1.8 microns.
40 . The flame-retardant adhesive resin compositions of claim 20 wherein the aluminum trihydrate has the following formula Al 2 O 3 ×nH 2 O where n ranges from about 2.4 to about 3.
41 . The flame-retardant adhesive resin composition of claim 40 where n ranges from about 2.6 to about 2.9.
42 . The flame-retardant adhesive resin composition of claim 40 wherein n is about 2.7.
43 . A printed circuit board including the adhesive resin coated conductive metal foil of claim 20.Join the waitlist — get patent alerts
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