US2003108746A1PendingUtilityA1

Halogen free flame retardant adhesive resin coated composite

Priority: Mar 31, 2000Filed: Mar 30, 2001Published: Jun 12, 2003
Est. expiryMar 31, 2020(expired)· nominal 20-yr term from priority
C09J 163/00C09J 2463/00H05K 2201/0209C08K 2003/026H05K 2203/122H05K 1/0373C08K 5/0066H05K 2201/012C08K 5/5333C08K 5/34928C08K 3/016C09J 7/28C08K 5/523C09J 11/06C08K 3/02Y10T428/31529Y10T428/31511
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Claims

Abstract

Fire resistant adhesive resins that include a halogen-free and bromine-free flame retardant ingredient and conductive foils coated with the halogen-free fire resistant adhesive resin coated compositions of this invention as well as printed circuit boards manufactured using the adhesive resin coated conductive foils.

Claims

exact text as granted — not AI-modified
We claim:  
     
         1 . A flame-retardant adhesive resin composition comprising: 
 at least one resin; and    at least one halogen-free flame retardant composition wherein the resin composition includes essentially no halogen containing flame-retardant compositions.    
     
     
         2 . The flame-retardant adhesive resin composition of  claim 1  wherein the resin is an epoxy resin.  
     
     
         3 . The flame-retardant adhesive resin composition of  claim 1  wherein the halogen-free flame retardant composition is selected from the group consisting of melamine cyanurate, melamine cyanurate encapsulated red phosphorous, phosphoric acid, 1,3-phenylenetetraphenyl ester, Di-polyoxyethylene, hydroxymethylphosphonate, aluminum trihydrate, and mixtures thereof.  
     
     
         4 . The flame-retardant adhesive resin composition of  claim 1  wherein the halogen-free flame retardant composition is melamine cyanurate.  
     
     
         5 . The flame-retardant adhesive resin composition of  claim 4  wherein the melamine cyanurate is present in the composition in an amount ranging from about 10 to about 20 wt %.  
     
     
         6 . The flame-retardant adhesive resin composition of  claim 1  wherein the halogen-free flame retardant is melamine cyanurate which is present in the composition in an amount ranging from about 12 to about 17 wt %.  
     
     
         7 . The flame-retardant adhesive resin composition of  claim 1  wherein the halogen-free flame retardant is melamine cyanurate having a particle size of from 1 to about 20 microns.  
     
     
         8 . The flame-retardant adhesive resin composition of  claim 7  wherein the melamine cyanurate particle size is less than about 12 microns.  
     
     
         9 . The flame-retardant adhesive resin composition comprising at least one resin and from about 12 to about 17 wt % melamine cyanurate having a particle size of from about 1 micron to about 12 microns.  
     
     
         10 . The flame-retardant adhesive resin composition of claim 1 wherein the halogen-free flame retardant composition is aluminum trihydrate.  
     
     
         11 . The flame-retardant adhesive resin composition of  claim 10  wherein the aluminum trihydrate is present in the composition in an amount ranging from about 20 to about 30 wt %.  
     
     
         12 . The flame-retardant adhesive resin composition of  claim 10  wherein the aluminum trihydrate is present in the composition in an amount ranging from about 23 to about 28 wt %.  
     
     
         13 . The flame-retardant adhesive resin composition of  claim 10  wherein the aluminum trihydrate has an average particle size of from 0.1 to about 20 microns.  
     
     
         14 . The flame-retardant adhesive resin composition of  claim 10  wherein the aluminum trihydrate has an average particle size of from about 1 to about 10 microns.  
     
     
         15 . The flame-retardant adhesive resin composition of  claim 10  wherein the aluminum trihydrate has an average particle size of about 1.5 to about 2.0 microns.  
     
     
         16 . The flame-retardant adhesive resin composition of  claim 10  wherein the aluminum trihydrate has an average particle size of about 1.8 microns.  
     
     
         17 . The flame-retardant adhesive resin composition of  claim 10  wherein the aluminum trihydrate has the following formula Al 2 O 3 ×nH 2 O where n ranges from about 2.4 to about 3.  
     
     
         18 . The flame-retardant adhesive resin composition of  claim 17  wherein n ranges from about 2.6 to about 2.9.  
     
     
         19 . The flame-retardant adhesive resin composition of  claim 17  wherein n is about 2.7.  
     
     
         20 . An adhesive resin coated conductive metal foil having a first surface and a second surface wherein the first surface includes a flame-retardant resin layer comprising at least one resin, and at least one halogen-free flame retardant composition wherein the resin composition includes essentially no halogen containing flame-retardant compositions.  
     
     
         21 . The adhesive resin coated conductive metal foil of  claim 20  wherein the conductive metal is copper.  
     
     
         22 . The adhesive resin coated conductive metal foil of  claim 20  wherein the resin has a thickness of from about 35 to about 100 microns.  
     
     
         23 . The adhesive resin coated conductive metal foil of  claim 20  wherein the resin is applied as a single layer having a thickness of from about 20 to about 100 microns.  
     
     
         24 . The adhesive resin coated conductive metal foil of  claim 20  wherein the resin layer includes a first resin layer and a second resin layer wherein the first resin layer is at least partially cured before the second resin layer is applied to the top of the first resin layer.  
     
     
         25 . The adhesive resin coated conductive metal foil of  claim 20  wherein the flame-retardant resin includes at least one epoxy resin.  
     
     
         26 . The adhesive resin coated conductive metal foil of  claim 20  wherein the resin halogen-free flame retardant is selected from the group consisting of melamine cyanurate, melamine cyanurate encapsulated red phosphorous, phosphoric acid, 1,3-phenylenetetraphenyl ester, Di-polyoxyethylene, hydroxymethylphosphonate, aluminum trihydrate, and mixtures thereof.  
     
     
         27 . The adhesive resin coated conductive metal foil of  claim 20  wherein the halogen-free flame retardant composition is melamine cyanurate.  
     
     
         28 . The adhesive resin coated conductive metal foil of  claim 20  wherein the halogen-free flame retardant is present in the resin composition in an amount ranging from about 10 to about 30 wt %.  
     
     
         29 . The flame-retardant adhesive resin composition of  claim 20  wherein the halogen-free flame retardant is melamine cyanurate which is present in the composition in an amount ranging from about 12 to about 17 wt %.  
     
     
         30 . The flame-retardant adhesive resin composition of  claim 20  wherein the halogen-free flame retardant is melamine cyanurate having a particle size of from 1 to about 20 microns.  
     
     
         31 . The flame-retardant adhesive resin composition of  claim 30  wherein the melamine cyanurate particle size is less than about 12 microns.  
     
     
         32 . The flame-retardant adhesive resin:composition of  claim 20  comprising at least one resin and from about 12 to about 17 wt % melamine cyanurate having a particle size of from about 1 micron to about 12 microns.  
     
     
         33 . The flame-retardant adhesive resin composition of  claim 20  wherein the halogen-free flame retardant composition is aluminum trihydrate.  
     
     
         34 . The flame-retardant adhesive resin composition of  claim 33  wherein the aluminum trihydrate is present in the composition in an amount ranging from about 20 to about 30 wt %.  
     
     
         35 . The flame-retardant adhesive resin composition of  claim 33  wherein the aluminum trihydrate is present in the composition in an amount ranging from about 23 to about 28 wt %.  
     
     
         36 . The flame-retardant adhesive resin composition of  claim 20  wherein the aluminum trihydrate has an average particle size of from 0.1 to about 20 microns.  
     
     
         37 . The flame-retardant adhesive resin composition of  claim 20 , wherein the aluminum trihydrate has an average particle size of from about 1 to about 10 microns.  
     
     
         38 . The flame-retardant adhesive resin composition of  claim 20  wherein the aluminum trihydrate has an average particle size of about 1.5 to about 2.0 microns.  
     
     
         39 . The flame-retardant adhesive resin composition of  claim 20  wherein the aluminum trihydrate has an average particle size of about 1.8 microns.  
     
     
         40 . The flame-retardant adhesive resin compositions of  claim 20  wherein the aluminum trihydrate has the following formula Al 2 O 3 ×nH 2 O where n ranges from about 2.4 to about 3.  
     
     
         41 . The flame-retardant adhesive resin composition of  claim 40  where n ranges from about 2.6 to about 2.9.  
     
     
         42 . The flame-retardant adhesive resin composition of  claim 40  wherein n is about 2.7.  
     
     
         43 . A printed circuit board including the adhesive resin coated conductive metal foil of  claim 20.

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