US2003106800A1PendingUtilityA1

Rigidified mesh structure and process for obtaining same

Priority: Dec 11, 2001Filed: Dec 10, 2002Published: Jun 12, 2003
Est. expiryDec 11, 2021(expired)· nominal 20-yr term from priority
C25D 7/005
16
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

The rigidified mesh structure includes filaments of at least one of metal and non-metal assembled in a mesh configuration, wherein the filaments are configured in a rigid structure by plating with metal. Desirably, the filaments include adjacent contact points which are fused together by the plated metal.

Claims

exact text as granted — not AI-modified
What is claimed:  
     
         1 . A rigid mesh structure, which comprises: filaments of at least one of metal and non-metal assembled in a mesh configuration; wherein said filaments are configured in a rigid mesh structure by plating with metal.  
     
     
         2 . A rigid structure according to  claim 1 , wherein said filaments in said mesh configuration include adjacent contact points which are fused together by said plated metal.  
     
     
         3 . A rigid structure according to  claim 2 , wherein said filaments are plated by electrodeposition with metal.  
     
     
         4 . A rigid structure according to  claim 2 , wherein said filaments are plated by electroless metal deposition.  
     
     
         5 . A rigid structure according to  claim 2 , wherein said rigid mesh structure is one of an article of jewelry and an ornamental product.  
     
     
         6 . A rigid structure according to  claim 3 , wherein said plated metal is in a work hardened state.  
     
     
         7 . A rigid structure according to  claim 2 , wherein said filaments are one of glass and plastic.  
     
     
         8 . A rigid structure according to  claim 2 , wherein said filaments are one of braided and knitted.  
     
     
         9 . A rigid structure according to  claim 2 , wherein said filaments are one of glass, plastic metal wire and metal filaments.  
     
     
         10 . A rigid structure according to  claim 9 , wherein said filaments have a gage of 0.003 to 0.01 inch, and said plating has a thickness of 0.005 to 0.05 inch.  
     
     
         11 . A method for forming a rigid mesh structure, which comprises: assembling filaments of at least one of metal and non-metal in a mesh configuration; and plating said filaments with metal to form a rigid mesh structure.  
     
     
         12 . A method according to  claim 11 , wherein said filaments are assembled in a mesh configuration with adjacent contact points, and including the step of fusing said adjacent contact points together by said plated metal.  
     
     
         13 . A method according to  claim 12 , including the step of plating said filaments by electrodeposition with metal.  
     
     
         14 . A method according to  claim 12 , including the step of plating said filaments by electroless metal deposition.  
     
     
         15 . A method according to  claim 12 , including the step of forming one of a rigid mesh article of jewelry and a rigid mesh ornamental product.  
     
     
         16 . A method according to  claim 12 , including the step of assembling filaments of one of glass, plastic, metal wire and metal filaments.  
     
     
         17 . A method according to  claim 12 , including the step of assembling filaments in one of a braided and knitted configuration.  
     
     
         18 . A method according to  claim 16 , wherein said filaments have a gage of 0.003 to 0.01 inch, and said plating has a thickness of 0.005 to 0.05 inch.

Join the waitlist — get patent alerts

Track US2003106800A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.