US2003106800A1PendingUtilityA1
Rigidified mesh structure and process for obtaining same
Priority: Dec 11, 2001Filed: Dec 10, 2002Published: Jun 12, 2003
Est. expiryDec 11, 2021(expired)· nominal 20-yr term from priority
Inventors:Jordan Schlanger
C25D 7/005
16
PatentIndex Score
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Cited by
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Claims
Abstract
The rigidified mesh structure includes filaments of at least one of metal and non-metal assembled in a mesh configuration, wherein the filaments are configured in a rigid structure by plating with metal. Desirably, the filaments include adjacent contact points which are fused together by the plated metal.
Claims
exact text as granted — not AI-modifiedWhat is claimed:
1 . A rigid mesh structure, which comprises: filaments of at least one of metal and non-metal assembled in a mesh configuration; wherein said filaments are configured in a rigid mesh structure by plating with metal.
2 . A rigid structure according to claim 1 , wherein said filaments in said mesh configuration include adjacent contact points which are fused together by said plated metal.
3 . A rigid structure according to claim 2 , wherein said filaments are plated by electrodeposition with metal.
4 . A rigid structure according to claim 2 , wherein said filaments are plated by electroless metal deposition.
5 . A rigid structure according to claim 2 , wherein said rigid mesh structure is one of an article of jewelry and an ornamental product.
6 . A rigid structure according to claim 3 , wherein said plated metal is in a work hardened state.
7 . A rigid structure according to claim 2 , wherein said filaments are one of glass and plastic.
8 . A rigid structure according to claim 2 , wherein said filaments are one of braided and knitted.
9 . A rigid structure according to claim 2 , wherein said filaments are one of glass, plastic metal wire and metal filaments.
10 . A rigid structure according to claim 9 , wherein said filaments have a gage of 0.003 to 0.01 inch, and said plating has a thickness of 0.005 to 0.05 inch.
11 . A method for forming a rigid mesh structure, which comprises: assembling filaments of at least one of metal and non-metal in a mesh configuration; and plating said filaments with metal to form a rigid mesh structure.
12 . A method according to claim 11 , wherein said filaments are assembled in a mesh configuration with adjacent contact points, and including the step of fusing said adjacent contact points together by said plated metal.
13 . A method according to claim 12 , including the step of plating said filaments by electrodeposition with metal.
14 . A method according to claim 12 , including the step of plating said filaments by electroless metal deposition.
15 . A method according to claim 12 , including the step of forming one of a rigid mesh article of jewelry and a rigid mesh ornamental product.
16 . A method according to claim 12 , including the step of assembling filaments of one of glass, plastic, metal wire and metal filaments.
17 . A method according to claim 12 , including the step of assembling filaments in one of a braided and knitted configuration.
18 . A method according to claim 16 , wherein said filaments have a gage of 0.003 to 0.01 inch, and said plating has a thickness of 0.005 to 0.05 inch.Join the waitlist — get patent alerts
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