Semiconductor substrate cleaning apparatus, method of cleaning semiconductor substrate and method of manufacturing semiconductor device

Abstract

A semiconductor substrate cleaning apparatus, a method of cleaning a semiconductor substrate and a method of manufacturing a semiconductor device are obtained, in which reduction of production yield of a semiconductor device can be prevented. The semiconductor substrate cleaning apparatus includes a holding member holding a semiconductor substrate and a cleaning member allowing a cleaning medium to be supplied only to a part of a surface of the semiconductor substrate while the semiconductor substrate held by the holding member is fixed. In such a manner, the cleaning medium is supplied to the semiconductor substrate while the semiconductor substrate is not rotated but fixed, whereby only a part of the surface of the semiconductor substrate can be cleaned.

What is claimed is:  
     
         1 . A semiconductor substrate cleaning apparatus, comprising: 
 a holding member holding a semiconductor substrate; and    a cleaning member allowing a cleaning medium to be supplied only to a part of a surface of said semiconductor substrate while said semiconductor substrate held by said holding member is fixed.    
     
     
         2 . The semiconductor substrate cleaning apparatus according to  claim 1 , wherein 
 said cleaning medium includes at least one selected from the group consisting of cleaning chemicals and pure water.    
     
     
         3 . The semiconductor substrate cleaning apparatus according to  claim 1 , wherein 
 said cleaning member includes at least one selected from the group consisting of means for supplying ultrasonically vibrated said cleaning medium and means for supplying pressurized said cleaning medium, to the part of the surface of said semiconductor substrate.    
     
     
         4 . The semiconductor substrate cleaning apparatus according to  claim 1 , wherein 
 said cleaning member includes 
 a nozzle for supplying said cleaning medium to the surface of said semiconductor substrate, and  
 position determining means for determining a relative position of said nozzle to the surface of said semiconductor substrate based on coordinate data of said part to be supplied with said cleaning medium, of the surface of said semiconductor substrate.  
   
     
     
         5 . The semiconductor substrate cleaning apparatus according to  claim 1 , further comprising rinsing means for washing said cleaning medium away from the surface of said semiconductor substrate.  
     
     
         6 . The semiconductor substrate cleaning apparatus according to  claim 5 , wherein 
 said rinsing means includes means for supplying a rinsing medium to the surface of said semiconductor substrate, and    said cleaning member supplies said cleaning medium only to the part of the surface of said semiconductor substrate while the surface of said semiconductor substrate is supplied with the rinsing medium.    
     
     
         7 . A method of cleaning a semiconductor substrate, comprising the steps of: 
 providing a semiconductor substrate; and    cleaning by supplying a cleaning medium only to a part of a surface of said semiconductor substrate while supplying a rinsing medium to the surface of said semiconductor substrate with said semiconductor substrate being fixed.    
     
     
         8 . The method of cleaning a semiconductor substrate according to  claim 7 , wherein 
 said cleaning medium includes at least one selected from the group consisting of cleaning chemicals and pure water.    
     
     
         9 . The method of cleaning a semiconductor substrate according to  claim 7 , wherein 
 said step of cleaning includes at least one selected from the group consisting of the step of supplying ultrasonically vibrated said cleaning medium and the step of supplying pressurized said cleaning medium, to the part of the surface of said semiconductor substrate.    
     
     
         10 . A method of manufacturing a semiconductor device using the method of cleaning a semiconductor substrate according to  claim 7 .  
     
     
         11 . A method of cleaning a semiconductor substrate, comprising the steps of: 
 providing a semiconductor substrate;    providing a medium tank holding a cleaning medium for cleaning a surface of the semiconductor substrate; and    dipping only an end portion of said semiconductor substrate into said cleaning medium held in said medium tank.