Silicon composition and electrically conductive silicone adhesive formed therefrom

Abstract

A silicone composition for preparing a silicone adhesive, the composition prepared by mixing (A) an organopolysiloxane containing an average of at least two silicon-bonded hydroxy groups per molecule; (B) a crosslinking agent in an amount sufficient to cure the composition; wherein the agent is selected from (i) at least one silane having the formula R 2 n SiX 4-n wherein each R 2 is independently selected from monovalent hydrocarbon and monovalent halogenated hydrocarbon groups having from 1 to about 8 carbon atoms, n is 0 or 1, and X is —OR 2 or —OCH 2 CH 2 OR 2 ; (ii) a partial hydrolyzate of (i), and (iii) mixtures comprising (i) and (ii); (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone adhesive, wherein the filler comprises particles having at least an outer surface of a metal selected from the group consisting of silver, gold, platinum, palladium, and alloys thereof; (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound does not substantially inhibit cure of the composition; and (E) a catalytic amount of a condensation catalyst comprising a metal salt of a carboxylic acid. A silicone adhesive and a multi-part curable silicone composition.

That which is claimed is:  
     
         1 . A curable silicone composition for preparing a silicone adhesive, the composition prepared by mixing: 
 (A) an organopolysiloxane containing an average of at least two silicon-bonded hydroxy groups per molecule;    (B) a crosslinking agent in an amount sufficient to cure the composition; wherein the agent is selected from (i) at least one silane having the formula R 2   n SiX 4-n  wherein each R 2  is independently selected from monovalent hydrocarbon and monovalent halogenated hydrocarbon groups having from 1 to about 8 carbon atoms, n is 0 or 1, and X is —OR 2  or —OCH 2 CH 2 OR 2 ; (ii) a partial hydrolyzate of (i), and (iii) mixtures comprising (i) and (ii);    (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone adhesive, wherein the filler comprises particles having at least an outer surface of a metal selected from the group consisting of silver, gold, platinum, palladium, and alloys thereof;    (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound does not substantially inhibit cure of the composition; and    (E) a catalytic amount of a condensation catalyst comprising a metal salt of a carboxylic acid.    
     
     
         2 . The silicone composition according to  claim 1 , wherein the organopolysiloxane is a hydroxy-terminated polydiorganosiloxane having the general formula HOR 1   2 SiO(R 1   2 SiO) m SiR 1   2 OH wherein each R 1  is independently selected from monovalent hydrocarbon and monovalent halogenated hydrocarbon groups and m has a value such that the viscosity of the polydiorganosiloxane at 25° C. is from 0.05 to 200 Pa·s.  
     
     
         3 . The silicone composition according to  claim 1 , wherein R 2  in the crosslinking agent is selected from methyl, ethyl, and propyl.  
     
     
         4 . The silicone composition according to  claim 1 , wherein the concentration of the crosslinking agent is sufficient to provide from 1.0 to 3.0 silicon-bonded —OR 2  or —OCH 2 CH 2 OR 2  groups per hydroxy group in component (A).  
     
     
         5 . The silicone composition according to  claim 1 , wherein the filler has a concentration from about 20 to about 50 percent by volume, based on the total volume of the composition.  
     
     
         6 . The silicone composition according to  claim 1 , wherein the composition cures at a temperature of from about room temperature to about 150° C.  
     
     
         7 . The silicone composition according to  claim 6 , wherein the hydroxy-functional organic compound has a normal boiling point greater than the cure temperature of the composition.  
     
     
         8 . The silicone composition according to  claim 1 , wherein the hydroxy-functional organic compound is selected from at least one monohydric alcohol, at least one dihydric alcohol, at least one polyhydric alcohol, at least one phenol, at least one sugar, at least one hydroxy aldehyde, at least one hydroxy ketone, at least one hydroxy acid, at least one hydroxy ester, and a mixture comprising at least two of the aforementioned compounds.  
     
     
         9 . The silicone composition according to  claim 8 , wherein the hydroxy-functional organic compound is selected from at least one monohydric alcohol, at least one dihydric alcohol, at least one polyhydric alcohol, and a mixture comprising at least two of the aforementioned compounds.  
     
     
         10 . The silicone composition according to  claim 1 , wherein the concentration of component (D) is from 0.5 to 1.5 percent by weight, based on the total weight of the composition.  
     
     
         11 . The silicone composition according to  claim 1 , wherein the condensation catalyst comprises a metal salt of a carboxylic acid selected from a tin salt, a lead salt, and a zinc salt.  
     
     
         12 . The silicone composition according to  claim 1 , wherein the composition further comprises an adhesion promoter.  
     
     
         13 . The silicone composition according to  claim 12 , wherein the adhesion promoter is selected from at least one amino-functional alkoxysilane, at least one epoxy-functional alkoxysilane, a reaction product of at least one amino-functional alkoxysilane and at least one epoxy-functional alkoxysilane, and at least one vinyl trialkoxysilane.  
     
     
         16 . The silicone composition according to  claim 1 , further comprising a solvent having a normal boiling point greater than the cure temperature of the composition.  
     
     
         17 . The silicone composition according to  claim 1 , further comprising a nonfunctional silicone fluid.  
     
     
         18 . A silicone adhesive comprising a reaction product of the composition of  claim 1 .  
     
     
         19 . A multi-part curable silicone composition for preparing a silicone adhesive, the composition comprising: 
 (A) an organopolysiloxane containing an average of at least two silicon-bonded hydroxy groups per molecule;    (B) a crosslinking agent in an amount sufficient to cure the composition; wherein the agent is selected from (i) at least one silane having the formula R 2   n SiX 4-n  wherein each R 2  is independently selected from monovalent hydrocarbon and monovalent halogenated hydrocarbon groups having from 1 to about 8 carbon atoms, n is 0 or 1, and X is —OR 2  or —OCH 2 CH 2 OR 2 ; (ii) a partial hydrolyzate of (i), and (iii) mixtures comprising (i) and (ii);    (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone adhesive, wherein the filler comprises particles having at least an outer surface of a metal selected from the group consisting of silver, gold, platinum, palladium, and alloys thereof;    (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound does not substantially inhibit cure of the composition; and    (E) a catalytic amount of a condensation catalyst comprising a metal salt of a carboxylic acid, provided neither component (A) nor component (D) are present with components (B) and (E) in the same part.