Tough and weak crystal mixing for low power grinding

Abstract

A resin bond grinding element is composed of a resin bond matrix containing superabrasive particles. The superabrasive particles are an at least 1:1 volume mixture of tough and weak particles, wherein there is at least about 10% difference in toughness between the tough particles and the weak particles. The corresponding method involves grinding a workpiece with a resin bond grinding element composed of a resin bond matrix containing an at least 1:1 volume mixture of tough and weak superabrasive particles, wherein there is at least about 10% difference in toughness between the tough particles and the weak particles. The mixture of tough and weak superabrasive particles also can be used in metal bond and vitreous bond grinding elements.

1 . In a bond grinding element composed of a bond matrix containing superabrasive particles, the improvement which comprises: 
 said superabrasive particles comprising an at least 1:1 volume mixture of tough and weak particles, wherein there is at least about 10% difference in toughness between said tough particles and said weak particles.    
     
     
         2 . The grinding element of  claim 1 , wherein said bond matrix is one or more of a resin bond matrix, a vitreous bond matrix, or a metal bond matrix.  
     
     
         3 . The grinding element of  claim 1 , wherein said abrasive particles are one or more of diamond or cubic boron nitride (CBN).  
     
     
         4 . The grinding element of  claim 1 , wherein said volume ratio of tough to weak particles ranges from about 10:1 to 1:1.  
     
     
         5 . The grinding element of  claim 1 , wherein there is a difference in toughness between said tough particles and said weak particles ranging from between about 30% and 90%.  
     
     
         6 . The grinding element of  claim 2 , wherein said bond matrix is a resin bond matrix of one or more of a phenol-formaldehyde resins, melamine formaldehyde reins, urea formaldehyde resins, epoxy resins, polyesters, polyamides, and polyimides.  
     
     
         7 . The grinding element of  claim 6 , wherein said abrasive particle is diamond.  
     
     
         8 . In a method for grinding a workpiece with a bond grinding element composed of a bond matrix containing superabrasive particles, the improvement which comprises: 
 providing said grinding element to contain superabrasive particles comprising an at least 1:1 volume mixture of tough and weak particles,    wherein there is at least about 10% difference in toughness between said tough particles and said weak particles.    
     
     
         9 . The method of  claim 8 , wherein said bond matrix is one or more of a resin bond matrix, a vitreous bond matrix, or a metal bond matrix.  
     
     
         10 . The method of  claim 8 , wherein said abrasive particles are one or more of diamond or cubic boron nitride (CBN).  
     
     
         11 . The method of  claim 8 , wherein said volume ratio of tough to weak particles ranges from about 10:1 to 1:1.  
     
     
         12 . The method of  claim 8 , wherein there is a difference in toughness between said tough particles and said weak particles ranging from between about 30% and 90%.  
     
     
         13 . The method of  claim 9 , wherein said bond matrix is a resin bond matrix of one or more of a phenol-formaldehyde resins, melamine formaldehyde reins, urea formaldehyde resins, epoxy resins, polyesters, polyamides, and polyimides.  
     
     
         14 . The method of  claim 13 , wherein said abrasive particle is diamond.