Method and apparatus for an air-cavity package

Abstract

Embodiments provide a method, article of manufacture, and apparatus for providing an component package. In one embodiment, a cover assembly including a plurality of air-cavity covers is bonded to a carrier having a plurality of components thereon. Each air-cavity cover encapsulates at least one of the components to form a multi-component assembly. Subsequently, the multi-component assembly is then separated into individually packaged component devices.

1 . A method of packaging components, comprising: 
 bonding a carrier to an enclosure including a plurality of covers having an air-cavity to receive at least one of the components therein; and    forming a component package assembly.    
     
     
         2 . The method of  claim 1 , wherein the components comprise at least one component die.  
     
     
         3 . The method of  claim 1 , wherein the enclosure is formed of materials comprising polymers, ceramic, glass, and combinations thereof.  
     
     
         4 . The method of  claim 1 , wherein bonding comprises providing an adhesive layer between the enclosure and the carrier.  
     
     
         5 . The method of  claim 4 , wherein providing the adhesive layer between the enclosure and the carrier comprises applying an adhesive to the carrier.  
     
     
         6 . The method of  claim 4 , wherein providing an adhesive layer between the enclosure and the carrier comprises applying adhesive to a cover surface disposed adjacent the carrier.  
     
     
         7 . The method of  claim 1 , further comprising separating the component package assembly into a plurality of individual component packages.  
     
     
         8 . The method of  claim 7 , wherein separating comprises cutting between each of the pluralities of component through a plurality of sidewalls and the carrier.  
     
     
         9 . The method of  claim 8 , wherein cutting comprises sawing, laser cutting, water cutting, milling, machining, lathing, and combinations thereof.  
     
     
         10 . A method of packaging components, comprising: 
 bonding a body including a plurality of component covers to a carrier comprising a plurality of the components thereon wherein at least one of the components is positioned proximate one of the component covers; and    providing an air-cavity between the components and a respective component covers.    
     
     
         11 . The method of  claim 10 , wherein the components comprise an component die.  
     
     
         12 . The method of  claim 10 , wherein the body is formed of materials comprising polymers, ceramic, glass, and combinations thereof.  
     
     
         13 . The method of  claim 10 , wherein the body comprises sidewalls defining the component covers.  
     
     
         14 . The method of  claim 13 , wherein bonding the body to the carrier comprises providing an adhesive between the sidewalls and the carrier.  
     
     
         15 . The method of  claim 10 , further comprising separating the sidewalls and carrier to form individual components having at least one of the plurality of covers thereon.  
     
     
         16 . The method of  claim 15 , wherein separating comprises sawing the common sidewalls and carrier using a saw, laser cutting tool, water cutting tool, mill, lath, and combinations thereof.  
     
     
         17 . The method of  claim 10 , wherein providing the air-cavity between each of the components and their respective component covers comprises forming the sidewalls with a top portion that exceeds the height of the components.  
     
     
         18 . The method of  claim 17 , wherein the sidewalls and the top portion define an enclosure.  
     
     
         19 . An apparatus for enclosing at least one component, comprising: 
 a plurality of separable sidewalls disposed on a top member wherein the separable sidewalls and top member define a plurality of separable individual component packages to enclose the at least one component therein.    
     
     
         20 . The apparatus of  claim 19 , wherein when separated, the sidewalls and top member define an individual component enclosure.