Heat radiation fin using a carbon fiber reinforced resin as heat radiation plates standing on a substrate

Abstract

A heat radiation fin comprises a substrate having a high thermal conductivity and a plurality of heat radiation plates. The heat radiation plates are arranged upright on the substrate with predetermined intervals therebetween. Each of the heat radiation plates is formed of a heat-resistant resin containing carbon fibers.

What is claimed is:  
     
         1 . A heat radiation fin comprising: 
 a substrate having a high thermal conductivity; and    a plurality of heat radiation plates arranged upright on said substrate with predetermined intervals therebetween,    wherein each of said heat radiation plates is formed of a heat-resistant resin containing carbon fibers.    
     
     
         2 . The heat radiation fin as claimed in  claim 1 , wherein said carbon fibers are woven so that the carbon fibers extend in a plurality of directions parallel to a surface of each of said heat radiation plates.  
     
     
         3 . The heat radiation fin as claimed in  claim 1 , wherein said carbon fibers are woven so that the carbon fibers extend in a plurality of directions parallel to a surface of each of said heat radiation plates and perpendicular to a surface of said substrate.  
     
     
         4 . The heat radiation fin as claimed in  claim 1 , wherein said substrate is formed of a heat-resistant resin containing carbon fibers.  
     
     
         5 . The heat radiation fin as claimed in  claim 1 , wherein said substrate is a metal plate formed of one of copper and aluminum.  
     
     
         6 . The heat radiation fin as claimed in  claim 1 , wherein said heat radiation plates are arranged upright in an array so that surfaces of said heat radiation plates oppose each other.  
     
     
         7 . The heat radiation fin as claimed in  claim 1 , wherein at least one of said heat radiation plates has an opening formed therein.  
     
     
         8 . A manufacturing method of a heat radiation fin, the method comprising the steps of: 
 preparing a plurality of heat-resistant resin members each having a rectangular shape and a predetermined size in a form of a prepreg containing carbon fibers;    arranging said heat-resistant resin members with predetermined intervals therebetween and bending a portion of each of said heat-resistant resin members so that each of said heat-resistant resin members has a shorter portion and a longer portion forming an L-shape; and    placing a substrate having a high thermal conductivity on said shorter portion and bonding said shorter portion to said substrate by heating and pressurizing.    
     
     
         9 . A manufacturing method of a heat radiation fin, the method comprising the steps of: 
 preparing a plurality of heat-resistant resin members each having a rectangular shape and a predetermined size in a form of a prepreg containing carbon fibers;    molding each of said heat-resistant resin members by heating and pressurizing so that each of said heat-resistant resin members has a shorter portion and a longer portion forming an L-shape; and    placing each of said heat-resistant resin members on a substrate having a high thermal conductivity with predetermined intervals therebetween so that said shorter portion faces said substrate, and bonding said shorter portion to said substrate by heating and pressurizing.    
     
     
         10 . A manufacturing method of a heat radiation fin, the method comprising the steps of: 
 preparing a plurality of heat-resistant resin members each having a rectangular shape and a predetermined size in a form of a prepreg containing carbon fibers;    molding each of said heat-resistant resin members; and    placing each of said heat-resistant resin members on a substrate having a high thermal conductivity with predetermined intervals therebetween by thrusting a portion of each of said heat-resistant resin members into said substrate, and bonding each of said heat-resistant resin members to said substrate by heating and pressurizing.    
     
     
         11 . A semiconductor device comprising: 
 a semiconductor element; and    a heat radiation fin provided on a side opposite to a surface of said semiconductor element on which an electrode terminal is formed,    wherein said heat radiation fin comprises: 
 a substrate having a high thermal conductivity; and  
 a plurality of heat radiation plates arranged upright on said substrate with predetermined intervals therebetween,  
 wherein each of said heat radiation plates is formed of a heat-resistant resin containing carbon fibers.