Method for manufacturing a copper-clad laminate

Abstract

A method for manufacturing a copper-clad laminate includes the steps of forming first and second metal films on first and second carriers, forming first and second copper films on the first and second metal films, sandwiching a prepreg containing a curable resin body, between a first assembly of the first carrier, the first metal film and the first copper film, and a second assembly of the second carrier, the second metal film and the second copper film, and vacuum hot pressing the prepreg and the first and second assemblies so as to completely cure the curable resin body of the prepreg to form a cured resin body that is bonded to the first and second copper films of the first and second assemblies.

I claim:  
     
         1 . A method for manufacturing a copper-clad laminate, comprising the steps of: 
 preparing rigid plate-shaped first and second carriers having first and second flat surfaces, respectively;    forming first and second thin metal films on said first and second flat surfaces of said first and second carriers, respectively;    forming ultra-thin first and second copper films on said first and second thin metal films, respectively, via electroplating techniques;    sandwiching a prepreg, which is in the form of a glass-fiber reinforced resin sheet containing a curable resin body, between a first assembly of said first carrier, said first thin metal film and said first copper film, and a second assembly of said second carrier, said second thin metal film and said second copper film in a manner that said first and second copper films are brought into contact with two opposite sides of said prepreg;    hot pressing said first and second assemblies and said prepreg so as to completely cure said curable resin body of said prepreg to form a cured resin body that is bonded to and that cooperates with said first and second copper films of said first and second assemblies to form a laminated body; and    removing said first and second carriers together with said first and second thin metal films from said laminated body.    
     
     
         2 . The method of  claim 1 , wherein each of said first and second copper films has a thickness less than 6 microns.  
     
     
         3 . The method of  claim 1 , wherein each of said first and second thin metal films is formed by vapor deposition.  
     
     
         4 . The method of  claim 2 , wherein each of said first and second thin metal films is formed by vacuum plating.  
     
     
         5 . The method of  claim 2 , wherein each of said first and second thin metal films is formed by vacuum sputtering.  
     
     
         6 . The method of  claim 2 , wherein each of said first and second thin metal films is formed by ion plating.  
     
     
         7 . The method of  claim 1 , wherein said curable resin body is made of epoxy resin.  
     
     
         8 . The method of  claim 1 , wherein each of said first and second carriers is made from a material selected from a group consisting of aluminum, copper, iron, high density polyethylene, polypropylene, cured glass-fiber reinforced epoxy resin, and fluorocarbon polymers.  
     
     
         9 . The method of  claim 8 , wherein each of said first and second thin metal films is made from a metal selected from a group consisting of chromium, zinc, nickel, titanium, and alloys thereof.