Polishing apparatus and dressing method

Abstract

An apparatus for polishing a surface of a substrate by slidingly engaging the surface with a polishing surface of an abrasive member has a dressing member for dressing the polishing surface of the fixed abrasive member. The dressing member has a dressing surface provided with projections having an angular portion of an obtuse angle of not less than (100°).

1 . A substrate polishing apparatus, comprising 
 an abrasive member having a polishing surface, the polishing surface being slidingly engaged with a substrate to be polished, and    a dressing member having a dressing surface adapted to be slidingly engaged with the polishing surface of the abrasive member for dressing the polishing surface,    the dressing surface being provided with a plurality of projections having an angular portion of an obtuse angle of not less than 100°.    
     
     
         2 . A substrate polishing apparatus, in which the abrasive member includes a fixed abrasive member.  
     
     
         3 . A substrate polishing apparatus, comprising 
 an abrasive member having a polishing surface, the polishing surface being slidingly engaged with a substrate to be polished, and    a dressing member having a dressing surface adapted to be slidingly engaged with the polishing surface of the abrasive member for dressing the polishing surface of the abrasive member,    the dressing member being in the shape of a rod extending from a center of the abrasive member to an outer periphery thereof.    
     
     
         4 . A substrate polishing apparatus, comprising 
 a substrate carrier for carrying a substrate,    an abrasive member having a polishing surface, the polishing surface being slidingly engaged with a substrate carried by the substrate carrier for effecting polishing, and    a dressing member having a dressing surface adapted to be slidingly engaged with the polishing surface of the abrasive member for dressing the polishing surface,    the dressing member being in the shape of a ring and provided on the substrate carrier in such a manner that the dressing member is placed around the substrate.    
     
     
         5 . A substrate polishing apparatus, comprising 
 a substrate carrier for carrying a substrate,    an abrasive member having a polishing surface, the polishing surface being slidingly engaged with a substrate carried by the substrate carrier for effecting polishing, and    a dressing device including a light source for generating light rays for irradiating the polishing surface of the abrasive member to thereby dress the polishing surface.    
     
     
         6 . A substrate polishing apparatus as set forth in  claim 5 , in which the light source includes a mercury lamp.  
     
     
         7 . A substrate polishing apparatus as set forth in  claim 5 , in which the light source generates laser rays.  
     
     
         8 . A substrate polishing apparatus as set forth in  claim 5 , further including a cooling system for cooling the abrasive member.  
     
     
         9 . In a substrate polishing apparatus wherein a substrate is brought into engagement with a polishing surface of a fixed abrasive disc rotating about its axis, while rotating the substrate: 
 a method for dressing the polishing surface comprising the steps of: 
 preparing a dressing member having a dressing surface,  
 bringing the dressing surface of the dressing member into engagement with the polishing surface of the rotating fixed abrasive disc; and  
 controlling a ratio of a number of revolutions of,the dressing member to a number of revolutions of the fixed abrasive disc so as to adjust conditions for dressing.  
   
     
     
         10 . A method according to  claim 9 , wherein the dressing surface of the dressing member is engaged with the polishing surface of the rigid rotating abrasive disc under a pressure of not more than 30 g/cm 2 .  
     
     
         11 . In a substrate polishing process wherein a substrate is brought into engagement with a polishing surface of an member and subjected to a relative sliding motion therebetween thereby causing the substrate to be polished, 
 a method for dressing the polishing surface of the abrasive member comprising: 
 supplying the polishing surface of the fixed abrasive disc with a liquid capable of dissolving a binder binding abrasive particles of the abrasive member to promote generation of freed abrasive particles.  
   
     
     
         12 . In a substrate polishing process wherein a substrate is brought into engagement with a polishing surface of an abrasive member and subjected to a relative sliding motion therebetween thereby causing the substrate to be polished, 
 a method for dressing the polishing surface of the abrasive member comprising: 
 passing an electric current through the abrasive member, thereby breaking bond of a binder binding abrasive particles of the abrasive member to promote generation of freed abrasive particles.  
   
     
     
         13 . In a substrate polishing process wherein a substrate is brought into engagement with a polishing surface of an abrasive member and subjected to a relative sliding motion therebetween thereby causing the substrate to be polished, 
 a method for dressing the polishing surface of the abrasive member comprising: 
 preparing the abrasive member containing photocatalyst in the polishing surface made of abrasive particles bound by a binder; and  
 irradiating the polishing surface of the abrasive member with a light ray, thereby breaking bond of the binder in the polishing surface to promote generation of freed abrasive particles.  
   
     
     
         14 . A method as set forth in  claim 13 , in which the light ray has wavelengths of 355 nm or less.  
     
     
         15 . A method as set forth in  claim 13 , further comprising the step of supplying chemical liquid or chemicals to the polishing surface of the abrasive member during or after a dressing operation of the polishing surface to make the polishing surface hydrophilic.  
     
     
         16 . A method as set forth in  claim 15 , in which the chemical liquid or chemicals supplied to the polishing surface include hydrophilic functional groups such as —OH, —COOH, —NH 2 , —CO and —O 3 H.