Method for mounting a semiconductor device

Abstract

Semiconductor devices can be mounted by the bump technique using compound metallic ultra-fine particles. Each particle comprises a core portion which is substantially a metallic component, with a coating layer chemically bound to the core portion, the coating layer being an organic substance. One of two bump technologies can be used to mount the semiconductor device, namely, forming under bump metals from the compound metallic ultra-fine particles, and forming ordinary solder balls on the under bump metals; or using paste balls comprising the compound metallic ultra-fine particles rather than ordinary solder balls.

What is claimed is:  
     
         1 . A semiconductor device mounting system comprising: 
 a coating device for coating a metallic fine particle paste on an electrode of the semiconductor device or on an electrode on the circuit board, the paste having compound metallic ultra-fine particles each comprising a core portion consisting substantially of a metallic component, and a coating layer covering the core portion and comprising an organic substance; and    a heat treatment furnace for forming a conductor portion from the paste on the electrode by heat treatment at a temperature such that the coating layer is released from the core portion and core portions are fused and bound together.    
     
     
         2 . The semiconductor device mounting system as claimed in  claim 1 , wherein the coating device and the heat treatment furnace are integrally dispose in one unit.  
     
     
         3 . The semiconductor device mounting system as claimed in  claim 1 , wherein the coating device and the heat treatment furnace are controlled independently, and are connected each other by a feedback mechanism.  
     
     
         4 . The semiconductor device mounting system as claimed in  claim 1 , wherein the coating layer is chemically bound to the core portion.