Vertical surface mount assembly

Abstract

A vertically mountable semiconductor device assembly including a semiconductor device and a mechanism for attaching the semiconductor device to a carrier substrate. The semiconductor device has each of its bond pads disposed proximate a single edge thereof. Preferably, at least a portion of the semiconductor device is exposed. An alignment device is attached to a carrier substrate. A mounting element on the vertically mountable semiconductor device package engages the alignment device to interconnect the semiconductor device and the alignment device. Preferably, the alignment device secures the vertically mountable semiconductor device package perpendicular relative to the carrier substrate. The distance between the bond pads and corresponding terminals on the carrier substrate is very small in order to reduce impedance. The vertically mountable semiconductor device package may also be readily user-upgradable.

What is claimed is:  
     
         1 . A system for securing a semiconductor device in nonparallel relation to a carrier substrate, comprising: 
 at least one interconnection receptacle associated with the carrier substrate for receiving at least an edge portion of the at least one semiconductor device; and    a mounting element, including: 
 at least one assembly member configured to couple to the at least one semiconductor device; and  
 at least one retaining member configured to engage or be engaged by a complementary engager upon insertion of at least the edge portion of the at least one semiconductor device into said at least one interconnection receptacle.  
   
     
     
         2 . The system of  claim 1 , wherein said at least one interconnection receptacle establishes at least one electrical connection between said at least one semiconductor die and the carrier substrate upon insertion of at least the edge portion into said at least one interconnection receptacle.  
     
     
         3 . The system of  claim 1 , wherein engagement of said at least one retaining member by said engager substantially maintains an inserted position of at least the edge portion of the at least one semiconductor device within said at least one interconnection receptacle.  
     
     
         4 . The system of  claim 1 , wherein disengagement of said at least one retaining member by said engager facilitates removal of at least the edge portion of the at least one semiconductor device from said at least one interconnection receptacle.  
     
     
         5 . The system of  claim 1 , further comprising: 
 a disconnection element for effecting disengagement of at least said at least one retaining member from said engager.    
     
     
         6 . The system of  claim 5 , wherein said disconnection element facilitates removal of at least the edge portion of the at least one semiconductor device from said at least one interconnection receptacle.  
     
     
         7 . The system of  claim 1 , wherein at least a portion of said at least one retaining member is resilient.  
     
     
         8 . The system of  claim 7 , wherein at least said portion of said at least one retaining member facilitates engagement and disengagement of said engager by said at least one retaining member.  
     
     
         9 . The system of  claim 1 , wherein said at least one assembly member of said mounting element is configured to be assembled with another edge of the at least one semiconductor device opposite the edge portion thereof.  
     
     
         10 . The system of  claim 9 , wherein said at least one assembly member comprises at least one receptacle for receiving at least a portion of said at least another edge.  
     
     
         11 . A system for connecting at least one semiconductor device in nonparallel relation to a carrier substrate, comprising: 
 at least one interconnection receptacle associated with the carrier substrate for receiving at least an edge portion of the at least one semiconductor device; and    a mounting element, including: 
 at least one assembly member configured to couple to the at least one semiconductor device; and  
 at least one retaining member configured to engage or be engaged by a complementary engager so as to retain at least the edge portion of the at least one semiconductor device within said interconnection receptacle.  
   
     
     
         12 . The system of  claim 11 , wherein said at least one interconnection receptacle establishes at least one electrical connection between said at least one semiconductor die and the carrier substrate upon insertion of at least the edge portion into said at least one interconnection receptacle.  
     
     
         13 . The system of  claim 11 , wherein engagement of said at least one retaining member by said engager substantially maintains an inserted position of at least the edge portion of the at least one semiconductor device within said at least one interconnection receptacle.  
     
     
         14 . The system of  claim 11 , wherein disengagement of said at least one retaining member by said engager facilitates removal of at least the edge portion of the at least one semiconductor device from said at least one interconnection receptacle.  
     
     
         15 . The system of  claim 11 , further comprising: 
 a disconnection element for effecting disengagement of at least said at least one retaining member from said engager.    
     
     
         16 . The system of  claim 15 , wherein said disconnection element facilitates removal of at least the edge portion of the at least one semiconductor device from said at least one interconnection receptacle.  
     
     
         17 . The system of  claim 11 , wherein at least a portion of said at least one retaining member is resilient.  
     
     
         18 . The system of  claim 17 , wherein at least said portion of said at least one retaining member facilitates engagement and disengagement of said engager by said at least one retaining member.  
     
     
         19 . The system of  claim 11 , wherein said at least one assembly member of said mounting element is configured to be assembled with another edge of the at least one semiconductor device opposite the edge portion thereof.  
     
     
         20 . The system of  claim 19 , wherein said at least one assembly member comprises at least one receptacle for receiving at least a portion of said at least another edge.