Wing-shaped surface mount package for light emitting diodes

Abstract

The bottom metal contacts of a surface mount LED are extended wider than the glue covering the LED. The extensions provide more area for soldering to a motherboard.

1 . A surface mount light emitting diode (LED) package, comprising: 
 a light emitting diode having a first electrode and a second electrode;    a first metal contact plate having a first bottom recess, mounted with said LED and connected to said first electrode;    a second metal contact plate having a second bottom recess and connected to said second electrode;    a glue covering said LED, said first bottom recess and a portion of the top surface of said first metal contact plate, said second bottom recess and a portion of the top surface of said second metal contact plate; and    extensions of said first metal contact plate and said second metal contact plate outside the borders of said glue to provide contact and soldering areas to a motherboard.    
     
     
         2 . The surface mount LED package as described in  claim 1 , wherein the glue covers below the bottom surfaces of said first contact metal plate and of second contact metal plate.  
     
     
         3 . The surface mount LED package as described in  claim 1 , wherein the top electrode of the LED is wire-bonded to said second metal contact plate.  
     
     
         4 . The surface mount LED package as described in  claim 1 , wherein the top surface of said first metal contact plate and the top surface second metal contact plate are flat.  
     
     
         5 . The surface mount LED package as described in  claim 1 , wherein said first recess and said second bottom recess are of trapezoidal shape.  
     
     
         6 . The surface mount LED package as described in  claim 1 , wherein said first bottom recess and said second bottom recess are of rectangular shape.  
     
     
         7 . The surface mount LED package as described in  claim 1 , wherein the fist bottom recess and said second bottom recess are of polygonal shape.  
     
     
         8 . The surface mount LED package as described in  claim 7 , wherein the portion of the glue covering said first bottom recess and said second bottom recess is wider the portion of the glue covering the top surfaces of the first metal contact plate and the second metal contact plate.  
     
     
         9 . The surface mount LED package as described in  claim 1 , wherein the first metal contact plate and the second metal plate each have through holes for said glue to deposit.  
     
     
         10 . The surface mount LED package as described in  claim 1 , wherein the top surface of said first metal contact plate and the top surface of said second metal contact plate are roughened to increase the grip of the glue.  
     
     
         11 . The surface mount LED package as described in  claim 1 , wherein the glue on top of the first metal contact plate and the second metal contact plate are shaped in the form of a cup to expose the LED and to focus the light emitted from the LED.  
     
     
         12 . The surface mount LED package as described in  claim 1 , wherein the first electrode and the second electrode of said LED lie on top of the LED and wire bonded to said first metal contact plate and said second metal contact plate respectively.  
     
     
         13 . The surface mount LED package as described in  claim 1 , wherein said fist electrode and said second electrode are at the bottom surface of said LED and straddles over said first metal contact plate and said second metal contact plate.